The present invention provides a pressure sensor module capable of improving work efficiency during assembly.

The pressure sensor module detects a fluid pressure on the basis of a differential pressure between a reference pressure and the fluid pressure, and includes: a housing; a sensor element that can contact each of the reference pressure and the fluid pressure; a support member that supports the sensor element and is held in the housing; a first pressure passage that guides the fluid pressure to a first contact surface of the sensor element; and a second pressure passage that is sealed from the first pressure passage and guides the reference pressure to a second contact surface of the sensor element. The support member is a structure that is formed by integrating an elastic material section exerting sealing performance on the first pressure passage and the second pressure passage and capable of being elastically deformed and a hard material section, rigidity of which is higher than the elastic material section.

The device includes a distal connector portion with a connector for electrical connection to an external electrical circuit, a proximal measuring portion including a detector of the physical parameter configured to be in fluid contact, the detector has a general shape of a wafer delimiting a first electrical contact face and a second opposite measuring face, a member for electrically joining the detector and the connector. The detector is configured in the device such that both faces of the detector are immersed and in direct fluid contact.

An intravascular pressure sensor assembly is disclosed herein that is produced in part using photolithography and DRIE solid-state device production processes. Using DRIE production processes facilitates a number of features that could not be readily incorporated in sensor chips fabricated using mechanical saws. In accordance with a first feature, sensor chips are created with non-rectangular outlines. The sensor chip includes a widened portion that substantially abuts an inner wall of a sensor housing, and a cantilevered portion that is relatively narrow in relation to the widened portion. The non-rectangular outline of the sensor chip is formed using photolithography in combination with DRIE processing. In accordance with another feature, the sensor chip is positioned width-wise in the housing, thereby reducing a required length for the housing. In accordance with yet another feature, the sensor chip comprises one or more cutouts for receiving signal wires for connection to signal lead lines on the sensor chip. The outline of the sensor chip and the cutouts are formed using photolithography in combination with DRIE processing.

A pressure sensor package includes a package lead frame including a molding plastic layer with a top surface and a plurality of lead frame units mounted in the molding plastic layer, a sidewall disposed on the top surface of the molding plastic layer and surrounding a receiving chamber, a pressure sensor module mounted on the top surface of the molding plastic layer and disposed in the receiving chamber, and a packaging silicone mounted in the receiving chamber to encapsulate the pressure sensor module.

A physical-quantity-measuring device includes: an outer-case including a bottom and a cylindrical body; a synthetic-resin-made inner-case provided inside the outer-case; a detector that detects a physical quantity; a terminal base including a terminal for transmitting a signal from the detector outward; a cover covering an opening of the outer-case and being different in hardness from the inner-case; a cable whose first end is connected to the terminal; and a cylindrical-cable-drawing portion drawing a second end of the cable and projecting from a circumferential surface of the outer-case. The inner case includes: a case threaded-portion; and a terminal-base-setting portion on which the terminal base is set. The detector includes: a bottom connector connected to the bottom; and a joint attachable to a target. The cover includes: a cover body covering the terminal-base-setting portion; and a cover threaded-portion provided to the cover body and screwable with the case threaded-portion.

A pressure sensor comprises a sensor housing, a diaphragm provided in the sensor housing, and a snubber insertable into the sensor housing. The sensor housing includes a coupler coupling with a pressure measurement target and a housing passage passing through the coupler and guiding a fluid that flows into the sensor housing from the pressure measurement target. The diaphragm is deformable by a pressure of the fluid that flows into the sensor housing from the pressure measurement target. The snubber is inserted into the sensor housing through the housing passage and fastens to the sensor housing in a state in which at least a portion of the sensor housing forming the housing passage is deformed. The snubber guides flow of the fluid and transmits the pressure of the fluid to the diaphragm.

A pressure sensor assembly and method for manufacturing a pressure sensor assembly is disclosed and includes a pressure responsive component having a pressure sensitive element and an output signal generator disposed on a common substrate. The substrate has an aperture extending completely there through and the pressure sensitive element is disposed in communication with the aperture. The aperture is open to the ambient environment. The pressure responsive component is received in a connector which is received in a housing. Multiple seal structures isolate the pressure responsive component within the housing.

There is provided a sensor device for measuring fluid and fluid conduit properties, and a method for activating the sensor device. The sensor device comprises an outer capsule for providing fluid-tight containment to an interior compartment of the sensor device in a closed position. The outer capsule comprises a first capsule portion and a second capsule portion. An aperture is located in the second capsule portion and fluidly connects the inner compartment to an exterior of the outer capsule. A mounting bracket is disposed within the inner compartment, the mounting bracket connects the first capsule portion to the second capsule portion and provides structural integrity and pressure resistivity for the outer capsule. At least one pressure sensor is constrained between the mounting bracket and an inner surface of the second capsule portion and is aligned with the aperture of the second capsule portion.

A micro pressure sensor includes a sense die mounted on a substrate, a ring structure encircling the sense die, and a silicone material is overmolded to an exterior of the ring structure to form a seal with the ring structure and fills an interior of the ring structure. The ring structure has one or more legs at bottom side, which are snap fitted to the substrate through mating holes such that the ring structure encircles the sense die; and a top surface of the silicone material receives the external pressure and transmits the external pressure to the sense surface of the sense die to generate an output signal on the sense die, wherein a processor converts the output signal into a pressure reading. The pressure-transmitting media transmits a received external pressure to the sense surface of the sense die to generate an output signal from the sense die, wherein a processor converts the output signal into a pressure reading.

A pressure switch includes a diaphragm sensing element disposed within a chamber to sealingly separate switching components from a passage. The diaphragm sensing element includes a convolution section that controls movement of a deflection section between neutral and pressurized positions. The pressure switch includes a reverse stop for limiting travel of the deflection section when exposed to negative pressure. A stationary seal element may be disposed at the reverse stop to further limit exposure of the convolution section of the diaphragm sensing element to negative pressure.