Described herein is a sensor for a virtually simultaneous measurement of transmission and/or forward scattering and/or remission and for a simultaneous measurement of the transmission and forward scattering or the transmission and remission of a liquid sample. Further described herein is a method for a virtually simultaneous measurement of transmission and/or forward scattering and/or remission and for a simultaneous measurement of the transmission and forward scattering or the transmission and remission of a liquid sample using a sensor according to the invention. Further described herein is a method for using the sensor according to the invention in order to determine the color properties of painting agents such as lacquers, dyes, pastes, and pigments or dilutions thereof.

An inspection system for detecting defects in a workpiece can include an illumination source for illuminating a first section of the workpiece with a patterned light, wherein the illumination source does not illuminate a second section of the workpiece. The inspection system further includes a feedback camera for imaging the first section and producing a first output, and a background camera for imaging the second section and producing a second output. A processor compares the first output with the second output, and a controller alters the patterned light that is output by the illumination source based on the comparison. This feedback control continues until the background is suitably homogeneous or camouflaged compared to the defect, such that the visibility and/or detectability of the defect is increased.

Disclosed is an illumination source apparatus comprising a high harmonic generation medium, a pump radiation source and a spatial filter. The pump radiation source emits a beam of pump radiation having a profile comprising no pump radiation in a central region of the beam and excites the high harmonic generation medium so as to generate high harmonic radiation. The pump radiation and the generated high harmonic radiation are spatially separated beyond the focal plane of the beam of pump radiation. The spatial filter is located beyond a focal plane of the beam of pump radiation, and blocks the pump radiation. Also disclosed is a method of generating high harmonic measurement radiation optimized for filtration of pump radiation therefrom.

An inspection system for detecting defects in a workpiece can include an illumination source for illuminating a first section of the workpiece with a patterned light, wherein the illumination source does not illuminate a second section of the workpiece. The inspection system further includes a feedback camera for imaging the first section and producing a first output, and a background camera for imaging the second section and producing a second output. A processor compares the first output with the second output, and a controller alters the patterned light that is output by the illumination source based on the comparison. This feedback control continues until the background is suitably homogeneous or camouflaged compared to the defect, such that the visibility and/or detectability of the defect is increased.

Aspects relate to mechanisms for enhancing the coupling of scattered light from a sample under test into a spectrometer. An optical device can include a reflective surface positioned apart from the sample and configured to receive a first portion of scattered light from the sample and to redirect the first portion of the scattered light back to one or more discrete spots on the sample in a non-random manner to produce redirected scattered light from the sample. The spectrometer may then be configured to receive coupled light from the sample including at least a portion of the redirected scattered light.

An apparatus for polymerase chain reaction (PCR) diagnosis for normalizing light source power and fluorescence power and an operating method thereof are disclosed.

An inspection system for detecting defects in a workpiece can include an illumination source for illuminating a first section of the workpiece with a patterned light, wherein the illumination source does not illuminate a second section of the workpiece. The inspection system further includes a feedback camera for imaging the first section and producing a first output, and a background camera for imaging the second section and producing a second output. A processor compares the first output with the second output, and a controller alters the patterned light that is output by the illumination source based on the comparison. This feedback control continues until the background is suitably homogeneous or camouflaged compared to the defect, such that the visibility and/or detectability of the defect is increased.

A lighting device includes: a light emitting device including a plurality of light emitting elements arranged in curve having a first curvature; and a honeycomb member having an extendable and contractible honeycomb structure, arranged in curve having a second curvature larger than the first curvature, in an emission direction of light emitted from the light emitting device.

Described herein is a sensor for a virtually simultaneous measurement of transmission and/or forward scattering and/or remission and for a simultaneous measurement of the transmission and forward scattering or the transmission and remission of a liquid sample. Further described herein is a method for a virtually simultaneous measurement of transmission and/or forward scattering and/or remission and for a simultaneous measurement of the transmission and forward scattering or the transmission and remission of a liquid sample using a sensor according to the invention. Further described herein is a method for using the sensor according to the invention in order to determine the color properties of painting agents such as lacquers, dyes, pastes, and pigments or dilutions thereof.

Implementations disclosed describe, among other things, a system and a method of using a wafer inspection system that includes a plurality of inspection heads configured to concurrently inspect a separate region of a plurality of regions of a wafer. Each inspection head includes an illumination subsystem to illuminate a corresponding region of the wafer, a collection subsystem to collect a portion of light reflected/scattered from the corresponding region of the wafer. Each inspection head further includes a light detection subsystem to detect the collected light and generate one or more signals representative of a state of the corresponding region of the wafer. The wafer inspection system further includes a processing device configured to determine, using the one or more signals received from each of the inspection heads, the quality of the wafer.