An image forming apparatus includes a reader; an image former, provided below the reader, for forming an image on a sheet; a sheet discharge portion, provided between the reader and the image former, for discharging and stacking the sheet; an operating portion provided in a front side adjacent to the reader in the horizontal direction and slidable along a side of the reader; a sensor unit provided at a side of the reader in a outside of a slidable range of the operating portion, the sensor unit being can project a signal on the side of the reader and receiving a reflection wave of the signal to detect presence of the user in an area in the front side; and a controller for restoring a state of the apparatus from a sleeping state to a stand-by state in response to detection by the sensor unit.

An image forming apparatus includes a reader; an image former, provided below the reader, for forming an image on a sheet; a sheet discharge portion, provided between the reader and the image former, for discharging and stacking the sheet; an operating portion provided in a front side adjacent to the reader in the horizontal direction and slidable along a side of the reader; a sensor unit provided at a side of the reader in a outside of a slidable range of the operating portion, the sensor unit being can project a signal on the side of the reader and receiving a reflection wave of the signal to detect presence of the user in an area in the front side; and a controller for restoring a state of the apparatus from a sleeping state to a stand-by state in response to detection by the sensor unit.

Method of determining an overlay error between device layers of a multilayer semiconductor device using an atomic force microscopy system, wherein the semiconductor device comprises a stack of device layers comprising a first patterned layer and a second patterned layer, and wherein the atomic force microscopy system comprises a probe tip, wherein the method comprises: moving the probe tip and the semiconductor device relative to each other for scanning of the surface; and monitoring motion of the probe tip with tip position detector during said scanning for obtaining an output signal; during said scanning, applying a first acoustic input signal to at least one of the probe or the semiconductor device; analyzing the output signal for mapping at least subsurface nanostructures below the surface of the semiconductor device; and determining the overlay error between the first patterned layer and the second patterned layer based on the analysis.

Method of determining an overlay error between device layers of a multilayer semiconductor device using an atomic force microscopy system, wherein the semiconductor device comprises a stack of device layers comprising a first patterned layer and a second patterned layer, and wherein the atomic force microscopy system comprises a probe tip, wherein the method comprises: moving the probe tip and the semiconductor device relative to each other for scanning of the surface; and monitoring motion of the probe tip with tip position detector during said scanning for obtaining an output signal; during said scanning, applying a first acoustic input signal to at least one of the probe or the semiconductor device; analyzing the output signal for mapping at least subsurface nanostructures below the surface of the semiconductor device; and determining the overlay error between the first patterned layer and the second patterned layer based on the analysis.

A method of adjusting flaw detection sensitivity on an array ultrasonic probe comprises disposing a plate material P1 oppositely to the ultrasonic probe such that an upper surface of the plate material is disposed to be approximately parallel to an array direction of the transducers 11, or disposing a tubular material P2 oppositely to the ultrasonic probe such that an axial direction of the tubular material is disposed to be approximately parallel to the array direction of the transducers. Ultrasonic waves are transmitted from each transducer toward the upper surface of the plate material or an outer surface of the tubular material, and echoes are received from the bottom surface of the plate material or an inner surface of the tubular material on each transducer. Flaw detection sensitivity of each transducer is adjusted to substantially equalize intensity of an echo received on each transducer.

A method of adjusting flaw detection sensitivity on an array ultrasonic probe comprises disposing a plate material P1 oppositely to the ultrasonic probe such that an upper surface of the plate material is disposed to be approximately parallel to an array direction of the transducers 11, or disposing a tubular material P2 oppositely to the ultrasonic probe such that an axial direction of the tubular material is disposed to be approximately parallel to the array direction of the transducers. Ultrasonic waves are transmitted from each transducer toward the upper surface of the plate material or an outer surface of the tubular material, and echoes are received from the bottom surface of the plate material or an inner surface of the tubular material on each transducer. Flaw detection sensitivity of each transducer is adjusted to substantially equalize intensity of an echo received on each transducer.

A manufacturing method is used for an outer joint member of a constant velocity universal joint. The outer joint member includes a cup section having track grooves formed in its inner periphery, which are engageable with torque transmitting elements, and a shaft section formed at a bottom portion of the cup section. The manufacturing method includes welding the cup and shaft members by irradiating a beam to joining end portions of the cup and shaft members, causing an outer surface including the welded portion to be formed into a flat smooth surface by removal processing, irradiating ultrasonic waves to the flat smooth surface with one probe at an incident angle which prevents total reflection in a circumferential angle beam flaw detection method, and setting a focal point of the ultrasonic waves to positions from a surface to an inside of the welded portion, to thereby perform inspection.

A manufacturing method is used for an outer joint member of a constant velocity universal joint. The outer joint member includes a cup section having track grooves formed in its inner periphery, which are engageable with torque transmitting elements, and a shaft section formed at a bottom portion of the cup section. The manufacturing method includes welding the cup and shaft members by irradiating a beam to joining end portions of the cup and shaft members, causing an outer surface including the welded portion to be formed into a flat smooth surface by removal processing, irradiating ultrasonic waves to the flat smooth surface with one probe at an incident angle which prevents total reflection in a circumferential angle beam flaw detection method, and setting a focal point of the ultrasonic waves to positions from a surface to an inside of the welded portion, to thereby perform inspection.

A manufacturing method is used for an outer joint member of a constant velocity universal joint. The outer joint member includes a cup section having track grooves formed in an inner periphery of the cup section, which are engageable with torque transmitting elements, and a shaft section formed at a bottom portion of the cup section. The outer joint member is constructed by forming the cup section and the shaft section as separate members, and by welding a cup member forming the cup section and a shaft member forming the shaft section to each other. The manufacturing method at least includes welding the cup member and the shaft member by irradiating a beam to joining end portions of the cup member and the shaft member, and inspecting a welded portion formed in the welding by a plurality of ultrasonic flaw detection methods with one probe.

A manufacturing method is used for an outer joint member of a constant velocity universal joint. The outer joint member includes a cup section having track grooves formed in an inner periphery of the cup section, which are engageable with torque transmitting elements, and a shaft section formed at a bottom portion of the cup section. The outer joint member is constructed by forming the cup section and the shaft section as separate members, and by welding a cup member forming the cup section and a shaft member forming the shaft section to each other. The manufacturing method at least includes welding the cup member and the shaft member by irradiating a beam to joining end portions of the cup member and the shaft member, and inspecting a welded portion formed in the welding by a plurality of ultrasonic flaw detection methods with one probe.