A diaphragm seal for transmitting the pressure of a process medium includes a main body having a surface and a separating membrane secured to the surface, thereby forming between the separating membrane and the surface a pressure chamber which communicates, via an opening in the surface, with a hydraulic path. The separating membrane can be exposed to the process medium on a first side, and the separating membrane has a central middle region. The diaphragm seal further includes a temperature transducer for determining a temperature measurement variable of the process medium, which is secured in the middle region on a second side of the separating membrane, and the main body is joined to the separating membrane such that a transmitting fluid, which fills the pressure chamber and the hydraulic path, does not come into contact with the temperature transducer.

An apparatus for measuring pressure within a fluid path includes a housing defining the structure of the apparatus. The housing includes a fluid path that extends through the housing and allows a fluid to pass through the housing. The apparatus also includes a first volume chamber that is in fluid communication with the fluid path and has a first volume chamber opening, and a second volume chamber with a second volume chamber opening that is less than the first volume chamber opening. A diaphragm separates the first volume chamber from the second volume chamber and fluidly disconnects the second volume chamber from the fluid path. The diaphragm deforms based upon the pressure within the fluid path. The apparatus also includes an interface that is connectable to a pressure sensor, and the second volume chamber is in fluid communication with the interface.

A waterproof pressure sensor includes a pressure detection element, a cavity package configured to be provided with a recess in which the pressure detection element is mounted and an edge provided around the recess, a cover member attached to the edge of the cavity package and to be provided with a pressure introducing hole having a diameter smaller than a diameter of an opening of the recess in a plan view at a position overlapping the recess, and a gel agent configured to be provided in the recess, in which an exhaust portion is provided at the cover member at least on the recess side, the exhaust portion being capable of discharging air in the recess to the outside when the gel agent is injected from the pressure introducing hole into the recess, and the exhaust portion is filled with the gel agent.

A semiconductor pressure sensor assembly for measuring a pressure of an exhaust gas which contains corrosive components, comprising: a first cavity, a pressure sensor comprising first bondpads for electrical interconnection, a CMOS chip comprising second bondpads for electrical interconnection with the pressure sensor, an interconnection module having electrically conductive paths connected via bonding wires to the pressure sensor and to the CMOS chip; the interconnection module being a substrate with corrosion-resistant metal tracks, wherein the CMOS chip and part of the interconnection module are encapsulated by a plastic package.

An industrial process differential pressure sensing device includes a housing having first and second isolation cavities that are respectively sealed by first and second diaphragms, a differential pressure sensor, a static pressure sensor, an eddy current displacement sensor, and a controller. The static pressure sensor is configured to output a static pressure signal that is based on a pressure of fill fluid in the first isolation cavity. The differential pressure sensor is configured to output a differential pressure signal that is indicative a pressure difference between the first and second isolation cavities. The eddy current displacement sensor is configured to output a position signal that is indicative of a position of the first isolation diaphragm relative to the housing. The controller is configured to detect a loss of a seal of the isolation cavity based on the position signal, the static pressure signal and the differential pressure signal.

A packaged pressure sensor, comprising: a MEMS pressure-sensor chip; and an encapsulating layer of elastomeric material, in particular PDMS, which extends over the MEMS pressure-sensor chip and forms a means for transferring a force, applied on a surface thereof, towards the MEMS pressure-sensor chip.

A pressure sensor comprising a housing, a diaphragm wafer, and an isolator configured to absorb lateral stress. The diaphragm wafer includes a fully exposed diaphragm, a fluid contact surface, a sensing element, and a support portion, where the support portion and the contact surface define a cavity. The isolator extends laterally from the support portion to the housing. The pressure sensor is easily drainable, eliminating the buildup of particulates, and the diaphragm can be directly wire-bonded to printed circuit boards, eliminating the need for extensive electrical feedthrough.

[Object] Provided are a pressure detection unit and a pressure sensor using the same capable of performing a trimming operation using a simple structure during an assembly operation, and reducing a decrease in detection accuracy of a semiconductor type pressure detection device.

[Solving Means] A pressure detection unit includes a base formed in a lid shape and made of ceramic, a receiving member formed in a plate shape, a diaphragm interposed between the base and the receiving member, a semiconductor type pressure detection device installed on a side of a pressure receiving space formed between the base and the diaphragm in the base, and three terminal pins electrically connected to the semiconductor type pressure detection device, the terminal pins penetrating the base, wherein the three terminal pins include an earth terminal pin, a power input terminal pin, and a signal output terminal pin.

[Object] Provided are a pressure detection unit and a pressure sensor using the same capable of suppressing an increase in manufacturing man-hours due to use of an additional member, and ensuring insulation of a semiconductor type pressure detection device.

[Solving Means] A pressure detection unit includes a base formed in a lid shape and made of ceramic, a receiving member formed in a plate shape, a diaphragm interposed between the base and the receiving member, a semiconductor type pressure detection device installed on a side of a pressure receiving space formed between the base and the diaphragm in the base, and terminal pins electrically connected to the semiconductor type pressure detection device, the terminal pins penetrating the base, wherein a metal layer is provided in a region around the semiconductor type pressure detection device on a surface of the base on the side of the pressure receiving space.

When a main body of a sensor chip (1) is in a grounded state, a shield layer (71) constituting a shield electrode formed on a circuit layer (72) is grounded through a resistor (46).