The present invention discloses a sensor system for estimating respective amounts of different molecules in a biological liquid, and the sensor system includes: an electronic circuit module and a Shear Horizontal Surface Acoustic Wave (SH-SAW) sensor, wherein the electronic circuit module has more than two different impedance matching circuits for exciting and detecting a plurality of Surface Acoustic Waves (SAWs) with different frequencies, and the SH-SAW sensor has at least one transducer and a surface on which the plurality of SAWs propagate, and wherein the surface is covered with a probe to be bound with more than two different molecules.

Acoustic optical integrity detection system architectures and methods can be used to detect optical integrity of an optical component by detecting a discontinuity on and/or in the optical component (e.g., on the optical surface and/or within the bulk of the optical component). In some examples, integrity detection can be used to ensure safety compliance of an optical system, optionally including a laser. Acoustic integrity detection can utilize transducers (e.g., piezoelectric transducers) to transmit ultrasonic waves along an optical surface and/or through the thickness of an optical component. A discontinuity of the optical surface can interact with the transmitted wave causing attenuation, redirection and/or reflection of at least a portion of the transmitted wave. Portions of the transmitted wave energy after interaction with the discontinuity can be measured to determine discontinuity location, type, and/or severity.

A sound source device and a signal receiver are disposed at first and second ports of a target object, respectively. A sound of a specific frequency of the sound source device is introduced into the target object to generate a resonant sound wave. A computer simulates a signal generated when the resonant sound wave is received by the signal receiver and regarding the signal as reference information. The reference information comprises first data having characteristics of the resonant sound wave, and data having features of an imaginary defect formed on the target object. The features of the imaginary defect correspond to the characteristics of the resonant sound wave. When the target object has a real defect, the sound of the specific frequency of the sound source device is introduced into the target object. Features of the real defect are derived by comparing the first data with the second data.

Provided are a waveform analysis method and a waveform analysis device capable of preventing, in advance, a breakage accident during operation and preventing stoppage due to breakdown of machinery and performing efficient maintenance work by specifying a degraded part from among the parts that constitute the machinery. A waveform analysis device 30 is provided with; a signal analysis unit 31 for performing fast Fourier transform for a signal transmitted from a sensor 28 that detects a physical phenomenon in the machinery an impulse extraction unit 32 for extracting an impulse component from spectrum data generated by the signal analysis unit 31; a display unit 35 for displaying waveform data including the impulse component extracted by the impulse extraction unit 32; and a data editing unit 33 for editing, from data of a waveform including the impulse component displayed by the display unit 35, waveform data in a range selected via an input unit 36 by a worker, generating a graph displaying a frequency, a time, and the intensity of the impulse component, and displaying the graph on the display unit 35.

A method of automatically inspecting a weld bead deposited in a plurality of passes in a chamfer formed between two parts by performing the following steps: positioning at least one emission electromagnetic acoustic sensor on one side of the chamfer and at least one reception electromagnetic acoustic sensor on an opposite side of the chamfer, the ultrasound wave emission sensor being configured to emit Rayleigh surface waves; while depositing a pass, automatically moving the sensors to follow the movement of welding electrodes along the chamfer; activating the sensors while they are moving to enable the emission sensor to generate and emit Rayleigh waves towards the pass of the weld bead that is being deposited, the reception sensor receiving the ultrasound signals transmitted and/or reflected in said pass; and reiterating the operation for the entire pass of the weld bead.

A method and apparatus for inspecting a fusion joint is provided. The apparatus includes a processor, an ultrasound (“US”) probe in communication with the processor, and a database comprising classification rules. The processor is configured to generate an initial set of US scanning positions about the fusion joint based on information of at least one of the US probe and the fusion joint; measure, via the US probe, a US pulse-echo spectrum from at least two of the initial US scanning positions; compare each measured US pulse-echo spectrum with one or more known US pulse-echo spectrums; classify each measured US pulse-echo spectrum according to the classification rules; and evaluate an aggregate of measured US pulse-echo spectrums to determine if the fusion joint is defective.

Embodiments herein relate to systems and methods for detecting aeration properties in fluids using a vibration sensor. In an embodiment, a system for fluid aeration monitoring is included having a vibration sensor configured to be mounted along a fluid flow path, and a control circuit in signal communication with the vibration sensor. The control circuit can be configured to evaluate a signal received from the vibration sensor and calculate one or more aeration parameters based on signals from the vibration sensor. Other embodiments are also included herein.

A system for monitoring and identifying states of a semiconductor device, the system including at least one acoustic sensor for sensing acoustic emission emitted by at least one semiconductor device operating at a voltage of less than or equal to 220 V, the at least one acoustic sensor outputting at least one acoustic emission signal and a signal processing unit for receiving the at least one acoustic emission signal from the at least one acoustic sensor and for analyzing the at least one acoustic emission signal, the signal processing unit providing an output based on the analyzing, the output being indicative at least of whether the at least one semiconductor device is in an abnormal operating state with respect to a normal operating state of the semiconductor device.

Disclosed herein is a method for depth-profiling of samples including a target region including a lateral structural feature. The method includes projecting an optical pump pulse on a semiconductor device comprising a target region, such as to produce an acoustic pulse which propagates within the target region of the semiconductor device, wherein a wavelength of the pump pulse is at least two times greater than a lateral extent of a lateral structural feature of the semiconductor device along at least one lateral direction, projecting an optical probe pulse on the semiconductor device, such that the probe pulse undergoes Brillouin scattering off the acoustic pulse within the target region, detecting a scattered component of the probe pulse to obtain a measured signal, and analyzing the measured signal to obtain a depth-dependence of at least one parameter characterizing the lateral structural feature.

Embodiments herein generally relate to systems and methods to determine the composition, properties, and morphology of a liquid in a liquid handling structure. Aspects disclosed include exploiting spatiotemporal constraints of zero-group-velocity modes for non-contact, non-invasive, liquid sensing applications.