Patent classifications
G01L19/0654
Membrane, Pressure Sensor System and Method for Producing the Pressure Sensor System
A membrane, a pressure sensor system and a method for producing the pressure sensor system are disclosed. In an embodiment a pressure sensor system includes a housing, at least one media supply line and a pressure-sensitive element including at least one membrane with a hydrophobic region.
ELECTRONIC PRESSURE AND TEMPERATURE SENSOR FOR A FLUID MEDIA
An electronic pressure and temperature sensor includes a chamber disposed within a housing. The pressure and temperature sensor are disposed at a chamber first end. An opening is disposed at a chamber second end, wherein the opening is configured to be in fluidic communication with the fluid media. A viscous gel is disposed within a portion of the chamber and encloses the pressure and temperature sensor apart from the fluid media. A second temperature sensor is at least partially disposed within the housing and is not disposed within the chamber. The first temperature sensor is configured to measure a temperature of the viscous gel, where the temperature of the viscous gel configured for use in temperature compensation calculations used to determine the pressure of the fluid media. The second temperature sensor is configured to measure a temperature of the flow of the fluid media.
Cavity wall structure for semiconductor packaging
A method for forming a semiconductor package is disclosed herein. The method includes forming a package substrate having a first major surface and a second major surface opposite to the first major surface. The package substrate includes a recess region below the first major surface defined with a die region and a non-die region surrounding the die region. A semiconductor die is disposed in the die region within the recess region. A dam structure is disposed within the recess region. The dam structure surrounds the semiconductor die and extends upwardly to a height below the first major surface of the package substrate. The method also includes dispensing a liquid encapsulant material into the recess region. The liquid encapsulant material is surrounded by the dam structure and extends upwardly to a height below the height of the dam structure. A package lid is attached to the package substrate.
ENCASED PRESSURE SENSOR FOR MEASURING PRESSURE IN AN AIRCRAFT WHEEL
A pressure measurement device (1) comprising a housing (20) extending around an electronic card (30) provided with a pressure sensor (40); the housing (20) co-operating with a first face (31) of the electronic card (30) to define a first sealed volume (3); the housing (20) also co-operating with a second face (32) of the electronic card (30) that is opposite from the first face (31) to define a second sealed volume (4); the housing (20) including at least one first channel (24) putting the medium (5) outside the housing (20) into fluid flow communication with the first sealed volume (3); the electronic card (30) including at least one second channel (33) putting the first volume (3) into fluid flow communication with the second volume (4); and the connection between the housing (20) and the electronic card (30) being arranged to allow relative movement between the housing (20) and the electronic card.
HOUSING FOR PROTECTING AN ELECTRONIC DEVICE
A protective housing for protecting an electronic device includes a housing having walls. One of the walls of the housing, referred to as the main wall, has an opening for exposing a part of a measuring device to atmospheric pressure. The housing comprises, arranged on the outer surface of the main wall, a plurality of partitions separated from each other by passages and arranged around the opening to completely surround it and at least one flow groove arranged next to the opening, in order to allow liquid that may be likely to accumulate around the opening and/or against the partitions to be discharged. The present disclosure also concerns a pressure sensor, in particular, for a tank of a motor vehicle, using such a protective housing.
PRESSURE SENSOR MODULE
The present invention provides a pressure sensor module capable of improving work efficiency during assembly.
The pressure sensor module detects a fluid pressure on the basis of a differential pressure between a reference pressure and the fluid pressure, and includes: a housing; a sensor element that can contact each of the reference pressure and the fluid pressure; a support member that supports the sensor element and is held in the housing; a first pressure passage that guides the fluid pressure to a first contact surface of the sensor element; and a second pressure passage that is sealed from the first pressure passage and guides the reference pressure to a second contact surface of the sensor element. The support member is a structure that is formed by integrating an elastic material section exerting sealing performance on the first pressure passage and the second pressure passage and capable of being elastically deformed and a hard material section, rigidity of which is higher than the elastic material section.
BREATHABLE WATERPROOF SHEET
A breathable waterproof sheet, which interposes a support layer having a plurality of holes formed therein, thus preventing a waterproof air-permeable layer from colliding with a pressure sensor by a water pressure. The breathable waterproof sheet includes a waterproof air-permeable layer formed of a film having elasticity, an adhesive layer having one surface adhered to one surface of the waterproof air-permeable layer, and a support layer having a plurality of air-permeable holes formed therein and having one surface adhered to the other surface of the adhesive layer.
Micromechanical sensor device with integrated housing seal, micromechanical sensor assembly, and corresponding manufacturing method
A micromechanical sensor device is described that includes an integrated housing seal, a micromechanical sensor assembly, and a corresponding manufacturing method. The micromechanical sensor device with an integrated housing seal is equipped with a micromechanical sensor chip that includes an upper side and a lower side, a sensor area that may be brought into contact with an environmental medium being provided on or at the upper side, and is equipped with at least one circumferential trench, open toward the upper side, that is provided in the periphery of the sensor area and that is at least partly filled with a sealing medium for sealing a corresponding area of a housing to be mounted thereon.
Electronic pressure sensor for measurement of pressure in a fluid media
An electronic sensor includes a housing having a distal end configured to be exposed to a flow of a fluid media opposite a proximal end configured not to be exposed to the fluid media. A chamber and connected passageway are disposed within the housing. The passageway is connected at one end to the chamber and connected at another end to an opening disposed at the distal end of the housing. The opening is configured to be in fluidic communication with the fluid media. A pressure sensor and a first temperature sensor are disposed within the chamber. A viscous gel is disposed within the chamber, the viscous gel separating on a first side both the pressure sensor and the first temperature sensor apart from the passageway on a second side of the viscous gel. The chamber can include a non-smooth surface to increase viscous gel adhesion.
PRESSURE AND TEMPERATURE SENSORS AND RELATED METHODS
A sensor includes an airfoil body, a heater element, and a temperature probe. The airfoil body defines a sensor axis, an insulating cavity, and extends between a leading edge and a trailing edge of the airfoil body. The heater element extends axially within the airfoil body and is positioned between the leading edge and the trailing edge of the airfoil body. The temperature probe extends axially within the airfoil body, is positioned between the heater element and the trailing edge of the airfoil body, and is separated from the heater element by the insulating cavity to limit thermal communication between the temperature probe and the heater element. Gas turbine engines, methods of making sensors, and methods of thermally separating temperature probes and heater elements in sensors are also described.