A piezoelectric sensor comprises a support structure, a channel extending through the support structure, a sensing material stack coupled to the support structure and extending over the channel, and a filler material disposed within the channel and over the sensing material stack. The sensing material stack comprises an structural layer, a first electrode layer disposed on the structural layer, a piezoelectric material disposed in a piezoelectric layer on the first electrode, and a second electrode disposed on the piezoelectric layer opposite the first electrode layer.

A sensor including one or more transistors; and one or more sensing elements, wherein an edge behaves as moving gate of said one or more transistors, an electric field is applied to said edge, said one or more transistors is/are biased, said one or more sensing elements is/are flexible, source and drain wells of said one or more transistors can be coplanar or stacked, said edge can move in a lateral or a parallel direction with respect to a transistor current, said edge can move in a vertical or a perpendicular direction with respect to said transistor current, and the magnitude of the change in said drain current determines the sensitivity.

This invention describes a magnetoresistive inertial sensor chip, comprising a substrate, a vibrating diaphragm, a magnetic field sensing magnetoresistor and at least one permanent magnet thin film. The vibrating diaphragm is located on one side surface of the substrate. The magnetic field sensing magnetoresistor and the permanent magnet thin film are set on the surface of the vibrating diaphragm displaced from the base of the substrate. A contact electrode is also arranged on the surface of the vibrating diaphragm away from the base of the substrate. The magnetic field sensing magnetoresistor is connected to the contact electrode through a lead. The substrate comprises a cavity formed through etching and either one or both of the magnetic field sensing magnetoresistors and the permanent magnet thin film are arranged in a vertical projection area of the cavity in the vibrating diaphragm portion. A magnetic field generated by the permanent magnet thin film changes in the sensing direction of the magnetic field sensing magnetoresistor of magnetoresistive inertial sensor chip, which changes the resistance valve of the magnetic field sensing magnetoresistor, thereby producing a change in an output electrical signal. This magnetoresistive inertial sensor chip uses the high-sensitivity and high-frequency response characteristics of a magnetoresistor to improve the output signal strength and frequency response, thereby facilitating the detection of small and high frequency pressure, vibration, or acceleration changes.

A physical quantity sensor includes a substrate, an anchor portion, a surrounding portion, a detecting element, a moving portion, and a beam portion. The anchor portion is formed on the same side as a principal surface of the substrate and fixed to the substrate. The surrounding portion is formed on the same side as the principal surface of the substrate and surrounds the anchor portion. The detecting element detects a physical quantity as a target of detection. The moving portion is provided with at least a part of the detecting element, formed on the same side as the principal surface of the substrate, and connected to the surrounding portion. The beam portion is formed on the same side as the principal surface of the substrate and connects the anchor portion and the surrounding portion together.

An electronic device is provided. The electronic device includes a housing, a flexible display configured to move relative to at least a portion of the housing, and at least one noise detection circuitry disposed in the housing. The at least one noise detection circuitry may include a substrate, a microphone circuitry disposed on the substrate, a vibration detection sensor disposed on the substrate, a shielding member disposed on the substrate and surrounding at least a portion of the vibration detection sensor, and a waterproofing member disposed on the shielding member and covering the vibration detection sensor.

An electronic device is provided. The electronic device includes a housing, a flexible display configured to move relative to at least a portion of the housing, and at least one noise detection circuitry disposed in the housing. The at least one noise detection circuitry may include a substrate, a microphone circuitry disposed on the substrate, a vibration detection sensor disposed on the substrate, a shielding member disposed on the substrate and surrounding at least a portion of the vibration detection sensor, and a waterproofing member disposed on the shielding member and covering the vibration detection sensor.

A transducer structure for converting a deformation along an axis into a corresponding deformation on a plane orthogonal to the axis itself, including: two end plates facing each other and aligned along a common reference axis (X); connection members projecting radially from each end plate according to respective different directions; lateral bars connecting the end plates to one another through two connection members. The connection members are deformable within respective deformation planes to allow relative movements between the end plates and the lateral bars such as to convert an axial movement of mutual approach between the two end plates into a corresponding radial movement of the lateral bars away from the reference axis (X), and vice-versa.

A self-diagnosis method for a vibration sensor attached to vibrating equipment includes measuring vibration data of the vibrating equipment by the vibration sensor, integrating the vibration data, and diagnosing whether or not the vibration sensor is abnormal by comparing an integrated value of the vibration data with a reference value.

One example is a shock gauge system for measuring an external blast to a hull. The shock gauge system includes at least one accelerometer to produce acceleration data in response to the external blast, a mass with an accelerometer affixed to it, a crush block, a linear displacement potentiometer (LDP), a camera, and a processor logic. The LDP device generates displacement data of a mass being pushed into the crush block when reacting to the external blast. The camera captures images of movement of the mass. The processor logic verifies if the acceleration data is valid by correlating the acceleration data to the displacement data, the images, and/or an amount of displacement into the crush block by the mass. When the acceleration data is valid, the acceleration data may be used to create a more blast resistant hull.

Aspects of this disclosure relate to a welding system that is configured to execute opposed, step, and parallel gap resistance spot welds (RSW) and associated methods. The system may be configured to switch bases to switch between an opposed weld configuration, a step weld configuration, and a parallel gap configuration. The system may include an accelerometer that is secured to the weld head adjacent one of the electrodes. The system may use the accelerometer to determine whether or not an RSW was defective. Acceleration data may indicate a defective weld when it includes acceleration data that is outside of a threshold range of acceptable acceleration data.