Patent classifications
G01N27/24
Sensor and capacitor device
According to one embodiment, a sensor includes a sensor element. The sensor element includes a first base body, a first fixed electrode fixed to the first base body, and a first structure body. The first structure body includes a first fixed portion fixed to the first base body, a first deformable portion supported by the first fixed portion, a first intermediate portion supported by the first deformable portion, and a first movable portion supported by the first intermediate portion. The first deformable portion includes a first deformed facing surface facing the first base body, and a first deformable surface. The first intermediate portion includes a first intermediate facing surface facing the first base body, and a first intermediate surface. The first deformable surface is possible to be deformed depending on a gas included in a space around the first structure body.
Sensor and capacitor device
According to one embodiment, a sensor includes a sensor element. The sensor element includes a first base body, a first fixed electrode fixed to the first base body, and a first structure body. The first structure body includes a first fixed portion fixed to the first base body, a first deformable portion supported by the first fixed portion, a first intermediate portion supported by the first deformable portion, and a first movable portion supported by the first intermediate portion. The first deformable portion includes a first deformed facing surface facing the first base body, and a first deformable surface. The first intermediate portion includes a first intermediate facing surface facing the first base body, and a first intermediate surface. The first deformable surface is possible to be deformed depending on a gas included in a space around the first structure body.
CHIP CRACK DETECTION STRUCTURE
A chip crack detection structure, including a substrate, a first chip crack detection ring, a second chip crack detection ring, and a seal ring, is provided. The first chip crack detection ring includes multiple first conductive layers stacked over the substrate and electrically connected to each other. A bottom surface of a lowermost conductive layer among the first conductive layers is not in contact with any plug. The second chip crack detection ring surrounds the first chip crack detection ring. The second chip crack detection ring includes multiple second conductive layers stacked over the substrate and electrically connected to each other. A bottom surface of a lowermost conductive layer among the second conductive layers is not in contact with any plug. The seal ring surrounds the second chip crack detection ring. The seal ring includes multiple third conductive layers stacked over the substrate and electrically connected to each other.
CHIP CRACK DETECTION STRUCTURE
A chip crack detection structure, including a substrate, a first chip crack detection ring, a second chip crack detection ring, and a seal ring, is provided. The first chip crack detection ring includes multiple first conductive layers stacked over the substrate and electrically connected to each other. A bottom surface of a lowermost conductive layer among the first conductive layers is not in contact with any plug. The second chip crack detection ring surrounds the first chip crack detection ring. The second chip crack detection ring includes multiple second conductive layers stacked over the substrate and electrically connected to each other. A bottom surface of a lowermost conductive layer among the second conductive layers is not in contact with any plug. The seal ring surrounds the second chip crack detection ring. The seal ring includes multiple third conductive layers stacked over the substrate and electrically connected to each other.
SENSOR AND CAPACITOR DEVICE
According to one embodiment, a sensor includes a sensor element. The sensor element includes a first base body, a first fixed electrode fixed to the first base body, and a first structure body. The first structure body includes a first fixed portion fixed to the first base body, a first deformable portion supported by the first fixed portion, a first intermediate portion supported by the first deformable portion, and a first movable portion supported by the first intermediate portion. The first deformable portion includes a first deformed facing surface facing the first base body, and a first deformable surface. The first intermediate portion includes a first intermediate facing surface facing the first base body, and a first intermediate surface. The first deformable surface is possible to be deformed depending on a gas included in a space around the first structure body.
SENSOR AND CAPACITOR DEVICE
According to one embodiment, a sensor includes a sensor element. The sensor element includes a first base body, a first fixed electrode fixed to the first base body, and a first structure body. The first structure body includes a first fixed portion fixed to the first base body, a first deformable portion supported by the first fixed portion, a first intermediate portion supported by the first deformable portion, and a first movable portion supported by the first intermediate portion. The first deformable portion includes a first deformed facing surface facing the first base body, and a first deformable surface. The first intermediate portion includes a first intermediate facing surface facing the first base body, and a first intermediate surface. The first deformable surface is possible to be deformed depending on a gas included in a space around the first structure body.
PROBE FOR NON-INTRUSIVELY DETECTING IMPERFECTIONS IN A TEST OBJECT
A probe for non-intrusively detecting imperfections in a test object made from metallic, non-conductive, and/or composite materials. The probe may include a capacitive measuring apparatus that includes at least two coplanar electrodes, an adjustment device to adjust a spatial separation between the electrodes, and a separation device. The separation device may maintain a substantially constant distance between the at least two coplanar electrodes and the test object during test measurements.
PROBE FOR NON-INTRUSIVELY DETECTING IMPERFECTIONS IN A TEST OBJECT
A probe for non-intrusively detecting imperfections in a test object made from metallic, non-conductive, and/or composite materials. The probe may include a capacitive measuring apparatus that includes at least two coplanar electrodes, an adjustment device to adjust a spatial separation between the electrodes, and a separation device. The separation device may maintain a substantially constant distance between the at least two coplanar electrodes and the test object during test measurements.
INSULATING ELEMENT, IN PARTICULAR STRIP, METHOD OF INSPECTION OF WELDS AND MELTING OF INSULATING ELEMENTS AND CONTROL SYSTEM OF WELDS AND MELTING OF INSULATING ELEMENTS
The subject of the invention is based on an insulating element, in particular a strip or other insulating element, joined in particular by melting or welding, which is provided on at least one side with a combustible or thermally destructible and electrically conductive element. The invention also relates to a method of inspecting of welds and melting of insulating elements, in particular strips. The invention further provides a control system for welds and melting-down of insulating elements.
INSULATING ELEMENT, IN PARTICULAR STRIP, METHOD OF INSPECTION OF WELDS AND MELTING OF INSULATING ELEMENTS AND CONTROL SYSTEM OF WELDS AND MELTING OF INSULATING ELEMENTS
The subject of the invention is based on an insulating element, in particular a strip or other insulating element, joined in particular by melting or welding, which is provided on at least one side with a combustible or thermally destructible and electrically conductive element. The invention also relates to a method of inspecting of welds and melting of insulating elements, in particular strips. The invention further provides a control system for welds and melting-down of insulating elements.