In one embodiment, a surface has a laser-beam machined area including an array of micro-sized conical pillars that are arranged in orthogonal rows and columns across the surface and that extend upward, the conical pillars defining deep troughs between them that are configured to absorb electrons, electromagnetic radiation, or both, the conical pillars tapering from relatively wide bases to pointed tips, the conical pillars comprising outer surfaces that are covered with a plurality of nanoparticles.

A method for measuring an element concentration of a material includes: a material sample is irradiated with first electromagnetic waves; second electromagnetic waves radiated by the material sample are obtained under the action of the first electromagnetic waves; material property parameters of the material sample are determined by detecting the second electromagnetic waves; and an element concentration of the material sample is determined according to the material property parameters.

There is provided a copper bonding wire that exhibits a favorable bondability even when a scrub at the time of bonding is reduced. The copper bonding wire is characterized in that when a sum of percentages of Cu, Cu.sub.2O, CuO and Cu(OH).sub.2 on a surface of the wire as measured by X-ray Photoelectron Spectroscopy (XPS) is defined as 100%, Cu[II]/Cu[I] which is a ratio of a total percentage of CuO and Cu(OH).sub.2 (Cu[II]) corresponding to bivalent Cu to a percentage of Cu.sub.2O (Cu[I]) corresponding to monovalent Cu falls within a range from 0.8 to 12.

There is provided a copper bonding wire that exhibits a favorable bondability even when a scrub at the time of bonding is reduced. The copper bonding wire is characterized in that when a sum of percentages of Cu, Cu.sub.2O, CuO and Cu(OH).sub.2 on a surface of the wire as measured by X-ray Photoelectron Spectroscopy (XPS) is defined as 100%, Cu[II]/Cu[I] which is a ratio of a total percentage of CuO and Cu(OH).sub.2 (Cu[II]) corresponding to bivalent Cu to a percentage of Cu.sub.2O (Cu[I]) corresponding to monovalent Cu falls within a range from 0.8 to 12.

Provided is a method for virtually executing an operation of an energy dispersive x-ray spectrometry (EDS) system in real time production line by analyzing a defect included in a material undergoing inspection based on computer vision, the method including receiving a scanning electron microscope (SEM) image of the material including the defect, extracting an image-feature from the SEM image of the material, classifying the extracted image-feature under a predetermined label, predicting, based on the classified image-feature, an element associated with the defect included in the material and a shape of the predicted element, and grading the defect included in the material based on comparing the predicted element with a predetermined criteria.

Provided is a method for virtually executing an operation of an energy dispersive x-ray spectrometry (EDS) system in real time production line by analyzing a defect included in a material undergoing inspection based on computer vision, the method including receiving a scanning electron microscope (SEM) image of the material including the defect, extracting an image-feature from the SEM image of the material, classifying the extracted image-feature under a predetermined label, predicting, based on the classified image-feature, an element associated with the defect included in the material and a shape of the predicted element, and grading the defect included in the material based on comparing the predicted element with a predetermined criteria.

According to one embodiment, a reduction catalyst includes a current collector including a metal layer; and organic molecules including a quaternary nitrogen cation, which are bonded to the metal layer. The organic molecules are represented by any of the following general formulae I to V.

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A system for positioning a sample in a charged particle apparatus (CPA) or an X-ray photoelectron spectroscopy (XPS) system includes a sample carrier coupled to a stage inside the vacuum chamber of the CPA or XPS system. The system allows transferring of the sample carrier among multiple CPAs, XPS systems and glove boxes in inert gas or in vacuum. The sample carrier is releasably coupled with the stage in the vacuum chamber of the CPA or the XPS. Multiple electrodes in a sample area of the sample carrier are electrically connectable with the stage by multiple spring contacts between the sample carrier and the stage.

A system for positioning a sample in a charged particle apparatus (CPA) or an X-ray photoelectron spectroscopy (XPS) system includes a sample carrier coupled to a stage inside the vacuum chamber of the CPA or XPS system. The system allows transferring of the sample carrier among multiple CPAs, XPS systems and glove boxes in inert gas or in vacuum. The sample carrier is releasably coupled with the stage in the vacuum chamber of the CPA or the XPS. Multiple electrodes in a sample area of the sample carrier are electrically connectable with the stage by multiple spring contacts between the sample carrier and the stage.

The present invention provides a method of deterioration analysis that enables detailed analysis of the deterioration, especially of the surface, of a polymer material containing at least two diene polymers. The present invention relates to a method of deterioration analysis including: irradiating a polymer material containing at least two diene polymers with high intensity x-rays; and measuring x-ray absorption while varying the energy of the x-rays, to analyze the deterioration of each diene polymer.