A semiconductor device includes a moveable element over a substrate, wherein the moveable element is moveable relative to the substrate. The semiconductor device further includes a first anchor portion connected to the substrate; and a second anchor portion connected to the substrate on an opposite side of the moveable element from the first anchor portion. The semiconductor device further includes a first connector configured to connect the moveable element to the first anchor portion. The semiconductor device further includes a second connector configured to connect the moveable element to the second anchor portion. The semiconductor device further includes a conductive wire loop on the moveable element; and a connection wire electrically connected to a first end of the conductive wire loop, wherein the connection wire extends across the first connector to the first anchor portion.

A semiconductor device includes a moveable element over a substrate, wherein the moveable element is moveable relative to the substrate. The semiconductor device further includes a first anchor portion connected to the substrate; and a second anchor portion connected to the substrate on an opposite side of the moveable element from the first anchor portion. The semiconductor device further includes a first connector configured to connect the moveable element to the first anchor portion. The semiconductor device further includes a second connector configured to connect the moveable element to the second anchor portion. The semiconductor device further includes a conductive wire loop on the moveable element; and a connection wire electrically connected to a first end of the conductive wire loop, wherein the connection wire extends across the first connector to the first anchor portion.

An accelerometer as disclosed herein includes a support wafer, a bottom wafer, a top wafer, and an inductive pick-off. The support wafer may define a plane and may comprise a first side, a second side, and a proof mass. The proof mass may be configured to move in the plane defined by the support wafer. The bottom wafer may comprise a first side and a second side, and the first side may be positioned over the first side of the support wafer. The top wafer may comprise a first side and a second side, and the first side may be positioned over the second side of the support wafer. The inductive pick-off may comprise a near field resonant conductive coupling mechanism and may be configured to output a signal indicative of an amount of displacement of the proof mass to electronics.

An accelerometer as disclosed herein includes a support wafer, a bottom wafer, a top wafer, and an inductive pick-off. The support wafer may define a plane and may comprise a first side, a second side, and a proof mass. The proof mass may be configured to move in the plane defined by the support wafer. The bottom wafer may comprise a first side and a second side, and the first side may be positioned over the first side of the support wafer. The top wafer may comprise a first side and a second side, and the first side may be positioned over the second side of the support wafer. The inductive pick-off may comprise a near field resonant conductive coupling mechanism and may be configured to output a signal indicative of an amount of displacement of the proof mass to electronics.