Patent classifications
G01N2223/6113
X-RAY INSPECTION APPARATUS FOR INSPECTING SEMICONDUCTOR WAFERS
An x-ray inspection system including an x-ray source, a sample support for supporting a sample to be inspected, an x-ray detector, a sample positioning assembly including a first positioning mechanism for moving the sample support along a first axis towards and away from the x-ray source, a proximity sensor fixed to the x-ray source configured to provide a measurement of distance between the x-ray source and a surface of a sample on the sample support, and a controller connected to the proximity sensor. Measurements from the proximity sensor can be used in image processing calculations and to prevent collision between a sample and the x-ray source.
X-RAY INSPECTION APPARATUS FOR INSPECTING SEMICONDUCTOR WAFERS
An x-ray inspection system includes a cabinet including an x-ray source, a sample support supporting a sample to be inspected, and an x-ray detector. The system further includes an air mover configured to force air into the cabinet through an air inlet in the cabinet above the sample support. The air mover and cabinet are configured to force air through the cabinet from the air inlet past the sample support to an air outlet in the cabinet below the sample support. The cabinet may be constructed to provide an x-ray shield. The x-ray inspection system can be used in a clean room environment to inspect items such as semiconductor wafers.
MEASURING METHOD AND MEASURING DEVICE
According to one embodiment, a measuring method includes forming a partition including a lower portion provided on a base and an upper portion protruding from a side surface of the lower portion, acquiring a plurality of images generated by detecting secondary electrons that occur by emitting electron beams including primary electrons toward the partition from a plurality of second directions inclined from a first direction orthogonal to the base, analyzing the acquired plurality of images, and measuring a first angle for indicating a ratio of an amount of protrusion at which an end portion of the upper portion protrudes from the side surface of the lower portion to a length of the lower portion in the first direction, based on a result of the analysis.
X-ray radioscope
An X-ray radioscope includes: an X-ray source that radially emits X-ray; a sample holder configured to hold a sample, the sample holder placed in front of the X-ray source in order for the sample to be irradiated by X-ray emitted from the X-ray source; a planar CCD including CCDs planarly arranged, the planar CCD being placed away from the sample holder to detect X-ray transmitted through the sample such that the planar CCD obtains X-ray transmission image of the sample; and a movement unit configured to move the planar CCD and the sample holder relative to each other in synchronization with obtaining the X-ray transmission image by the planar CCD, wherein the planar CCD has 500 or more pixels along the movement direction relative to the sample.
SOLDER MATERIAL WITH CONTRAST AGENT
An electrical connection material having a contrast agent infused within, and related systems and methods of detection thereof, are disclosed herein. Computer electronics such as printed circuit boards have electronic components attached to a substrate by an electrical connection material. The electrical connection material has at least one component infused with a contrast agent. The contrast agent is of a concentration to provide a visual distinction or highlight when imaged by an inspection system, such as an x-ray system of computed tomography (CT) scanning system. The presence of the contrast agent demonstrates that not all of residual electrical connection material has been cleaned away from the printed circuit board after manufacture.
System and method for image segmentation from sparse particle impingement data
Described are systems and methods for segmenting images which comprise impinging a substrate surface with a particle beam at each of a plurality of sensing locations which define a subset of locations within an area of interest of the substrate surface. An intensity value associated with post-impingement particles resulting from the impinging is measured and the measured intensity based on the intensity value of the sensing location is calculated. For each of a plurality of estimated locations which define a further subset of said area of interest and a corresponding estimated intensity based on at least one of the following corresponding to one or more locations proximal to the estimated location is calculated. The plurality of estimated locations is each segmented based on the corresponding estimated intensity, each of the sensing locations, and based on the corresponding measured intensity, to correspond to one of the plurality of features.