Aspects of the subject technology relate to electronic devices with pressure sensors. Pressure sensor occlusion may be mitigated by ejecting occluding liquid with pulsed liquid heating. Processing circuit of the electronic device can obtain pressure sensor data from the pressure sensor and determine that the opening is occluded based at least in part on a change in pressure within a cavity adjacent the opening. The processing circuitry applies a first power pulse to a heating element during a first phase to cause the heating element to form a gas pocket around the heating element by heating at least a portion of a water volume inside the cavity and applies a second power pulse to the heating element during a second phase following the first phase to cause the heating element to expand the gas pocket around the heating element by further heating the water volume inside the cavity.

A vacuum gauge protector for deposition systems includes a body comprising an input port that is configured to couple to a vacuum chamber, and an output port configured to couple to a vacuum gauge. A deposition material filter is positioned in the body to present a tortuous path to gases comprising deposition materials entering the body where the surface area of the deposition material filter is greater than 2000 mm.sup.2. In addition, the deposition material filter restricts deposition material from passing through the body to the output port so as to reduce vacuum gauge contamination while maintaining enough gas flow through the body to the output port so that the vacuum gauge response time can be less than 10 seconds.

A pair of vehicle door panels defines a cavity. An air sensor has an air inlet protruding into the cavity and senses an air pressure within the cavity. A shield covers the air inlet, has at least one side wall extending away from the air inlet, and defines a chamber configured to collapse in response to an increase in the air pressure to excite the air sensor.

A vacuum gauge protector for deposition systems includes a body comprising an input port that is configured to couple to a vacuum chamber, and an output port configured to couple to a vacuum gauge. A deposition material filter is positioned in the body to present a tortuous path to gases comprising deposition materials entering the body where the surface area of the deposition material filter is greater than 2000 mm.sup.2. In addition, the deposition material filter restricts deposition material from passing through the body to the output port so as to reduce vacuum gauge contamination while maintaining enough gas flow through the body to the output port so that the vacuum gauge response time can be less than 10 seconds.

The semiconductor device includes a microelectromechanical system (MEMS) chip having a first main surface and a second main surface situated opposite the first main surface, a first glass-based substrate, on which the MEMS chip is arranged by its first main surface, and a second substrate, which is arranged on the second main surface of the MEMS chip, wherein the MEMS chip has a first recess connected to the surroundings by way of a plurality of perforation holes arranged in the first substrate.

A pressure transducer assembly configured for low-pressure measurements in water or high humidity environments, the pressure transducer assembly having a non-corrosive housing, an upside-down mounted pressure sensor chip comprising silicon and contact glass, and an electrically insulating and stress-absorbing spacer layer disposed between the non-corrosive housing and the contact glass of the sensor chip, the spacer layer is matched to a coefficient of thermal expansion (CTE) of one or more of the glass and the silicon of the sensor chip to absorb stress and improve reliability. The pressure transducer assembly may be suitable for use in microphone and/or hydrophone applications.

Disclosed example pressure sensors include: a pressure sensor comprising a fluid input and a sensor housing configured to contain a reference pressure, and configured to output a signal representative of a pressure sensed at the fluid input; and an inlet filter configured to reduce byproducts entering the pressure sensor with a process gas, the inlet filter comprising: a thermally conductive filter in fluid communication with the fluid input of the pressure sensor, and comprising a plurality of surfaces at least partially impeding a flow path of the process gas toward the fluid input of the pressure sensor; and a cooler thermally coupled to the thermally conductive filter and configured to cool the thermally conductive filter.

A method for producing a semiconductor device includes providing a microelectromechanical system (MEMS) chip having a first main surface and a second main surface situated opposite the first main surface, wherein the first main surface of the MEMS chip has a recess; providing a first glass-based substrate, wherein the first glass-based substrate has a plurality of perforation holes; applying the first main surface of the MEMS chip onto the first glass-based substrate in such a way that the recess becomes located over the plurality of perforation holes; providing a second substrate, which is arranged on the second main surface of the MEMS chip; and applying the second substrate to the second main surface of the MEMS chip.

Aspects of the subject technology relate to electronic devices with pressure sensors. Pressure sensor occlusion may be mitigated by ejecting occluding liquid with pulsed liquid heating. Processing circuit of the electronic device can obtain pressure sensor data from the pressure sensor and determine that the opening is occluded based at least in part on a change in pressure within a cavity adjacent the opening. The processing circuitry applies a first power pulse to a heating element during a first phase to cause the heating element to form a gas pocket around the heating element by heating at least a portion of a water volume inside the cavity and applies a second power pulse to the heating element during a second phase following the first phase to cause the heating element to expand the gas pocket around the heating element by further heating the water volume inside the cavity.

Aspects of the subject technology relate to an apparatus having a housing including a port exposed to an environment. A pressure sensor is disposed within the housing to measure a pressure of the environment. A medium partially fills a sensor cavity or is coated over the pressure sensor, and a cap including multiple openings is disposed over the pressure sensor. The openings of the cap are arranged to be offset from the port.