According to one embodiment, an ultrasonic sensor includes first and second elements. The first elements emit a first ultrasonic wave. A first operation is performed. The first operation includes processing based on a first signal. The first signal corresponds to a first reflected wave of the first ultrasonic wave and is obtained from N.sub.R of the second elements (N.sub.R being an integer of 3 or more) included in the second elements. The first elements are arranged in a first direction at a first pitch p.sub.T. The first pitch p.sub.T is in the first direction. The N.sub.R second elements are arranged at a pitch of the second elements. A component in the first direction of the pitch of the second elements is a second pitch p.sub.R. p.sub.R/p.sub.T is not less than 0.97 times and not more than 1.03 times (N.sub.R+j)/N.sub.R. j is not n.Math.N.sub.R/m.

A method of non-destructively inspecting an adhesively bonded assembly of first, second, and third materials includes generating guided waves in the adhesively bonded assembly and establishing a dispersion curve plot in a first reference frame on the basis of receiving the guided waves. The method further includes comparing the dispersion curve plot with a plurality of reference dispersion curves established in the first reference frame, each of the reference dispersion curves being obtained by generating guided waves in a reference adhesively bonded assembly. Finally, the method includes estimating at least one of the thicknesses of the materials in the adhesively bonded assembly under inspection.

The present invention provides a method for inspecting a material to be inspected using ultrasound waves, the method including the following step 201 to step 301, in which step 201 is performed in a condition where: the surface temperature of a material under inspectionatmospheric temperature >2 C., and inspection using ultrasound waves in step 301 satisfies: a refractive attenuation rate 1.5%. Step 201: blowing a fluid from a blowing port onto the material to be inspected. Step 301: inspecting the material to be inspected using the ultrasound waves after step 201 or at the same time as the step 201.

A method of additive manufacturing a part on a build plate includes additive manufacturing at least a first layer of the part on the build plate, supplying a series of frequencies to the build plate from a resonate probe connected to the build plate, processing a received response from an ultrasonic detector connected to the build plate, determining a series of resonant frequencies of the build plate and a corresponding series of peak intensities from the received response, comparing the resonant frequencies and the corresponding peak intensities to a set of reference resonant frequencies and a corresponding set of reference peak intensities, respectively, calculating an intensity difference between a peak intensity and a reference peak intensity or a frequency difference between a resonant frequency and a reference resonant frequency, and additive manufacturing a subsequent layer of the part if the intensity difference and the frequency difference are below a threshold.

One embodiment of the present disclosure set forth a resonator device for generating a resonance map of a surface. The resonator device includes an actuator mechanism that vibrates the surface. The resonator device further includes one or more sensors that detect a deflection of the surface responsive to the actuator mechanism vibrating the surface. The resonator device further includes a processor. The processor is configured to generate the resonance map based on the detected deflection.

A signal is sent into a first surface of a structure at an angle relative to the first surface of the structure using a transducer array, wherein the structure has a second surface with a portion non-parallel to the first surface. An ultrasound response signal is formed at the portion of the second surface of the structure. The ultrasound response signal is received at the transducer array.

An ultrasonic probe (1) sends out ultrasound waves to a steel sheet (100) obliquely at a plurality of angles, using transmission signals provided from a transmission signal processing unit (3a). In addition, the ultrasonic probe (1) receives echoes corresponding to the plurality of angles from the steel sheet (100). A reception signal processing unit (3b) determines amplitudes of the echoes received by the ultrasonic probe (1) and corresponding to the plurality of angles, and periods of time from when the ultrasound waves are sent out until the echoes are received, as reception times, and identifies a location of a flaw (101) in the steel sheet (100) from the reception times and a ratio between the amplitudes.

A method of non-destructively inspecting an adhesively bonded assembly of first, second, and third materials includes generating guided waves in the adhesively bonded assembly and establishing a dispersion curve plot in a first reference frame on the basis of receiving the guided waves. The method further includes comparing the dispersion curve plot with a plurality of reference dispersion curves established in the first reference frame, each of the reference dispersion curves being obtained by generating guided waves in a reference adhesively bonded assembly. Finally, the method includes estimating at least one of the thicknesses of the materials in the adhesively bonded assembly under inspection.

An apparatus for measuring a crystal grain size of a steel plate according to an embodiment of the present invention may comprises: an ultrasound generating unit for applying ultrasound to one point of a steel sheet; an ultrasound receiving unit for receiving propagated ultrasound at two points spaced different distances apart from the one point of the steel sheet; and a crystal grain size calculating unit for calculating an average crystal grain size of the steel sheet according to intensities of the ultrasound propagated to the two points and an attenuation coefficient according to a distance between the two points. The apparatus can calculate an attenuation coefficient, regardless of a change of surface characteristics, such as surface reflectance, surface roughness, or the like.

A tapping device suitable for use on tiles, bricks, floors, and walls is disclosed. The tapping device includes a pulse generator, a controller, and a plurality of push-pull solenoids, wherein the pulse generator is electrically connected to the controller. The controller includes a plurality of output pins and each output pin is respectively connected to each of the plurality of push-pull solenoids. The controller receives a square wave signal from the pulse generator and sequentially outputs a high potential signal at each output pin, and thus each push-pull solenoid sequentially extends and retracts to tap an adjacent floor or wall on the surface.