An endoscopic imaging system for use in a light deficient environment includes an imaging device having a tube, one or more image sensors, and a lens assembly including at least one optical elements that corresponds to the one or more image sensors. The endoscopic system includes a display for a user to visualize a scene and an image signal processing controller. The endoscopic system includes a light engine having an illumination source generating one or more pulses of electromagnetic radiation and a lumen transmitting one or more pulses of electromagnetic radiation to a distal tip of an endoscope.

A surgical visualization feedback system is disclosed. The surgical visualization feedback system comprises an emitter assembly configured to emit electromagnetic radiation toward an anatomical structure. The emitter assembly comprises a structured light emitter configured to emit a structured light pattern on a surface of the anatomical structure and a spectral light emitter configured to emit spectral light capable of penetrating the anatomical structure. The surgical visualization feedback system further comprises a waveform sensor assembly configured to detect reflected electromagnetic radiation corresponding to the emitted electromagnetic radiation and a control circuit in signal communication with the waveform sensor assembly. The control circuit is configured to receive an input corresponding to a selected surgical procedure, determine an identity of a targeted structure within the anatomical structure based on the selected surgical procedure and the reflected electromagnetic radiation, and confirm the determined identity of the targeted structure through a user input.

An image sensor assembly includes at least one upconverter configured to detect light in a NIR waveband that is received from an object to be imaged and generate, based on the detected light, upconverted light that is outside of the NIR waveband; and at least one image sensor configured to detect the upconverted light.

An imaging module includes an imager having an optical member on a light receiving surface, an electronic component having a front surface facing the same direction as the one to which an incidence surface of the optical member faces, a resin portion that has a first surface flush with the incidence surface of the optical member and the front surface of the electronic component, and a second surface that is a surface on a side opposite to the first surface while having the imager and the electronic component being embedded therein such that the incidence surface and the front surface are exposed to the first surface, an external connection terminal provided on the second surface, and a through wiring that extends through the resin portion to connect at least one of the imager and the electronic component with the external connection terminal.

An endoscope device and a cable assembly thereof are provided. The cable assembly includes a first substrate, a second substrate, and a wire. The first substrate includes a first body and a first solder pad disposed on the first body. The second substrate is correspondingly disposed on the first substrate and includes a second body, a second solder pad disposed on the second body and corresponding to the first solder pad, and an accommodating portion corresponding to the second solder pad. The wire includes a soldering portion disposed in the accommodating portion. The first solder pad and the second solder pad are coupled to each other by at least one of a first solder and a second solder, and the soldering portion and the second solder pad are coupled to each other by the first solder.

There is provided herein a flexible electronic circuit board for a tip section of a multi-camera endoscope, the circuit board comprising a front camera surface configured to carry a forward looking camera, a first side camera surface configured to carry a first side looking camera, a second side camera surface configured to carry a second side looking camera, one or more front illuminator surfaces a configured to carry one or more front illuminators to essentially illuminate the FOV of the forward looking camera, one or more side illuminator surfaces configured to carry one or more side illuminators to essentially illuminate the FOV of the first side looking camera and one or more side illuminator surfaces configured to carry one or more side illuminators to essentially illuminate the FOV of the second side looking camera.

A method for characterizing a state of an end effector of an ultrasonic device is disclosed. The ultrasonic device including an electromechanical ultrasonic system defined by a predetermined resonant frequency. The electromechanical ultrasonic system further including an ultrasonic transducer coupled to an ultrasonic blade. The method including applying, by an energy source, a power level to the ultrasonic transducer, measuring, by a control circuit coupled to a memory, an impedance value of the ultrasonic transducer, comparing, by the control circuit, the impedance value to a reference impedance value stored in the memory; classifying, by the control circuit, the impedance value based on the comparison; characterizing, by the control circuit, the state of the electromechanical ultrasonic system based on the classification of the impedance value; and adjusting, by the control circuit, the power level applied to the ultrasonic transducer based on the characterization of the state of the end effector.

An image pickup apparatus includes an image pickup member including an image pickup device, a stacked device in which a plurality of semiconductor devices are stacked, a wiring board having a first principal surface and a second principal surface, the wiring board including a central section having a substrate thicker than the image pickup device, an intermediate section that is extended from the central section and is bent, and a terminal section that is extended from the intermediate section, the image pickup member being bonded to the first principal surface of the central section, the stacked device being bonded to the second principal surface of the central section, and a plurality of signal cables bonded to the terminal section.

An electronic module includes: an integrated circuit including a first mounting surface; a solid wiring board including a second mounting surface and a third mounting surface within a horizontally projected area corresponding to the integrated circuit; both the second and third mounting surfaces face the first mounting surface of the integrated circuit and disposed at positions with different distances to the first mounting surface. An electrode surface of an electronic component mounted in a space formed between the first and the third mounting surfaces, and an electrode surface of the second mounting surface are arranged substantially parallel to a surface of the integrated circuit on which electrodes are aligned. The electrode on the second mounting surface and the electrodes of the integrated circuit are electrically connected to each other. The electrode of the electronic component is electrically connected to the electronic component and the electrodes of the integrated circuit.

A tip section of a multi-camera endoscope includes a front-pointing camera on a planar surface of a distal end of the tip section and two side-pointing cameras positioned on a cylindrical surface in proximity to the planar surface such that the side field of view provided by the two side-pointing cameras partially overlaps with the front field of view provided by the front-pointing camera. The tip section further includes a working channel configured for insertion of a surgical tool; and a pathway fluid injector for inflating and/or cleaning a body cavity into which the endoscope is inserted.