The invention relates to a housing comprising a venting device (10) which is arranged on the housing (2) and which allows an ambient pressure to be supplied to the interior of the housing (2). The venting device (10) is made of a sleeve-like protective cap (11) with lateral openings (12) and a liquid-repellant membrane, and a cavity for receiving the membrane is formed in the interior of the venting device (10). The membrane is arranged such that an opening, which is provided for the pressure supply, in the wall of the housing (2) is covered. In order to prevent the so-called teapot effect and therefore allow a light dripping of a liquid on the venting device (10), the sleeve-like protective cap (11) has a narrow circumferential expansion (14) in the region of the lateral surface of the protective cap such that a defined dripping edge is formed.

Methods, apparatuses and systems for providing sensing components for apparatuses are disclosed herein. An example sensing component comprises: a substrate; a sensing element attached to a surface of the substrate and in electronic communication therewith; a lower coupling element in contact with the sensing element defining a bottom layer of the sensing component; and an upper coupling element disposed adjacent a top surface of the lower coupling element and defining a top layer of the sensing component, wherein the lower coupling element exhibits lower internal stress relative to the upper coupling element.

In an embodiment, a semiconductor package includes a support and a stack of two or more semiconductor dies, the stack including an upper die and further including a lower die attached to the support by adhesive on a backside of the lower die, wherein the adhesive covers only part of the backside of the lower die, and wherein the adhesive has a plurality of non-contiguous regions on the backside of the lower die.

In an embodiment a membrane includes a hydrophobic region having a plurality of hierarchically arranged micrometer-sized and submicrometer-sized units consisting of a membrane material, wherein a single micrometer-sized unit has a diameter of from 1 μm to 5 μm and a single submicrometer-sized unit has a diameter of <1 μm, and wherein the membrane is configured to be used in a pressure sensor system.

Provided is a pressure sensor including: a housing portion including a housing part housing a pressure sensor module, a concave portion facing the housing part across an inner wall, and a through hole part formed in the inner wall; a filter covering the through hole part; and a cover mounted on the housing portion while covering the concave portion and including cutout parts. The concave portion includes a bottom surface that is one surface of the inner wall, and two side surfaces perpendicular to the bottom surface and opposed to each other. The cover is formed with a rectangular upper plate and two rectangular side plates continuous with edges of the upper plate in a vertical direction and opposed to each other. The upper plate is arranged to face the bottom surface. The two side plates are arranged between the two side surfaces opposed to each other.

A pressure sensor includes a base including an accommodation portion, a pressure sensor element disposed in the accommodation portion, and a lead portion electrically-connected to the pressure sensor element, including a terminal portion provided along a lower surface of the base, and being exposed to an outside of the base, where the terminal portion includes a recessed groove portion provided on a second surface which is an opposite surface of a first surface facing the body, and where the recessed groove portion divides at the second surface, a first region including a tip of the terminal portion and a second region next to the first region and away from the tip of the terminal portion.

A pressure sensor includes a pressure sensing-element in fluid communication with a port and an oil separator in the port. The oil separator is configured to reduce an amount of oil-vapor residue that reaches the pressure sensing element by elongating a path of fluid from an opening of the port to the pressure sensing element and by creating additional surface area within the port upon which oil-vapor residue -may be deposited. There is also a cover, which has holes, and that is configured to prevent the oil separator from felling out of the port. The oil separator may include circular discs having cut-out portions. The cut-out portions on adjacent circular discs may he rotated relative to one another about a longitudinal axis of the oil separator. The cut-out portions may have a semi-circular shape.

In a pressure detection device which is provided in an intake pressure measurement apparatus, a detection space surrounded by an outer wall portion is formed in a housing, and an inner wall portion is formed integrally in the detection space such that both end portions are connected to the outer wall portion. The inner wall portion has a cylindrical shape, and a sensor storage portion is formed between the inner wall portion and the outer wall portion. In the sensor storage portion, a pressure sensor is disposed in a region with the least influence of thermal stress at a position closer to the inner wall portion than the outer wall portion.

An integrated circuit (IC) device includes a pressure sensor die, a flexible gel covering a least a pressure-sensing region of the die, and a flexible diaphragm covering the gel. The IC device has encapsulant and a lid that define a cavity above the diaphragm. The lid has an aperture that enables proximate ambient air pressure outside the device to be sensed by the pressure-sensing region through the flexible diaphragm and the flexible gel. The diaphragm protects the gel material from potentially harmful ambient materials. The diaphragm may be a part of the lid.

Disclose is a method for fabricating a semiconductor device. The method includes: forming a groove such as by etching one side surface of a first substrate; attaching a second substrate including a silicon layer on the etched surface of the first substrate formed with the hollow groove; etching the second substrate so as to leave substantially only the silicon layer; forming a thin film structure on the surface of silicon layers of the second substrate; and separating the second substrate formed with the thin film structure from the first substrate. For example, the groove structure may be formed in the lower portion of the device in the process of fabricating the semiconductor device to facilitate the final device separation.