A stress luminescence measurement method according to one aspect includes the steps of: placing a stress luminescent material on a surface of a sample; irradiating the stress luminescent material with excitation light; acquiring a first captured image by imaging the stress luminescent material during irradiation of the excitation light; applying a load to the sample; acquiring a stress luminescence image by imaging stress luminescence of the stress luminescent material; irradiating the stress luminescent material after removal of the load with the excitation light; acquiring a second captured image during irradiation of the excitation light by imaging the stress luminescent material in a state in which the load has been removed; and storing the first captured image and the second captured image in a memory in association with the stress luminescent image.

A terahertz scanner for detecting irregularities, such as chemical or structural variations, in a sample and methods of use thereof are described. The described terahertz scanner and algorithms allow for direct, high-sensitivity, high-throughput, and non-invasive detection of irregularities that range from chemical contaminant to material defects in a variety of substrates and settings.

The disclosure provides a structure diagnosis system and a structure diagnosis method. The structure diagnosis system includes: a lidar scanner scanning a structure to generate a point cloud data; an input interface receiving the point cloud data; and a processor receiving the point cloud data and generating a point cloud data set. The processor executes a surface degradation and geometry abnormal coupling diagnosis module to: marking a first point cloud range of a surface degradation area according to color space value of the point cloud data set; marking a second point cloud range of a geometry abnormal area according to coordinate value of the point cloud data set; when an abnormal area includes the first point cloud range and the second point cloud range at least partially overlapping each other, determining surface degradation or geometry abnormal occurring at the abnormal area and mark the abnormal area with a predetermined mode.

Apparatuses and methods are described for detecting inclusions in glass. The apparatuses and methods employ a laser that is configured to project a laser sheet at a first angle from one side of a glass sheet, and a camera configured to capture images from a second angle from another side of the glass sheet. The glass sheet is moved thorough the laser sheet while the camera captures images. One or more processing devices execute image processing algorithms to identify areas of the glass sheet containing inclusions based on the captured images. In some examples, the identified areas of the glass sheet are revisited to confirm they contain inclusions.

A method for inspecting a transparent workpiece comprises: directing light from an illumination source onto a plurality of defects formed in the transparent workpiece, wherein the plurality of defects extends in a defect direction, wherein the transparent workpiece comprises a first surface and a second surface; detecting a scattering image signal from light scattered by the plurality of defects using an imaging system, wherein an imaging axis of the imaging system extends at a non-zero imaging angle relative to the defect direction, wherein entireties of at least a subset of the plurality of defects are within a depth of field of the imaging system; and generating a three-dimensional image of at least one of the plurality of defects based on the scattering signal.

Modulation-encoded light, using different spectral bin coded light components, can illuminate a stationary or moving (relative) target object or scene. Response signal processing can use information about the respective different time-varying modulation functions, to decode to recover information about a respective response parameter affected by the target object or scene. Electrical or optical modulation encoding can be used. LED-based spectroscopic analysis of a composition of a target (e.g., SpO2, glucose, etc.) can be performed; such can optionally include decoding of encoded optical modulation functions. Baffles or apertures or optics can be used, such as to constrain light provided by particular LEDs. Coded light illumination can be used with a focal plane array light imager receiving response light for inspecting a moving semiconductor or other target. Encoding can use orthogonal functions, such as an RGB illumination sequence, or a sequence of combinations of spectrally contiguous or non-contiguous colors.

Apparatuses systems and methods for gas emission rate detection sensitivity and probability of detection (PoD) based on emission rate. A measurement system may be characterized by its ability to detect gas plumes as a function of the emission rate of those plumes. The measurement system may be characterized based on a generalized PoD function which expresses PoD relative to emission rate as a function of gas concentration noise and gas flow speed. In an example application, the PoD may be used to estimate a cumulative distribution of gas plumes which were not detected based on a cumulative distribution of measured gas plumes. In another example application, the PoD may be used to refine an estimate for a measured emission rate.

A system for improving drill bit performance, having processors and memory storing instructions to obtain a wear report for a drill bit, wherein the wear report includes wear characteristics of the drill bit and drill operating parameters under which the drill bit was used; compare the wear characteristics of the drill bit to a threshold for acceptable drill bit wear; and adjust drill operating parameters based on the wear characteristics of the drill bit. The instructions to obtain the wear report for the drill bit include instructions to analyze images of the drill bit to identify wear characteristics; identify wear patterns based on the wear characteristics of the drill bit; identify probable drilling conditions based on the wear patterns; and generate the wear report for the drill bit based on the images of the drill bit, the wear characteristics of the drill bit, and the probable drilling conditions.

Disclosed herein are systems and methods for synthesizing a diamond using a diamond synthesis machine. A processor receives a plurality of images of a diamond during synthesis within a diamond synthesis machine, each of the plurality of images captured within a time period. The processor executes a diamond state prediction machine learning model using the plurality of images to obtain a predicted data object, the predicted data object indicating a predicted state of the diamond within the diamond synthesis machine at a time subsequent to the time period. The processor detects a predicted defect, a number of defects, defect types, and/or sub-features of such defects and/or other characteristics (e.g., a predicted shape, size, and/or other properties of predicted contours for the diamond and/or pocket holder) of the predicted state of the diamond. The processor adjusts operation of the diamond synthesis machine.

A continuous dust accumulation monitoring system, device and method monitors and measures dust accumulation via an enclosure and a machine vision subsystem which can include a digital camera. A dirty optics detection subsystem monitors optical clarity and can invoke a cleaning assembly to help maintain clarity of optics for monitoring and measuring dust accumulation.