A method of detecting defects in a structure sample comprising a thin film layer and a sacrificial later is disclosed. The method comprises exposing the thin film layer to a vapour phase etchant, obtaining an image of the thin film layer and analysing the image. The vapour phase etchant enhances any defects present in the thin film layer by passing through the defect and etching a cavity within the sacrificial layer. The cavity undercuts the thin film layer resulting in a stress region surrounding the defect. Defects which were not originally detectable may be made detectable after exposure to the vapour phase etchant. A vapour phase etchant has the advantage of being highly mobile such that it can access defects that a liquid phase etchant might not. Furthermore, unlike a liquid phase etchant, a vapour phase etchant can be used to test a sample non-destructively.

Provided is a method for detecting defects, in particular cracks and/or pores, in a component, in particular in a component of a turbomachine, preferably in a component of an engine, the method including the following steps: applying penetrant to at least a sub-region of the component such that the penetrant penetrates into any defects, in particular cracks and/or pores, present in the component; cleaning the surface of the component of penetrant that has not penetrated into defects, in particular cracks and/or pores, of the component; capturing an image, in particular a complete image, of the component; inputting the captured image into a machine learning system trained to detect defects, in particular cracks and/or pores; and detecting defects, in particular cracks and/or pores, in the component by machine learning system on the basis of light emitted and/or reflected by the penetrant in the defects, in particular cracks and/or pores.

Provided is a method for detecting defects, in particular cracks and/or pores, in a component, in particular in a component of a turbomachine, preferably in a component of an engine, the method including the following steps: applying penetrant to at least a sub-region of the component such that the penetrant penetrates into any defects, in particular cracks and/or pores, present in the component; cleaning the surface of the component of penetrant that has not penetrated into defects, in particular cracks and/or pores, of the component; capturing an image, in particular a complete image, of the component; inputting the captured image into a machine learning system trained to detect defects, in particular cracks and/or pores; and detecting defects, in particular cracks and/or pores, in the component by machine learning system on the basis of light emitted and/or reflected by the penetrant in the defects, in particular cracks and/or pores.

An article of manufacture may include a tangible, non-transitory computer-readable storage medium having instructions stored thereon that, in response to execution by a processor, cause the processor to perform operations comprising: commanding, via the processor, a first scan of a bladed rotor; generating, via the processor, a three-dimensional model based on a first set of data received from a first scanner; comparing, via the processor, the three-dimensional model to an acceptable three-dimensional model of the bladed rotor; determining, via the processor, areas of interest based on the comparison; and commanding, via the processor, a contact probe to perform a non-destructive inspection on the areas of interest.

An article of manufacture may include a tangible, non-transitory computer-readable storage medium having instructions stored thereon that, in response to execution by a processor, cause the processor to perform operations comprising: commanding, via the processor, a first scan of a bladed rotor; generating, via the processor, a three-dimensional model based on a first set of data received from a first scanner; comparing, via the processor, the three-dimensional model to an acceptable three-dimensional model of the bladed rotor; determining, via the processor, areas of interest based on the comparison; and commanding, via the processor, a contact probe to perform a non-destructive inspection on the areas of interest.

A crimping determination device according to an embodiment includes a dropping unit, an image acquisition unit, and a control unit. The dropping unit drops a test solution to a wire harness. The wire harness includes a crimped portion in which an electric wire is crimped by a crimping terminal, a first electric wire portion in which the electric wire is exposed on a distal end side, and a second electric wire portion in which the electric wire is exposed on a proximal end side. The dropping unit drops the test solution to either one of the first electric wire portion and the second electric wire portion. The image acquisition unit acquires an image including the other one of the first electric wire portion and the second electric wire portion. The control unit determines a quality of a crimped state of the crimped portion based on the image.

A method for detecting a defect in a semiconductor fabrication process is disclosed. The method includes forming photoresist on a substrate; forming a fluorescent agent in the photoresist; and detecting the defect of the photoresist after being subjected to developing by utilizing the fluorescent agent.

A method of detecting defects in a structure sample comprising a thin film layer and a sacrificial later is disclosed. The method comprises exposing the thin film layer to a vapour phase etchant, obtaining an image of the thin film layer and analysing the image. The vapour phase etchant enhances any defects present in the thin film layer by passing through the defect and etching a cavity within the sacrificial layer. The cavity undercuts the thin film layer resulting in a stress region surrounding the defect. Defects which were not originally detectable may be made detectable after exposure to the vapour phase etchant. A vapour phase etchant has the advantage of being highly mobile such that it can access defects that a liquid phase etchant might not. Furthermore, unlike a liquid phase etchant, a vapour phase etchant can be used to test a sample non-destructively.

Embodiments of the invention include a dye and pry process for removing a surface mount technology (SMT) dual in-line memory module (DIMM) from card assemblies. Aspects of the invention include immersing a semiconductor package assembly in a solution comprising dye and placing the immersed semiconductor package assembly under vacuum pressure. Vacuum conditions ensure that the dye solution is pulled into any cracks in the solder formed between the semiconductor package assembly and the SMT DIMM. The package assembly is dried, and a dummy card stock is installed in the SMT DIMM using an epoxy. The SMT DIMM is then removed by applying a force to an exposed cavity between the dummy card stock and the semiconductor package assembly. The semiconductor package assembly and the SMT DIMM can then be inspected for the dye to locate cracks.

Embodiments of the invention include a dye and pry process for removing a surface mount technology (SMT) dual in-line memory module (DIMM) from card assemblies. Aspects of the invention include immersing a semiconductor package assembly in a solution comprising dye and placing the immersed semiconductor package assembly under vacuum pressure. Vacuum conditions ensure that the dye solution is pulled into any cracks in the solder formed between the semiconductor package assembly and the SMT DIMM. The package assembly is dried, and a dummy card stock is installed in the SMT DIMM using an epoxy. The SMT DIMM is then removed by applying a force to an exposed cavity between the dummy card stock and the semiconductor package assembly. The semiconductor package assembly and the SMT DIMM can then be inspected for the dye to locate cracks.