A multi-electron beam inspection apparatus includes a multi-detector that includes a plurality of detection sensors each of which detects a secondary electron beam emitted due to that a target object is irradiated with a primary electron beam individually preset in multiple secondary electron beams emitted because the target object is irradiated with multiple primary electron beams, a reference image data generation circuit that generates reference image data of a position irradiated with each primary electron beam, based on design data serving as a basis of the pattern formed on the target object, a synthesis circuit that synthesizes, for each primary electron beam, the reference image data of the position irradiated with a primary electron beam concerned and portions of reference image data of positions irradiated with other primary electron beams different from the primary electron beam concerned, and a comparison circuit that compares synthetic reference image data having been synthesized, and secondary electron image data based on a value detected by the detection sensor which detects a secondary electron beam due to irradiation with the primary electron beam concerned.

In one embodiment, an X-ray inspection system may capture one or more X-ray images for samples of interest processed by a first tool. The X-ray inspection system may be inline with the first tool and have an inspection speed of 300 mm.sup.2 per minute or greater. The system may determine, in real-time, metrology information related to the samples of interest based on the X-ray images. The metrology information may indicate that a sample parameter associated with the samples of interest is outside of a pre-determined range. The system may provide instructions or data to one or more of the first tool or one or more second tools to adjust process parameters associated with the respective tools based on metrology information. The adjusted process parameters may reduce a processing error probability, of the respective tool for processing subsequent samples, related to the sample parameter being outside of the pre-determined range.

An electron beam inspection apparatus according to one aspect of the present invention includes an image acquisition mechanism to acquire a secondary electron image by scanning a substrate, on which a figure pattern is formed, with an electron beam, and detecting a secondary electron emitted due to irradiation with the electron beam by the scanning, a resize processing unit to perform, using design pattern data being a basis of the figure pattern, resize processing on the figure pattern to enlarge its size in a scan direction of the electron beam, a first developed image generation unit to generate, using the design pattern data which has not been resized, a first developed image by developing an image of a design pattern of a region corresponding to the secondary electron image, a second developed image generation unit to generate, using partial patterns enlarged by the resize processing in the figure pattern having been resized, a second developed image by developing an image of partial patterns in a region corresponding to the secondary electron image, a map generation unit to generate a pseudo defect candidate pixel map which can identify a pseudo defect candidate pixel that has no pattern in the first developed image and has a pattern in the second developed image, a reference image generation unit to generate a reference image of the region corresponding to the second electron image, and a comparison unit to compare, using the pseudo defect candidate pixel map, the second electron image with the reference image of the region corresponding to the second electron image.

Method for detecting at least one critical defect in a ceramic rolling element providing the steps of capturing a plurality of two-dimensional digital radiographic images of the rolling element; digitally filtering each radiographic image; delineating, on the basis of the filtered image, at least one region liable to comprise the critical defect; constructing stereoscopically a virtual model of the rolling element having the region; comparing the dimensions of the delineated region with a plurality of predetermined threshold values, and, when the dimensions are greater than the threshold values, generating an alarm signal.

An image is obtained by using a charged particle beam, and a design layout information is generated to select patterns of interest. Grey levels among patterns can be compared with each other to identify abnormal, or grey levels within one pattern can be compared to a determined threshold grey level to identify abnormal.

A method of detecting defects on a surface or interface of a part is provided. The method includes: providing data from an X-ray scan of the part; processing the scan data to obtain an original 3D or 2D model of a surface or interface topology of the part; and filtering the original 3D or 2D model of the surface or interface topology to identify deviations from the expected surface or interface topology of the part. The identified deviations may be produced by surface or interface defects on the part.

Aspects of the disclosure are directed to an analysis of a material of a component. A radiation source is activated to transmit radiation to the component. A beam pattern is obtained based on the component interfering with the radiation. The beam pattern is compared to a reference beam pattern. An anomaly is detected to exist in the material when the comparison indicates a deviation between the beam pattern and the reference beam pattern.

An image quality indicator (IQI) system includes a crack IQI. The crack IQI includes a penetrameter having a first body and a second body disposed in the first body. The first body has a first body inner surface defining a first body hole. The second body has a second body outer surface disposed adjacent the first body inner surface to form an interface having an interface gap. The IQI system also includes a radiation source spaced from the penetrameter and configured to transmit radiation rays to the penetrameter. The IQI system also includes a radiation detector disposed adjacent the penetrameter and configured to generate an IQI radiographic image indicative of an interface gap characteristic of the interface gap.

An image is obtained by using a charged particle beam, and a design layout information is generated to select patterns of interest. Grey levels among patterns can be compared with each other to identify abnormal, or grey levels within one pattern can be compared to a determined threshold grey level to identify abnormal.

A method of fabricating a reference blade for calibrating non-destructive inspection by tomography of real blades of similar shapes and dimensions, including making a three-dimensional blank out of resin, creating housings in the thickness of the blank at predetermined locations, and introducing in each of the housings a cylinder including an artificial defect or a real defect in order to obtain the reference blade.