The robot system includes a robot having an arm which is provided, on its tip, with two claws which are driven by a servo motor. According to this robot system, a relative position of the two claws is detected when the two claws apply a load of a predetermined force to a welded part welded to a workpiece. The deviation between the detected relative position and a predetermined reference relative position is calculated. The workpiece is determined to be of a good quality or poor quality by comparing the calculated deviation to a predetermined threshold value.

An apparatus and method for measuring broken spot weld artifacts has a framework for supporting a light and a plurality of cameras for acquiring controlled images of a specimen with minimal distortion and parallax. The framework holds the specimen flat and in a reproducible position, controlling movement while imaging. The image data is received in a computer programmed with image processing software capable of isolating and measuring the artifacts. A calibration standard is used to correct for aberrations.

A symmetrical, flat laminate structure used to minimize variables in a test structure to experimentally gauge white bump sensitivity to CTE mismatch is disclosed. The test structure includes a flat laminate structure. The method of using the test structure includes isolating a cause of a multivariable chip join problem that is adversely impacted by warpage and quantifying a contribution of the warpage, itself, in a formation of the multivariable chip join problem.

A fusion bead testing device is provided for testing the strength of a fusion bead removed from a pipe joint. The testing device comprises a first pressing means for exerting a force against the fusion bead. If the fusion bead splits as a result of the applied force then the fusion bead fails a quality control test and the fusion bead and consequently the pipe joint from which the bead was removed are deemed too weak. The fusion bead testing apparatus comprises an automatic split detection device for detecting a split in the bead.

A symmetrical, flat laminate structure used to minimize variables in a test structure to experimentally gauge white bump sensitivity to CTE mismatch is disclosed. The test structure includes a flat laminate structure. The method of using the test structure includes isolating a cause of a multivariable chip join problem that is adversely impacted by warpage and quantifying a contribution of the warpage, itself, in a formation of the multivariable chip join problem.

A detection device includes a frame body and a main pipe positioning assembly, a branch pipe positioning assembly, and a first driving assembly disposed on the frame body. One side of the frame body is provided with an opening. The branch pipe positioning assembly is disposed inside the opening. The first driving assembly adjusts the branch pipe positioning assembly, so that the branch pipe positioning assembly is adapted to positions of the two branch pipes. During detection, the branch pipes are located in the opening, the main pipe positioning assembly connects two ends of the main pipe, and the branch pipe positioning assembly connects the two branch pipes. Two limiting members are slidably disposed on the frame body to open and close the opening, and the limiting members abut against an outer wall of the main pipe, such that the main pipe is located inside or outside the opening.

A system and method for evaluating a bond is provided. The system uses an underwater spark discharge to generate a compression wave in a first vessel containing a liquid. The system further includes a second vessel in which a vacuum is pulled to hold the first vessel against a bonded structure being inspected. The compression wave is directed to propagate from the liquid into the bonded structure to apply a known force to the bond being inspected.

A method of cleaning solder from the jaws of a solder ball test device including the steps of heating a gas to a temperature above the melting temperature of the solder and directing the heated has over the jaws of a solder ball test device to remove solder from the jaws, and an apparatus for carrying out the method.

A first measured value of a specific physical quantity at a target portion is correlated with a damage evaluation index to calculate a damage degree corresponding to the first measured value. The specific physical quantity is measured at least once at a position corresponding to the first measurement position in another time period having a different usage elapsed time from that of the first measurement, and these second and subsequent measured values are correlated with damage degrees calculated based on temporal changes corresponding to the second and subsequent measurements. A new damage evaluation index is approximately calculated based on a relationship between the first, second, and subsequent measured values and the damage degrees corresponding to the first, second, and subsequent measured values.

A method for welding a workpiece with a vision guided welding platform. The welding platform comprises a welding tool, and a camera for guiding the movement of the welding tool from a start point to an end point. The method includes the steps of adjusting a focal length of the camera such that a focal plane of the camera is located on a surface of the workpiece and obtaining a surface image of the workpiece. The method further includes the steps of determining a current focal length of the camera, determining a corrected pixel length of a pixel in the surface image and determining the number of pixels between the start point and the end point of each movement of the welding tool. Using the corrected pixel length, a distance between the start and end points is determined and the welding tool is guided to move therebetween.