Patent classifications
G01N21/95
DAMAGE DETECTION APPARATUS FOR LOCK GATE SILL
The present invention discloses a damage detection apparatus for a lock gate sill, including a support, a water storage tank, a water inlet barrel, a filter device, a water pump, and a control device, wherein a barrier is vertically disposed at the bottom of the water storage tank, multiple water discharge pipes are vertically disposed in the barrier, upper ends of the water discharge pipes are communicated with the water storage tank, the water discharge pipes have different heights, lower ports of the water discharge pipes together compose a truncated conical cavity, a camera is disposed at the bottom of the water storage tank in a sealed manner, and a lens of the camera is located in an upper part of the truncated conical cavity. When it is desired to perform damage detection for the lock gate sill, muddy water is filtered by the filter device into clear water, and the clear water is pressurized by the water pump and then discharged from the water discharge pipes, such that the muddy water in the barrier is continuously diluted by clear water, the camera is in a shooting environment of clear water, and the lock gate sill is shot for detection at this time, whereby it is ensured that the taken picture has good definition, and thus the position of abrasion and the amount of abrasion of the lock gate sill can be clearly determined.
DAMAGE DETECTION APPARATUS FOR LOCK GATE SILL
The present invention discloses a damage detection apparatus for a lock gate sill, including a support, a water storage tank, a water inlet barrel, a filter device, a water pump, and a control device, wherein a barrier is vertically disposed at the bottom of the water storage tank, multiple water discharge pipes are vertically disposed in the barrier, upper ends of the water discharge pipes are communicated with the water storage tank, the water discharge pipes have different heights, lower ports of the water discharge pipes together compose a truncated conical cavity, a camera is disposed at the bottom of the water storage tank in a sealed manner, and a lens of the camera is located in an upper part of the truncated conical cavity. When it is desired to perform damage detection for the lock gate sill, muddy water is filtered by the filter device into clear water, and the clear water is pressurized by the water pump and then discharged from the water discharge pipes, such that the muddy water in the barrier is continuously diluted by clear water, the camera is in a shooting environment of clear water, and the lock gate sill is shot for detection at this time, whereby it is ensured that the taken picture has good definition, and thus the position of abrasion and the amount of abrasion of the lock gate sill can be clearly determined.
Systems and Methods for Quality Control of a Periodic Structure
Quality control of a periodic structure is performed using the damping rate of acoustic waves generated in the periodic structure. In this technique, an excitation light beam illuminates the first layer in the periodic structure to excite an acoustic wave. Possible irregularities in the periodic structure can scatter the acoustic wave, thereby increasing the damping rate of the acoustic wave. A sequence of probe light beams illuminates the periodic structure to measure the acoustic wave as a function of time to generated a temporal signal representing the damping rate of the acoustic signal. The acquired damping rate is employed to evaluate the quality of the periodic structure.
METHOD AND DEVICE FOR QUALITY ASSESSMENT OF A PROCESSING OPERATION
In a method and device for assessing the quality of a processing operation, a workpiece with specific processing parameters is processed along a processing trajectory. The (X), wherein the processing result is measured by at least one sensor and at least one sensor signal is recorded and at least one quality parameter is determined based on at least one sensor signal and the at least one quality parameter is compared with quality parameter threshold values to assess the quality of the processing result. During the assessment of the processing operation quality, changes made to the processing parameters from target values during the processing are automatically taken into consideration, in that, instead of the quality parameter threshold values, quality parameter threshold values adapted to the changes in the processing parameters are determined, and the at least one quality parameter for assessing the quality of the processing result is compared with the adapted quality parameter threshold values.
METHOD AND DEVICE FOR QUALITY ASSESSMENT OF A PROCESSING OPERATION
In a method and device for assessing the quality of a processing operation, a workpiece with specific processing parameters is processed along a processing trajectory. The (X), wherein the processing result is measured by at least one sensor and at least one sensor signal is recorded and at least one quality parameter is determined based on at least one sensor signal and the at least one quality parameter is compared with quality parameter threshold values to assess the quality of the processing result. During the assessment of the processing operation quality, changes made to the processing parameters from target values during the processing are automatically taken into consideration, in that, instead of the quality parameter threshold values, quality parameter threshold values adapted to the changes in the processing parameters are determined, and the at least one quality parameter for assessing the quality of the processing result is compared with the adapted quality parameter threshold values.
SUBSTRATE EDGE TEST APPARATUS, SYSTEM, AND METHOD
An apparatus for testing an edge portion of a substrate, includes a first illumination source configured to irradiate light to an end portion of the edge portion of the substrate; a second illumination source configured to irradiate light to a lower portion of the edge portion; a third illumination source configured to irradiate light to an upper portion of the edge portion; and first to third photographing portions, respectively corresponding to the first to third illumination sources, wherein the first illumination source comprises a C-shaped cross-section and comprises a first curved surface facing the end portion of the edge portion, the second illumination source comprises a half C-shaped cross-section and comprises a second curved surface facing the lower portion of the edge portion, and the third illumination source comprises a half C-shaped cross-section and comprises a third curved surface facing the upper portion of the edge portion.
Method of fabricating a photomask and method of inspecting a photomask
In accordance with some embodiments of the present disclosure, an inspection method of a photomask includes performing a first inspection process, unloading the photomask from the inspection system, and performing a second inspection process. In the first inspection process, a common Z calibration map of an objective lens of an optical module with respect to the photomask is generated and stored, and a first image of the photomask is captured by using an image sensor while focusing the objective lens of the optical module based on the common Z calibration map. The photomask is unloaded from the inspection system. In the second inspection process, the photomask is loaded on the inspection system and a second image of the photomask is captured by using an image sensor while focusing an objective lens of an optical module based on the common Z calibration map generated in the first inspection process.
TEMPLATE-BASED IMAGE PROCESSING FOR TARGET SEGMENTATION AND METROLOGY
One or more images of a portion of a wafer with fabricated devices are acquired using an imaging tool. A pattern of repeating features in an input image of a wafer is identified using various methods, such as correlation and clustering of neighboring vectors. A template is generated based on the found pattern of repeating features. The template is aligned with the acquired image to identify target locations. The target locations are then isolated from the original image for performing detailed metrology.
SYSTEM FOR AUTOMATIC DIAGNOSTICS AND MONITORING OF SEMICONDUCTOR DEFECT DIE SCREENING PERFORMANCE THROUGH OVERLAY OF DEFECT AND ELECTRICAL TEST DATA
Systems and methods for determining a diagnosis of a screening system are disclosed. Such systems and methods include identifying defect results based on inline characterization tool data, identifying electrical test results based on electrical test data, generating one or more correlation metrics based on the defect results and the electrical test results, and determining at least one diagnosis of the screening system based on the one or more correlation metrics, the diagnosis corresponding to a performance of the screening system.
SELECTIVE MARKING OF A SUBSTRATE WITH FLUORESCENT PROBES HAVING A SMALL FORM FACTOR
A photoluminescent material can be applied to part of a substrate as part of substrate inspection. The photoluminescent material includes a conjugated polymer having a coiled macroscopic molecular shape and a meta-linkage or an ortho-linkage. The substrate is imaged using an inspection system. The conjugated polymer can be, for example, poly(m-phenylene ethynylene) (PPE) or poly(para-phenylene vinylene) (PPV).