G01P15/06

Impact sensor

An impact sensor has a hollow container with a spring extending therethrough. A liquid is present in the cavity. The spring biases opposing valve balls to a closed position, preventing dye that is located exterior of the cavity from entering the cavity. When a force applied to the sensor exceeds a first predetermined value, the spring is compressed or displaced, allowing at least one of the valve balls to move from the closed position to an open position, thereby allowing the dye at the moving valve ball to pass into the cavity, mixing with the liquid and providing a visual indication of the exceeded force upon the sensor.

PACKAGE IMPACT INDICATOR(S) REGISTERING LOCATION AND ELAPSED TIME FROM IMPACT
20190367238 · 2019-12-05 ·

Impact indicators which include an impact registering structure are provided for a package. The impact registering structure registers a location and an elapsed time of an impact of excessive force on the package. The structure includes a first region, a second region, and a barrier film. The first region contains a first element, and the second region contains a second element. The first and second elements are selected to register the location and the elapsed time of the impact when coming in contact. The barrier film separates the first and second regions, and is calibrated to rupture with a specified impact force. Once ruptured, the first element and the second element contact, in part, to provide a location indication of the rupture in the barrier film and a time elapsed indication indicative of the elapsed time from the rupture in the barrier film.

PACKAGE IMPACT INDICATOR(S) REGISTERING LOCATION AND ELAPSED TIME FROM IMPACT
20190367238 · 2019-12-05 ·

Impact indicators which include an impact registering structure are provided for a package. The impact registering structure registers a location and an elapsed time of an impact of excessive force on the package. The structure includes a first region, a second region, and a barrier film. The first region contains a first element, and the second region contains a second element. The first and second elements are selected to register the location and the elapsed time of the impact when coming in contact. The barrier film separates the first and second regions, and is calibrated to rupture with a specified impact force. Once ruptured, the first element and the second element contact, in part, to provide a location indication of the rupture in the barrier film and a time elapsed indication indicative of the elapsed time from the rupture in the barrier film.

Powerless environmental data recorder
10241126 · 2019-03-26 · ·

An environmental data recorder includes an enclosure, a first acceleration recorder array positioned on a first inner surface of the enclosure corresponding to an x-z plane defined by an x-axis and a z-axis, a second acceleration recorder array positioned on a second inner surface of the enclosure corresponding to an x-y plane defined by the x-axis and a y-axis, and a third acceleration recorder array positioned on a third inner surface of the enclosure corresponding to a y-z plane defined by the y-axis and the z-axis. The x-axis, the y-axis, and the z-axis are orthogonal axes. The first, second, and third acceleration recorder arrays each include a plurality of beams cantilevered at first ends from a base attached to an inner surface of the enclosure and a plurality of known masses associated with the beams. The beams are configured to deform or break when exposed to different g loads.

Powerless environmental data recorder
10241126 · 2019-03-26 · ·

An environmental data recorder includes an enclosure, a first acceleration recorder array positioned on a first inner surface of the enclosure corresponding to an x-z plane defined by an x-axis and a z-axis, a second acceleration recorder array positioned on a second inner surface of the enclosure corresponding to an x-y plane defined by the x-axis and a y-axis, and a third acceleration recorder array positioned on a third inner surface of the enclosure corresponding to a y-z plane defined by the y-axis and the z-axis. The x-axis, the y-axis, and the z-axis are orthogonal axes. The first, second, and third acceleration recorder arrays each include a plurality of beams cantilevered at first ends from a base attached to an inner surface of the enclosure and a plurality of known masses associated with the beams. The beams are configured to deform or break when exposed to different g loads.

POWERLESS ENVIRONMENTAL DATA RECORDER
20180275156 · 2018-09-27 ·

An environmental data recorder includes an enclosure, a first acceleration recorder array positioned on a first inner surface of the enclosure corresponding to an x-z plane defined by an x-axis and a z-axis, a second acceleration recorder array positioned on a second inner surface of the enclosure corresponding to an x-y plane defined by the x-axis and a y-axis, and a third acceleration recorder array positioned on a third inner surface of the enclosure corresponding to a y-z plane defined by the y-axis and the z-axis. The x-axis, the y-axis, and the z-axis are orthogonal axes. The first, second, and third acceleration recorder arrays each include a plurality of beams cantilevered at first ends from a base attached to an inner surface of the enclosure and a plurality of known masses associated with the beams. The beams are configured to deform or break when exposed to different g loads.

Tipping indicator and packing box including the same

A tipping indicator (10) for fixing to a side surface of a packing box (1) includes an ink bag (11), an ink absorber (12), and an outer bag (13). The ink bag (11) includes an ink chamber (11a) internally filled with an ink (G). The ink absorber (12) is ink absorptive and has a different color from the ink (G). The outer bag (13) is formed from a film within which the ink bag (11) and the ink absorber (12) are enclosed. At least part of the outer bag (13) has a visual confirmation region (R3) in which the ink absorber (12) is visible.

Tipping indicator and packing box including the same

A tipping indicator (10) for fixing to a side surface of a packing box (1) includes an ink bag (11), an ink absorber (12), and an outer bag (13). The ink bag (11) includes an ink chamber (11a) internally filled with an ink (G). The ink absorber (12) is ink absorptive and has a different color from the ink (G). The outer bag (13) is formed from a film within which the ink bag (11) and the ink absorber (12) are enclosed. At least part of the outer bag (13) has a visual confirmation region (R3) in which the ink absorber (12) is visible.

Semiconductor device and method including an intertial mass element

Disclosed is a semiconductor device comprising a stack of patterned metal layers separated by dielectric layers, the stack comprising a first conductive support structure and a second conductive support structure and a cavity in which an inertial mass element comprising at least one metal portion is conductively coupled to the first support structure and the second support structure by respective conductive connection portions, at least one of said conductive connection portions being designed to break upon the inertial mass element being exposed to an acceleration force exceeding a threshold defined by the dimensions of the conductive connection portions. A method of manufacturing such a semiconductor device is also disclosed.

Semiconductor device and method including an intertial mass element

Disclosed is a semiconductor device comprising a stack of patterned metal layers separated by dielectric layers, the stack comprising a first conductive support structure and a second conductive support structure and a cavity in which an inertial mass element comprising at least one metal portion is conductively coupled to the first support structure and the second support structure by respective conductive connection portions, at least one of said conductive connection portions being designed to break upon the inertial mass element being exposed to an acceleration force exceeding a threshold defined by the dimensions of the conductive connection portions. A method of manufacturing such a semiconductor device is also disclosed.