System and method for imaging an integrated circuit (IC). The imaging system comprises an x-ray source including a plurality of spatially and temporally addressable electron sources, an x-ray detector arranged such that incident x-rays are oriented normal to an incident surface of the x-ray detector and a three-axis stage arranged between the x-ray source and the x-ray detector, the three-axis stage configured to have mounted thereon an integrated circuit through which x-rays generated by the x-ray source pass during operation of the imaging system. The imaging system further comprises at least one controller configured to move the three-axis stage during operation of the imaging system and selectively activate a subset of the electron sources during movement of the three-axis stage to acquire a set of intensity data by the x-ray detector as the three-axis stage moves along a three-dimensional trajectory.

A sample holder for holding a sample during an X-ray imaging process includes a sample placement surface on which the sample is placed for positioning the sample in a depth direction of the sample holder. The sample holder also includes a first alignment portion for aligning the sample in a width direction of the sample holder, and a second alignment portion for aligning the sample in a height direction of the sample holder.

The present invention relates to an X-ray fluorescence, XRF, spectrometer, for measuring X-ray fluorescence emitted by a target, wherein the XRF spectrometer comprises an X-ray tube with an anode that is emitting a divergent X-ray beam, a capillary lens that is configured to focus the divergent X-ray beam on the target, an aperture system that is positioned between the anode of the X-ray tube and the capillary lens and comprises at least one pinhole, and a detector that is configured for detecting X-ray fluorescence radiation emitted by the target, wherein the at least one pinhole is configured for being inserted into the divergent X-ray beam and for reducing a beam cross section of the divergent X-ray beam between the anode and the capillary lens.

The present invention further relates to an aperture system for a spectrometer, to the use of an aperture system for adjusting the focal depth of a spectrometer and to an method for adjusting the focal depth of as spectrometer.

A radiation image acquisition system of an aspect of the present invention includes a radiation source emitting radiation toward an object, a holding unit holding the object, a wavelength conversion member generating scintillation light in response to incidence of the radiation emitted from the radiation source and transmitted through the object, a first imaging means condensing and imaging scintillation light emitted from an incidence surface of the radiation of the wavelength conversion member, a second imaging means condensing and imaging scintillation light emitted from a surface opposite to the incidence surface of the wavelength conversion member, a holding unit position adjusting means adjusting the position of the holding unit between the radiation source and the wavelength conversion member, and an imaging position adjusting means adjusting the position of the first imaging means.

An x-ray inspection system includes a cabinet including an x-ray source, a sample support supporting a sample to be inspected, and an x-ray detector. The system further includes an air mover configured to force air into the cabinet through an air inlet in the cabinet above the sample support. The air mover and cabinet are configured to force air through the cabinet from the air inlet past the sample support to an air outlet in the cabinet below the sample support. The cabinet may be constructed to provide an x-ray shield. The x-ray inspection system can be used in a clean room environment to inspect items such as semiconductor wafers.

A system includes a component inspection system having a radiation source configured to generate radiation and a radiation detector configured to detect the radiation after the radiation passes through components to be inspected. The system also includes a fixture configured to receive multiple reels that are each configured to receive a tape in or on which the components are located. The fixture includes a base configured to be secured to a support, a shaft, one or more motors mounted to the shaft and configured to rotate the reels, and one or more joints coupling the shaft and base. The one or more joints are configured to allow (i) rotation of the shaft about a longitudinal axis of the shaft to change an orientation of the shaft with respect to the base and (ii) rotation of the shaft to change a direction at which the shaft extends away from the base.

An X-ray inspection apparatus includes an X-ray source, an X-ray detector, and a stage. A dose rate calculation unit of a control section calculates a dose rate at any position in an inspection space, a stage face information storage unit 32 stores stage face information, an irradiation history monitoring unit monitors a movement locus, a stage face cumulative irradiation dose calculation unit calculates cumulative irradiation dose distribution data, a stage face imaging range calculation unit calculates a stage face imaging range of the X-ray detector, and a dose distribution image display control unit extracts the cumulative irradiation dose distribution data in an imaging range and displays an image thereof.

A pattern-measuring apparatus and a semiconductor-measuring system are provided which are able to obtain an evaluation result for suitably selecting processing with respect to a semiconductor device. In particular, there is proposed a pattern-measuring apparatus including an arithmetic device which compares a circuit pattern of an electronic device with a reference pattern, in which the arithmetic device classifies the circuit pattern in processing unit of the circuit pattern on the basis of a comparison of a measurement result between the circuit pattern and the reference pattern with at least two threshold values.

An object of the present invention is to provide a pattern-measuring apparatus and a semiconductor-measuring system which are able to obtain an evaluation result for suitably selecting processing with respect to a semiconductor device. In the present invention for attaining the object described above, there is proposed a pattern-measuring apparatus including an arithmetic device which compares a circuit pattern of an electronic device with a reference pattern, in which the arithmetic device classifies the circuit pattern in processing unit of the circuit pattern on the basis of a comparison of a measurement result between the circuit pattern and the reference pattern with at least two threshold values.

The invention relates to a method for testing an electronic component for defects, by examining the electronic component in a production line by means of automatic optical inspection; determining the coordinates of regions in which an examination using automatic optical inspection is not possible; transmitting the coordinates of these regions from the production line to a computer; transporting the electronic component from the production line into an X-ray device which is arranged outside the production line, for non-destructive material testing; transmitting the coordinates of the regions from the computer to this X-ray device; examining the electronic component by means of the X-ray device only in the regions in which an examination using automatic optical inspection is not possible; transmitting the results of the examination in the X-ray device to the computer; returning the electronic component to the production line if the result indicates that it is not defective.