A system and method facilitates measuring physical properties of an electrode specimen. Accordingly, it is possible to suppress a slipping phenomenon of an electrode specimen and prevent disconnection of a gripping portion during a tensile test for the electrode specimen by forming a tape on the gripping portion of the electrode specimen and forming a grid pattern on the surface of a pressing jig.

An electrochemical sensor comprising a probe immersible in a measured medium and having at least two electrodes of a first electrically conductive material and at least one probe body of a second, electrically non-conductive material. The electrodes are at least partially embedded in the probe body and insulated from one another by the probe body, wherein the at least two electrodes are embodied of at least one conductive material and the probe body of at least one electrically insulating ceramic, wherein the electrodes are embodied of thin, measuring active layers of a conductive material and sit in an end face of the probe body of a ceramic material, and wherein the electrodes are electrically contacted via connection elements extending through the probe body.

A test apparatus and method for applying one or more tensile loads to a sample and for testing attributes of the sample exposed to the one or more tensile loads. The test apparatus includes a housing that has a plurality of interconnected sides that contain the sample during testing and provide a rigid support structure to offset the tensile loads applied to the sample. The test apparatus includes one or more force application assemblies that are each configured to apply a particular tensile load on the sample. Each of the force application assemblies includes an anchor for securing the sample to the housing, a connector attached to an opposite side of the sample from the corresponding anchor, and a tension rod assembly configured to apply the tensile load between the housing and the sample.

A test sample is provided for measuring tensile strength of an adhesive bond between two identical substrates. Each identical substrate has first and second identical ends. An end from one substrate is aligned with an end from the other substrate so that they completely overlap and abut each other. Adhesive is applied to the abutting ends. An alignment fixture aligns the substrates while the adhesive cures. Each substrate includes through holes for mounting to a test machine without the use of special grips. After a test sample has been tested to failure, a new test sample can be quickly made by reversing the orientation of the substrates by 180 degrees and using their opposite ends to make a new test sample. After both ends of a substrate have been used for testing, both ends can be cleaned and the substrates reused for new test samples.

A pull-test jig for microchips and a test apparatus and method using the same are disclosed. The microchip pull-test jig comprises a sample fixer provided, at an upper surface thereof, with a sample seat configured to fix a substrate to which a microchip is connected by a solder, a stud support disposed over the sample fixer and formed with a stud hole at a position corresponding to the microchip, a stud fixed to an upper surface of the microchip through the stud hole, and a stud holder separably coupled to the stud.