A structural health monitoring system capable of maintaining electrical contact with sensors affixed to a rotating structure. One such structural health monitoring system comprises a rotatable structure, a plurality of sensors each affixed to the rotatable structure, and an interface. The interface has an inner housing and an outer housing, and maintains a plurality of individual electrical connections, each of the individual electrical connections being an electrical connection between one of the sensors and an electrical contact maintained on the outer housing, the electrical connections configured to be maintained during rotation of the structure. The inner housing is affixed to the structure and the outer housing is rotationally coupled to the inner housing, so that the inner housing is free to rotate with respect to the outer housing during rotation of the structure and the sensors, while maintaining the electrical connections.

An apparatus for inspecting an empty crate that is transported on a transport device includes an inspection device having a pulse generator, a processor, a sensor, and an uncoupling device. Prior to inspection, the uncoupling device uncouples the empty crate from the transport device. The pulse generator then excites vibrations in the empty crate, which the sensor receives and passes to a processor for analysis.

An apparatus for inspecting an empty crate that is transported on a transport device includes an inspection device having a pulse generator, a processor, a sensor, and an uncoupling device. Prior to inspection, the uncoupling device uncouples the empty crate from the transport device. The pulse generator then excites vibrations in the empty crate, which the sensor receives and passes to a processor for analysis.

A density detection system uses a magnetic force feedback actuator positioner to maintain a precise selected pressure between transducer wheels and the surface of a sheet of material as the sheet of material moves through a position between transducer wheel and lift wheel. Consequently, the antiquated mechanical/pneumatic springs/airbags of prior art ultrasonic density detection systems are replaced with a highly responsive magnetic force feedback actuator positioner capable of providing a precise and relatively constant force that can react to the introduction of a sheet of material, and/or variations in the surface of a sheet of material, extremely rapidly without the bounce/recovery oscillations associated with prior art ultrasonic density detection systems. Consequently, precise density measurements of an entire sheet of material can be obtained with unprecedented accuracy.

A density detection system uses a magnetic force feedback actuator positioner to maintain a precise selected pressure between transducer wheels and the surface of a sheet of material as the sheet of material moves through a position between transducer wheel and lift wheel. Consequently, the antiquated mechanical/pneumatic springs/airbags of prior art ultrasonic density detection systems are replaced with a highly responsive magnetic force feedback actuator positioner capable of providing a precise and relatively constant force that can react to the introduction of a sheet of material, and/or variations in the surface of a sheet of material, extremely rapidly without the bounce/recovery oscillations associated with prior art ultrasonic density detection systems. Consequently, precise density measurements of an entire sheet of material can be obtained with unprecedented accuracy.

An inspection system for performing an inspection of an end region of a part is provided. The inspection system includes a robotic assembly positioned along a side of the part. The inspection system includes an ultrasonic probe coupled to the robotic assembly and positioned in proximity to the end region of the part. The ultrasonic probe is moved by the robotic assembly along a path to inspect the end region of the part. During the inspection, the ultrasonic probe transmits a signal towards the end region of the part and receives a reflected signal from the end region of the part. The inspection system provides, as a single system, for inspection of both a body of the part and the end region of the part.

An ultrasonic matrix phased array inspection system can include a plurality of curved matrix phased array probes surrounding a test chamber through which a longitudinal test object passes. Fluid injectors can provide a rotating fluid jacket around the longitudinal test object to ultrasonically couple the plurality of curved matrix phased array probes to the longitudinal test object. The plurality of curved matrix phased array probes can remain in a fixed position during inspection and can inspect the longitudinal test object by transmitting ultrasonic sound waves at various angles to identify flaws of any orientation.

An ultrasonic matrix phased array inspection system can include a plurality of curved matrix phased array probes surrounding a test chamber through which a longitudinal test object passes. Fluid injectors can provide a rotating fluid jacket around the longitudinal test object to ultrasonically couple the plurality of curved matrix phased array probes to the longitudinal test object. The plurality of curved matrix phased array probes can remain in a fixed position during inspection and can inspect the longitudinal test object by transmitting ultrasonic sound waves at various angles to identify flaws of any orientation.

Provided is an ultrasonic inspection device for inspecting a packaged semiconductor device, The ultrasonic inspection device including an ultrasonic transducer that is disposed to face the semiconductor device; a medium holding unit that is provided at an end of the ultrasonic transducer facing the semiconductor device and holds a medium through which ultrasonic waves are propagated; a stage that moves the position of the semiconductor device relative to the ultrasonic transducer; and an analysis unit that analyzes the reaction of the semiconductor device in accordance with input of the ultrasonic waves from the ultrasonic transducer.

Provided is an ultrasonic inspection device for inspecting a packaged semiconductor device, The ultrasonic inspection device including an ultrasonic transducer that is disposed to face the semiconductor device; a medium holding unit that is provided at an end of the ultrasonic transducer facing the semiconductor device and holds a medium through which ultrasonic waves are propagated; a stage that moves the position of the semiconductor device relative to the ultrasonic transducer; and an analysis unit that analyzes the reaction of the semiconductor device in accordance with input of the ultrasonic waves from the ultrasonic transducer.