A micro pressure sensor includes a sense die mounted on a substrate, a ring structure encircling the sense die, and a silicone material is overmolded to an exterior of the ring structure to form a seal with the ring structure and fills an interior of the ring structure. The ring structure has one or more legs at bottom side, which are snap fitted to the substrate through mating holes such that the ring structure encircles the sense die; and a top surface of the silicone material receives the external pressure and transmits the external pressure to the sense surface of the sense die to generate an output signal on the sense die, wherein a processor converts the output signal into a pressure reading. The pressure-transmitting media transmits a received external pressure to the sense surface of the sense die to generate an output signal from the sense die, wherein a processor converts the output signal into a pressure reading.

To provide a pressure sensor housing that is less likely to cause temperature distribution inside a pressure sensor when the pressure sensor is disposed inside a heater block, a pressure sensor housing includes a hollow cylindrical member extending along a predetermined axis core. A pressure sensor element that detects the pressure of a fluid is accommodated inside the cylindrical member. The entire circumference of a side surface thereof is surrounded by an air layer in the first posture in which an axis core of a space is aligned with the predetermined axis core with the hollow member disposed in the space. The side surface is in contact with a wall surface defining the space at a plurality of points at the same time in a second posture, which is at least one of postures in which the predetermined axis core is eccentric with the axis core of the space.

An instrument enclosure includes top and bottom sections, the bottom section having a first part fastened to a second part, and hinges hinging the top and bottom sections to enable the top section to rotate between a close positioned and an open position. When closed, the instrument enclosure defines an enclosed space suitable for receiving a field instrument. The bottom section may be fastened to a standpipe or to a bracket fastened to the standpipe. The bottom section may define an opening configured to receive the standpipe and/or an opening to receive process line tubing carrying process line signals to the field instrument. The field instrument may be affixed to an end portion of the standpipe received in the enclosed space, removably attached to an interior of the instrument enclosure, or affixed to a mounting plate attached to the standing pipe.

A pressure gauge adapted to be mounted in a containing recess of an air pump includes a housing arranged in the containing recess, a driving member movably arranged in the housing, a biasing member biasing the driving member toward the housing, a driven member configured to be driven to rotate by the driving member, a pointer needle connected with the driven member, a scale plate disposed between the driven member and the pointer needle, and a guiding member arranged between the housing and the driving member. The guiding member is configured to contact at least one of the housing and the driving member to remain the driving member moving relative to the housing in a straight direction.

A sensor having a chamber with a sensor element arranged therein comprises a first volume of air. The sensor has a tubular air supply to the chamber, the air supply comprising a second volume of air, and penetration of water through the air supply to the sensor element being prevented by the dimensions of the air supply that define the second volume.

A semiconductor sensor assembly for use in a corrosive environment comprises a processing device comprising at least one first bondpad of a material which may be corroded by a corrosive component in a corrosive environment; a sensor device comprising at least one second bondpad consisting of and/or being covered by a first corrosion resistant material; at least one bonding wire for making a signal connection between the at least one first bondpad of the processing device and the second bondpad of the sensor device. The processing device is partially overmoulded by a second corrosion resistant material, and is partially exposed to a cavity in the corrosion resistant material, with the sensor device being present in the cavity. A redistribution layer is provided to enable signal connection between the processing device and the sensor device is physically made in the cavity while the second corrosion resistant material covers the first bondpad.

A pressure-sensor device (1) has: —a component sensitive to pressure, comprising a sensor body (5), with an elastically deformable membrane part (5a), and at least one detection element (6) for detecting a deformation of the membrane (5a); —a structure (2, 3) for housing or supporting the pressure-sensitive component, having at least one passageway (15) for a fluid the pressure of which is to be detected, the housing or supporting structure (2, 3) comprising a supporting body (2) with respect to which the sensor body (5) is positioned in such a way that its membrane part (5a) is exposed to the fluid coming out of the passageway (15), the supporting body (2) having a hydraulic-connection portion (2a) and a duct (14) that extends from the hydraulic-connection portion (2a); —at least one elastically deformable body (16), formed with one or more elastically deformable or compressible materials, comprising at least one from among: —a compressible compensation element (20, 21), configured for compensating any possible variations in volume of the fluid; —a sealing element (13, 17); configured for providing a seal with respect to at least one of the housing or supporting structure (2, 3), and the sensor body (5); and—a supporting element (23), configured for supporting or positioning the sensor body (5) with respect to the housing or supporting structure (2, 3). At least one from among the compressible compensation element (16), the sealing element (13, 17) and the supporting element (23) is overmoulded on at least one of the housing or sup porting structure (2, 3) and the sensor body (5).

A device includes: an outer case; an inner case; a cylindrical base having a distal end that penetrates through a cylinder of the outer case to be fixed to the outer case; and a fastener configured to be mounted on the distal end of the base, the fastener including: an exterior configured to be guided by a guide provided to the inner case; a fastener-side engaging portion engageable with the inner case; and a contact peripheral portion configured to be contact with the outer case to prevent the inner case from rotating relative to the outer case.

The present invention proposes a sensor, comprising a first element, a second element having a circular portion, the first element being configured to hold the circular portion of the second element against the first element at a holding angle less than 360 degrees.

Disclosed is a pressure detecting device having a temperature sensor, the device including: a housing having a first chamber, a second chamber, and a port part having a fluid guide tube that guides a pressure transmitting fluid to the second chamber; a lead frame coupled to the housing and configured for being connected to an external device; a circuit substrate electrically connected to the lead frame and including a first surface and a second surface; a pressure detecting element provided on the second surface of the circuit substrate and generating an electrical signal according to a pressure change; a tube coupled to the port part, whereby a first end of the tube is open and provided inside the first chamber; and a temperature detecting element provided inside the tube and transmitting an electrical signal generated according to a temperature change to the circuit substrate.