Spectral data such as a CARS spectrum of a sample is acquired at high speed by reducing the amount of data. During scan by emission light focused and emitted onto the sample, the exposed state of a detection unit of a spectroscope that divides light generated from the sample is continued, thereby acquiring spectral data obtained by summing spectra generated at a plurality of positions in the sample.

Provided is a microscope provided with: a scanner that scans an excitation beam coming from a light source; an objective optical system that focuses the scanned excitation beam onto a sample and that collects fluorescence generated at individual scanning positions in the sample; a detector that detects the collected fluorescence; a light blocking member that is disposed between the detector and the system and that partially blocks the collected fluorescence; a switching portion that switches the positional relationship between the member and a light-focusing point of the excitation beam in the sample between an optically conjugate positional relationship, in which an in-focus fluorescence generated at the light-focusing point passes through the member, and a non-conjugate positional relationship, in which the in-focus fluorescence is blocked by the member; and a computing portion that computes a difference between fluorescence signals acquired by the detector in the two positional relationships.

A wafer defect inspection system is disclosed, and comprises a line light source, a camera and a processor, wherein the processor is configured to control the line light source to provide an inspection light to be incident on a wafer, wherein an included angle between the inspection light and the surface of the wafer ranges from 45 to 90. After incidence on the wafer, the inspection light travels inside the wafer according to the principle of total reflection, and when encountering a crack, part of the inspection light exits from the surface of the wafer through the crack. Moreover, the processor controls the camera to obtain a wafer image containing at least one defect feature, and after processing the wafer image into an inspection wafer image, compares the wafer image with a reference wafer image, so as to know the at least one defect feature.

An inspection apparatus for the side surface of a cylindrical battery according to an embodiment of the disclosure includes a conveyor, an imaging case, an illumination unit located inside the imaging case and configured to emit light while the cylindrical battery product is conveyed along the conveyance path, a line scan camera module located outside the imaging case and configured to continuously capture images of the cylindrical battery product; and a mirror module configured to reflect a blind spot of the cylindrical battery product.