Acoustically mediated pulsed radiation sources, phased arrays incorporating the radiation sources, and methods of using the radiation sources and phased arrays to generate electromagnetic radiation via magnetic dipole emission are provided. The radiation sources are based on a superlattice heterostructure that supports in-phase magnetic dipole emission from a series of magnetic insulator layers disposed along the length of the heterostructure.

A method for determining the state of at least one sensor, the method using a first electromechanical transducer and a second electromechanical transducer that are coupled to a substrate, and a non-linear electrical circuit connected between the second electromechanical transducer and the sensor, the method comprising the steps of: applying an electrical signal at a first amplitude to the terminals of the first electromechanical transducer, and determining a first set of values of a parameter characteristic of the electrical impedance of the first electromechanical transducer in response to the application of the electrical signal; applying the electrical signal at a second amplitude to the terminals of the first electromechanical transducer, and determining a second set of values of the parameter characteristic of the impedance; measuring a difference between the first set of values and the second set of values; determining a state of the sensor on the basis of the difference between the first set of values and the second set of values.

A method and system for detecting imperfections on a surface of a touchscreen of an electrical device, comprising: swiping a test object, such as a fingertip, a fingernail or a pin, along at least a portion of the touchscreen; producing, by the touchscreen, an electric signal indicative of the test object's contact with the touchscreen; receiving an acoustic signal by an acoustic sensor, during the swipe of the test object along the touchscreen; analyzing, by a processor, at least one of the electric signal and received acoustic signal; and determining existence of imperfections on the touchscreen's surface based on the analysis.

A method and system for detecting imperfections on a surface of a touchscreen of an electrical device, comprising: swiping a test object, such as a fingertip, a fingernail or a pin, along at least a portion of the touchscreen; producing, by the touchscreen, an electric signal indicative of the test object's contact with the touchscreen; receiving an acoustic signal by an acoustic sensor, during the swipe of the test object along the touchscreen; analyzing, by a processor, at least one of the electric signal and received acoustic signal; and determining existence of imperfections on the touchscreen's surface based on the analysis.

The invention relates to a DC electrical power supply source including a protective housing and electrical energy storage devices disposed in the protective housing. The storage devices are connected electrically in series by way of interconnection elements. There is an acoustic sensor configured to measure ultrasounds and a filling medium disposed in the housing. The filling medium exhibits a homogeneous acoustic impedance and forms a continuous acoustic link between the interconnection elements and the acoustic sensor.

A system for semiconductor manufacturing that uses ultrasonic waves for estimating and monitoring a remaining service lifetime of a consumable element is provided. A consumable element comprises a front side arranged inside a process chamber and a back side, opposite the front side, arranged outside the process chamber. An ultrasonic transducer is arranged on the back side of the consumable element, and directed towards the front side of the consumable element. A monitoring unit is configured to estimate and monitor a remaining service lifetime of the consumable element using the ultrasonic transducer. A method for estimating and monitoring the remaining service lifetime of the consumable element using ultrasonic waves is also provided.

An inspection device includes an oscillator for generating ultrasonic waves toward a first connector, and a vibration receiver for receiving vibrations generated in the first connector. The inspection device includes a vibration controller for analyzing the vibrations received by the vibration receiver. The vibration controller detects a resonance frequency by converting, by Fourier transform, the vibrations received by the vibration receiver. The vibration controller determines an insertion amount of the first connector into the second connector, based on the detected resonance frequency.

Various embodiments provide systems and methods for detecting defects in components of a fuel cell. Embodiment methods and systems for detecting a defect in an interconnect for a fuel cell system include thermally exciting the interconnect using optical radiation and/or inductive stimulation, detecting a thermal response of the interconnect, and based on the thermal response, determining the presence or absence of a defect in the interconnect, such as a lateral or through crack in the interconnect.

A system and method for the acoustic detection of cracks in a semiconductor substrate is disclosed. In one example, the system includes a force generating unit configured to apply a force onto the semiconductor substrate, a detector unit comprising a resonating indenter and an acoustic emission sensor coupled to the resonating indenter, and an evaluation unit configured to evaluate acoustic signals detected by the detector unit and configured to determine whether a crack has occurred based on the detected signals. The resonating indenter is configured to contact the semiconductor substrate at a lateral distance from the force generating unit, and wherein the force generating unit and the resonating indenter are configured to contact the semiconductor substrate on the same side.

Provided is an ultrasonic inspection device for inspecting a packaged semiconductor device, The ultrasonic inspection device including an ultrasonic transducer that is disposed to face the semiconductor device; a medium holding unit that is provided at an end of the ultrasonic transducer facing the semiconductor device and holds a medium through which ultrasonic waves are propagated; a stage that moves the position of the semiconductor device relative to the ultrasonic transducer; and an analysis unit that analyzes the reaction of the semiconductor device in accordance with input of the ultrasonic waves from the ultrasonic transducer.