A micromechanical pressure sensor device is equipped with a sensor substrate including a front side and a rear side. The device includes a pressure sensor unit suspended in the sensor substrate, a first cavity above the pressure sensor unit, which is exposed toward the front side via one or multiple access openings, one or multiple stress relief trenches, which laterally enclose the pressure sensor unit and form a fluidic connection from the rear side to the first cavity, and a circuit substrate, on which the rear side of the sensor substrate is bonded. A second cavity, which is in fluidic connection with the stress relief trenches, is formed below the pressure sensor unit in the circuit substrate. At least one channel is provided in a periphery of the pressure sensor unit, which is in fluidic connection with the second cavity and is exposed to the outside.

In an embodiment a sensor arrangement includes a sensor die having a contact area, a suspended area and a sensitive element located in the suspended area, an interposer including at least two vias connecting a first side of the interposer to a second side of the interposer and a support mechanically and electrically connecting the contact area of the sensor die to the first side of the interposer, the support including at least two contact joints.

A device for detecting at least one property of a fluid medium, and a method for its production. The method includes a) providing at least one housing, the housing having at least one electrical contact; introducing at least one sensor element for detecting the property into the housing; c) providing at least one pressure-pipe tube, the pressure-pipe tube including at least one contacting element; d) bringing the contacting element into contact with the sensor element in such a way that an electrical connection is established between the contacting element and the sensor element; and e) introducing at least one circuit substrate into the housing in such a way that the circuit substrate is electrically connected to the electrical contact of the housing and to the sensor element, the housing and the pressure-pipe tube being produced as separate components.

In a pressure sensor, a cap-shaped shielding member (17) to block an electric field undesirable for a signal processing electronic circuit unit of a sensor chip (16) is supported by an end surface of a disk conductive plate (19) between one end surface of the sensor chip (16) in a liquid sealing chamber (13) and a diaphragm (32). The conductive plate (19) is electrically connected via a group of input-output terminals (40ai) and bonding wires (Wi), for example, and the sensor chip (16) is supported by one end portion of a chip mounting member (18) which is electrically connected via the group of input and output terminals (40ai) and the bonding wires (Wi).

A differential pressure transducer assembly having an internal bellows coupling configured to improve reliability and ease assembly. The differential pressure transducer assembly includes a header, a sensing element mounted on the header, a first pressure port having a first pressure media channel in communication with a first side of the sensing element, a second pressure port having a second pressure media channel in communication with a second side of the sensing element, and a bellows coupling disposed between the header and the second pressure port. The bellows coupling may be configured to flex during assembly to compensate for tolerance mismatches. The bellows coupling may further reduce or prevent external stress from being applied to one or more of the header and the sensing element.

The present invention relates to a sensor, particularly a flexible pressure sensor and a fabrication method thereof. The invention provides a flexible pressure sensor which comprises a sensor body and electrodes. The sensor body comprises a first insulation layer of PET film, a first conductivity layer, an isolation layer, a second conductive layer and a second insulation layer of PET film from top to bottom, respectively. The electrodes are made from the first conductive layer and the second conductive layer connected with external circuit through any electrical wire. The isolation layer is a semi-conductive foamed polymer with adjustable conductivity/resistance. Both of the first insulation layer of PET film and the second insulation layer of PET film have the thickness of 4.5-120 μm with the surface resistance value of 10.sup.13-14. In the process method of the invention, the isolation layer is a foamed polymer with adjustable conductivity. When pressed, the isolation layer deforms, which reduces the resistance between the two electrodes and increases the conductivity. High sensitivity of the isolation layer meets the requirement that a tiny deformation is enough to have a large change in resistance. Hence, the pressure can be detected by computer data processing upon the relationship between any external pressure and related resistance value.

A sensing device including a sensitive part and a first sensor. The sensitive part includes a sealed internal space. At least part of the sensitive part is flexible and configured to be flexed, by a load applied on the sensitive part or by vibration of the sensitive part, so as to change an air pressure in the internal space. The first sensor borders the internal space or is at least partly housed in the internal space. The first sensor includes at least one sensing part configured to detect changes in the air pressure in the internal space.

A pressure measuring device comprises a capacitive pressure measuring cell, a process connector including a retaining element, a housing mounted on the process connector, and a sealing element arranged between an inwardly projecting region of the retaining element and the pressure measuring cell. The retaining element is configured with a cap with a base area portion and an outer area portion bent over with respect thereto and fitted over an end face of the process connector. The retaining element is in a material-bonded and/or form-fit manner connected to the process connector exclusively in the bent-over outer area portion so that the base area portion assumes a resilient property.

A method for producing a micromechanical pressure sensor. The method includes: providing a MEMS wafer having a silicon substrate and a first cavity developed therein underneath a sensor diaphragm; providing a second wafer; bonding the MEMS wafer to the second wafer; and exposing a sensor core from the rear side; a second cavity being formed in the process between the sensor core and the surface of the silicon substrate, and the second cavity being developed with the aid of an etching process which is carried out using etching parameters that are modified in a defined manner.

A microelectromechanical force/pressure sensor has: a sensor die, of semiconductor material, having a front surface and a bottom surface, extending in a horizontal plane, and made of a compact bulk region having a thickness along a vertical direction, transverse to the horizontal plane; piezoresistive elements, integrated in the bulk region of the sensor die, at the front surface thereof; and a cap die, coupled above the sensor die, covering the piezoresistive elements, having a respective front surface and bottom surface, opposite to each other along the vertical direction, the bottom surface facing the front surface of the sensor die. A conversion layer is arranged between the front surface of the sensor die and the bottom surface of the cap die, patterned to define a groove traversing its entire thickness along the vertical direction; the piezoresistive elements are arranged vertically in correspondence to the groove and the conversion layer is designed to convert a load applied to the front surface of the cap die and/or bottom surface of the sensor die along the vertical direction into a planar stress distribution at the groove, acting in the horizontal plane.