A mechanism is provided for identifying a wire-pull test location on a wire of a microelectronic package. A first distance between a first terminating location of the wire on the microelectronic package and a second terminating location of the wire on the microelectronic package is determined. Based on the first distance, a second distance from either the first terminating location or the second terminating location is determined as the wire-pull test location for testing a strength of a connection of the wire to at least one of the first terminating location or the second terminating location. An adjustment is performed such that a visual guide is oriented on the wire at the wire-pull test location.

A testing apparatus for torque off weld stud testing has a socket to receive a weld stud welded to a metal sheet for testing strength of the weld. A stopper is received in the socket indexing the weld stud. A nut locks the stopper in position to enable repeated socket indexing to like weld studs.