A microelectromechanical device includes a substrate, a first structural layer, and a second structural layer of semiconductor material. A sensing mass extends in the first structural layer and is coupled to the substrate by first elastic connections to enable oscillation of the sensing mass in a sensing direction perpendicular to the substrate by a maximum amount relative to a resting position of the sensing mass. An out-of-plane stopper structure includes an anchorage fixed to the substrate and a mechanical end-of-travel structure, which extends in the second structural layer, faces the sensing mass, and is separated therefrom by a gap having a width smaller than the maximum displacement distance of the sensing mass. The mechanical end-of-travel structure is coupled to the anchorage by second elastic connections that enable movement of the mechanical end-of-travel structure in the sensing direction in response to an impact of the sensing mass.

Systems and methods according to present principles provide for three axis force sensing in a convenient and manufacturable way. In one implementation, a vibrating motor is attached at the fixed end of an anisotropic structure, such as a rod, which then vibrates in a circular motion. A monitor such as a 3-axis accelerometer is also attached to the anisotropic structure. The resulting motion is then mapped electronically for analysis. With no force applied, a circular motion is achieved. When a net force is applied to the free, vibrating end of the rod, the circular pattern which is traced out becomes distorted, e.g., progressively flattened into an ellipse, in a repeatable way which is directly proportional to the applied force. The axis of the applied force can be ascertained according to the direction in which the ellipse forms. Systems and methods according to present principles may be used in any application in which force sensing is needed, e.g., robotics, including robotic surgery.

A physical quantity detection element includes a first base portion and a second base portion, a pair of vibrating beams extending between the first base portion and the second base portion, and a plurality of excitation electrodes provided in surfaces of the pair of vibrating beams. The vibrating beam includes a first region, a second region, and a third region. The first region is located between the second region and the first base portion, and the third region is located between the second region and the second base portion. The excitation electrode provided in the first region is disposed such that a distance from the first base portion is 2.5% or more and 12.3% or less of a total length of the vibrating beam, and the excitation electrode provided in the third region is disposed such that a distance from the second base portion is 2.5% or more and 12.3% or less of the total length of the vibrating beam.

A physical quantity detection element includes a first base portion and a second base portion, a pair of vibrating beams extending between the first base portion and the second base portion, and a plurality of excitation electrodes provided in surfaces of the pair of vibrating beams. The vibrating beam includes a first region, a second region, and a third region. The first region is located between the second region and the first base portion, and the third region is located between the second region and the second base portion. The excitation electrode provided in the first region is disposed such that a distance from the first base portion is 2.5% or more and 12.3% or less of a total length of the vibrating beam, and the excitation electrode provided in the third region is disposed such that a distance from the second base portion is 2.5% or more and 12.3% or less of the total length of the vibrating beam.

A device (10) and method for sensor diagnostic monitoring and detection of an imbalance of a rotating machine (1) has steps of (a) detecting acceleration signals (Sb) of the housing (2) or of a non-rotating component of the rotating machine (1) by a sensor (20); (b) detecting signals (Sd) for the determination of the rotation speed of the rotating machine (1) by a second sensor; and (c) supplying and evaluating of sensor signals (Sb, Sd) by an evaluation unit (40, 50, 60). An acceleration component that is acquired occurs with the rotation speed of the rotating machine. This component is compared with a predetermined limit value.

A device (10) and method for sensor diagnostic monitoring and detection of an imbalance of a rotating machine (1) has steps of (a) detecting acceleration signals (Sb) of the housing (2) or of a non-rotating component of the rotating machine (1) by a sensor (20); (b) detecting signals (Sd) for the determination of the rotation speed of the rotating machine (1) by a second sensor; and (c) supplying and evaluating of sensor signals (Sb, Sd) by an evaluation unit (40, 50, 60). An acceleration component that is acquired occurs with the rotation speed of the rotating machine. This component is compared with a predetermined limit value.

A micromechanical component for a sensor device. The component includes a first seismic mass, the first seismic mass displaced out of its first position of rest by a first limit distance into a first direction along a first axis mechanically contacting a first stop structure, and including a second seismic mass which is displaceable out of its second position of rest at least along a second axis, the second axis lying parallel to the first axis or on the first axis, and a second stop surface of the second seismic mass, displaced out of its second position of rest into a second direction counter to the first direction along the second axis, mechanically contacting a first stop surface of the first seismic mass adhering to the first stop structure.

The accelerometers disclosed herein provide excellent sensitivity, long-term stability, and low SWaP-C through a combination of photonic integrated circuit technology with standard micro-electromechanical systems (MEMS) technology. Examples of these accelerometers use optical transduction to improve the scale factor of traditional MEMS resonant accelerometers by accurately measuring the resonant frequencies of very small (e.g., about 1 μm) tethers attached to a large (e.g., about 1 mm) proof mass. Some examples use ring resonators to measure the tether frequencies and some other examples use linear resonators to measure the tether frequencies. Potential commercial applications span a wide range from seismic measurement systems to automotive stability controls to inertial guidance to any other application where chip-scale accelerometers are currently deployed.

The accelerometers disclosed herein provide excellent sensitivity, long-term stability, and low SWaP-C through a combination of photonic integrated circuit technology with standard micro-electromechanical systems (MEMS) technology. Examples of these accelerometers use optical transduction to improve the scale factor of traditional MEMS resonant accelerometers by accurately measuring the resonant frequencies of very small (e.g., about 1 μm) tethers attached to a large (e.g., about 1 mm) proof mass. Some examples use ring resonators to measure the tether frequencies and some other examples use linear resonators to measure the tether frequencies. Potential commercial applications span a wide range from seismic measurement systems to automotive stability controls to inertial guidance to any other application where chip-scale accelerometers are currently deployed.

A force sensor including a support, a test body, two strain gauges, mechanical transmission means between the test body and the strain gauges so that a movement of the test body applies a strain onto the strain gauges in a first direction of the plane of the sensor, the transmission means being hinged relative to the support about a second direction in the plane of the sensor, the test body being accommodated within a first volume, the strain gauges being accommodated within a second volume, insulated by sealed insulation means. The sensor includes a sacrificial layer, a nanometric layer, a protective layer and a micrometric layer. The test body and at least one portion of the support are formed in the substrate, the sealed insulation means are partially formed by the nanometric layer and by the sacrificial layer, and the strain gauges are formed in the nanometric layer.