A system such as a vehicle may have windows with one or more conductive layers. The conductive layers may form part of an infrared-light-blocking layer or other layer. The infrared-light-blocking layer or other layer may be formed as a coating on a transparent structural window layer such as an outer or inner glass layer in a laminated window or may be embedded in a polymer layer between the outer and inner layers. Segmented terminals and elongated terminals that may extend past two or more segmented terminals may be coupled to the edges of the conductive layers. Using these terminals, control circuitry can apply localized ohmic heating currents and can make resistance measurements on the conductive layers to detect cracks.

A system such as a vehicle may have windows with one or more conductive layers. The conductive layers may form part of an infrared-light-blocking layer or other layer. The infrared-light-blocking layer or other layer may be formed as a coating on a transparent structural window layer such as an outer or inner glass layer in a laminated window or may be embedded in a polymer layer between the outer and inner layers. Segmented terminals and elongated terminals that may extend past two or more segmented terminals may be coupled to the edges of the conductive layers. Using these terminals, control circuitry can apply localized ohmic heating currents and can make resistance measurements on the conductive layers to detect cracks.

An electronic device include: a first housing; a second housing; a display module including a flexible substrate, a TFT layer on the flexible substrate, a protection layer on the TFT layer, and a deformation region which deforms as a relative position between the first housing and the second housing changes; a bending portion including a first layer integral with the flexible substrate and bent, and a second layer integral with the TFT layer, bent and laminated on the first layer; a display driver IC (DDI) in the bending portion; a touch wire on the protection layer to be connected to a touch circuit; and a detection wire on the protection layer in the deformation region and having an electrical value changeable by physical damage to the protection layer. The detection wire extends from the protection layer to the second layer so as to be electrically connected to the DDI.

An electronic device include: a first housing; a second housing; a display module including a flexible substrate, a TFT layer on the flexible substrate, a protection layer on the TFT layer, and a deformation region which deforms as a relative position between the first housing and the second housing changes; a bending portion including a first layer integral with the flexible substrate and bent, and a second layer integral with the TFT layer, bent and laminated on the first layer; a display driver IC (DDI) in the bending portion; a touch wire on the protection layer to be connected to a touch circuit; and a detection wire on the protection layer in the deformation region and having an electrical value changeable by physical damage to the protection layer. The detection wire extends from the protection layer to the second layer so as to be electrically connected to the DDI.

The present disclosure enables apparatus and methods for tracking medications and/or product units via smart-packaging concepts. Embodiments include sensors that monitor the state of a blister-card package having an unpatterned lidding film by measuring the impedance of each dispensing region of the lidding film that defines a portion of a blister. In some embodiments, the impedance is measured via a plurality of contact points arranged on opposite sides of each dispensing region, where the contact points are resistively or capacitively coupled with the lidding film. In some embodiments, the impedance map of a measurement region on the blister card is derived via electrical impedance tomography or electrical resistance tomography, where the measurement region includes a plurality of dispensing regions.

A method of examining the integrity of an aircraft structure including determining an electrical conductivity or resistivity of the metal matrix composite of the aircraft structure. An apparatus for performing such a method is also provided. A method of estimating damage in an aircraft structure and a method of estimating the remaining operational life of an aircraft structure are also provided.

A semiconductor device includes a target layer disposed on a substrate, and a crack sensor for detecting a crack generated in the target layer. The crack sensor includes a first conductive pattern positioned at a bottom surface of the target layer, a second conductive pattern positioned on a top surface of the target layer, the top surface being opposite to the bottom surface of the target layer, a plurality of resistors, and nodes. The plurality of resistors are connected in parallel to each other through the first conductive pattern and the second conductive pattern. Each of the plurality of resistors is disposed to substantially penetrate the target layer.

A semiconductor device includes a target layer disposed on a substrate, and a crack sensor for detecting a crack generated in the target layer. The crack sensor includes a first conductive pattern positioned at a bottom surface of the target layer, a second conductive pattern positioned on a top surface of the target layer, the top surface being opposite to the bottom surface of the target layer, a plurality of resistors, and nodes. The plurality of resistors are connected in parallel to each other through the first conductive pattern and the second conductive pattern. Each of the plurality of resistors is disposed to substantially penetrate the target layer.

A system, apparatus, and method for analyzing cathodic protection (CP) current shielding of a coating are provided. The system includes: a test cell configured to have a coating film disposed therein and to be filled with electrically conductive solution surrounding the coating film; an electrical resistance (ER) probe mounted through a port of the test cell; and a potentiostat configured to: apply potential to the test cell to thereby polarize a sensing element of the ER probe such that the ER probe is configured to measure data indicative of a corrosion rate of the sensing element when the coating film is disposed within the test cell and while a CP current flows through the sensing element; and measure a current density through the sensing element in order to indicate an extent of CP current shielding of the coating film.

A system, apparatus, and method for analyzing cathodic protection (CP) current shielding of a coating are provided. The system includes: a test cell configured to have a coating film disposed therein and to be filled with electrically conductive solution surrounding the coating film; an electrical resistance (ER) probe mounted through a port of the test cell; and a potentiostat configured to: apply potential to the test cell to thereby polarize a sensing element of the ER probe such that the ER probe is configured to measure data indicative of a corrosion rate of the sensing element when the coating film is disposed within the test cell and while a CP current flows through the sensing element; and measure a current density through the sensing element in order to indicate an extent of CP current shielding of the coating film.