A method for testing movement speed includes, but is not limited to: measuring a static pressure P.sub.0 of an inner cavity of a pressure hole of a mobile device (S100); aligning the pressure hole to a wind direction and measuring a total pressure P of the wind in a static state (S101); aligning the pressure hole to the wind direction in a moving process, and measuring a pressure P.sub.m of the inner cavity of the pressure hole in a movement direction (S102); obtaining a current wind speed v.sub.f according to a correspondence relationship between a wind speed v.sub.f and a dynamic pressure P-P.sub.0; and obtaining a current relative movement speed v.sub.r according to a correspondence relationship between a relative movement speed v.sub.r and a pressure difference P.sub.m-P.sub.0 (S103); and obtaining a current movement speed v according to the current relative movement speed v.sub.r and the current wind speed v.sub.f (S104).

An atomic interferometric accelerometer comprises a laser that emits a pulsed beam at a first frequency, an electro-optic modulator that receives the beam, and a vacuum cell in communication with the electro-optic modulator. The electro-optic modulator outputs a first optical signal corresponding to the beam at the first frequency and a second optical signal having a second frequency different from the first frequency. The vacuum cell has a chamber for laser cooled atoms. The vacuum cell receives the optical signals such that they propagate in a direction that passes through the atoms. A piezo mirror retro-reflects the optical signals back through the vacuum cell in a counter-propagating direction. The piezo mirror is driven with substantially constant velocity during a beam pulse, thereby imparting a Doppler shift to the retro-reflected optical signals to create two non-symmetric counter-propagating lightwave pairs. One of the lightwave pairs supports interferometry while the other is non-resonant.

A sensor system including a chip arrangement, the chip arrangement including a sensor and an acceleration sensor, and the sensor system including a processor circuit. The processor circuit is configured in such a way that: one or multiple temperature-dependent variables and/or properties of the sensor are ascertained, and an offset of a signal of the acceleration sensor induced by a temperature gradient is corrected with the aid of the one or the multiple ascertained temperature-dependent variables and/or properties of the sensor.

An inertial sensor device includes a plurality of inertial measurement units, one of the inertial measurement units includes an inertial sensor, a reception section configured to receive data of another of the inertial measurement units, a combination processing section configured to operate the data of the another of the inertial measurement units and data of the one of the inertial measurement units, and a first transmission section configured to transmit output of the combination processing section.

An inertial force sensor includes: an acceleration detection element; a temperature sensor that detects an ambient temperature of the acceleration detection element; a bridge circuit that processes an output signal from the acceleration detection element; an AD converter that converts an analog signal output from the bridge circuit into a digital signal, and outputs the digital signal; a calculation circuit that performs calculation on the output signal from the AD converter; and a storage that stores correction data for correcting a variation in the output signal from the AD converter due to a temperature change. The correction data are coefficients of a formula expressed by a calibration curve that is a quadratic or higher-degree curve, and the storage stores, as the correction data, the coefficients of the calibration curve of each of a plurality of patterns that differ between a predetermined temperature or more and less than the predetermined temperature.

A sensor assembly includes a housing extending from an insertion end to an opposite coupling end, from a sensor end to an opposite back end, and from a top end to an opposite bottom end. The assembly also includes a sensor dish outwardly projecting from the sensor end of the housing and configured to hold one or more sensors. The assembly also includes a radio frequency (RF) transparent sensor cap configured to be secured to the sensor dish to secure the one or more sensors within the sensor dish. The housing also can be secured to a vehicle for the sensors to measure operational conditions of the vehicle. The housing of the sensor assembly may be connected to a drive train of the vehicle by inserting a fastener through a channel in the housing and into a jacking hole of the vehicle.

An accelerometer is disclosed. The accelerometer includes an encapsulation structure provided with an accommodation space; a MEMS chip for detecting acceleration signal accommodated in the accommodation space; an ASIC chip received in the accommodation space. The ASIC chip includes a signal processing module connected to MEMS chip for processing the acceleration signal detected by the MEMS chip and outputting the processed acceleration signal. The accelerometer further includes a temperature detection module for detecting temperature signal and outputting the temperature signal.

This invention describes the structure and function of an integrated multi-sensing system. Integrated systems described herein may be configured to form a microphone, pressure sensor, gas sensor, multi-axis gyroscope or accelerometer. The sensor uses a variety of different Field Effect Transistor technologies (horizontal, vertical, Si nanowire, CNT, SiC and III-V semiconductors) in conjunction with MEMS based structures such as cantilevers, membranes and proof masses integrated into silicon substrates. It also describes a configurable method for tuning the integrated system to specific resonance frequency using electronic design.

MEMS mass-spring-damper systems (including MEMS gyroscopes and accelerometers) using an out-of-plane (or vertical) suspension scheme, wherein the suspensions are normal to the proof mass, are disclosed. Such out-of-plane suspension scheme helps such MEMS mass-spring-damper systems achieve inertial grade performance. Methods of fabricating out-of-plane suspensions in MEMS mass-spring-damper systems (including MEMS gyroscopes and accelerometers) are also disclosed.

A micromechanical sensor device includes an evaluation circuit formed in a first substrate, and an MEMS structure which is situated in a cavity delimited by a second substrate and a third substrate, the MEMS structure and the second substrate being situated on top of each other, the MEMS structure being functionally connected to the evaluation circuit via a contact area, the contact area between the MEMS structure and the first substrate being situated essentially centrally on the second substrate and essentially centrally on the first substrate and has an essentially punctiform configuration, proceeding radially from the contact area, a clearance being formed between the first substrate and the second substrate.