Techniques for self-adjusting calibration of offset and sensitivity of a MEMS accelerometer are provided. In one example, a system comprises a first microelectromechanical (MEMS) sensor. The first MEMS sensor comprises: a proof mass coupled to an anchor connected to a reference plane, wherein the proof mass is coupled to the anchor via a first spring and a second spring; a plurality of reference paddles coupled to the anchor; and a plurality of acceleration sensing electrodes disposed on the reference plane, wherein a first area of each of the acceleration sensing electrodes is larger than a second area of each of a plurality of reference electrodes associated with the plurality of reference paddles.

Techniques for self-adjusting calibration of offset and sensitivity of a MEMS accelerometer are provided. In one example, a system comprises a first microelectromechanical (MEMS) sensor. The first MEMS sensor comprises: a proof mass coupled to an anchor connected to a reference plane, wherein the proof mass is coupled to the anchor via a first spring and a second spring; a plurality of reference paddles coupled to the anchor; and a plurality of acceleration sensing electrodes disposed on the reference plane, wherein a first area of each of the acceleration sensing electrodes is larger than a second area of each of a plurality of reference electrodes associated with the plurality of reference paddles.

A sensor unit with high reliability and stable detection accuracy against vibrations of an installation target object is to be provided.

A sensor unit includes: a sensor module configured including a substrate with inertial sensors mounted thereon, and an inner case in which the substrate is installed; and an outer case accommodating the sensor module. A recessed part is formed in the inner case. The inertial sensors are arranged in an area overlapping with the recessed part as viewed in a plan view seen from the direction of thickness of the substrate, and a filling member is provided to fill a space formed by the substrate and the recessed part. The sensor module is joined to a bottom wall of the outer case via a joining member.

The underground inclinometer system includes a probe having a displacement measurement sensor measuring displacement of the ground, a cable controller controlling the length of a cable inserted into the ground to move the probe within an inclinometer pipe, and a ground displacement calculator calculating the displacement of the ground by using displacement measurement information measured by the probe and information on the length of the cable controlled by the cable controller.

A force sensor includes a sensor chip that detects displacements in multiple axial directions, and a strain body that transfers force applied thereto to the sensor chip. The strain body includes a sensor chip mount on which the sensor chip is mounted, multiple columns disposed around and apart from the sensor chip mount, and connecting beams via which the sensor chip mount is fixed to the columns.

An MEMS or NEMS accelerometer adapted to measure an acceleration along a sensing axis includes a substrate featuring a plane; a mass having a central zone and suspended relative to the substrate; a single lever arm comprising: a first end connected to the substrate by means of a first connection adapted to allow rotation of the lever arm about a rotation axis perpendicular to the sensing axis, and a second end connected to the mass by means of a second connection adapted to transmit movement in translation of the mass to the lever arm whilst allowing rotation of the lever arm about the rotation axis; the second end of the lever arm being disposed at the level of the central zone of the mass; at least one strain gauge comprising: a first end connected to the substrate, and a second end connected to the lever arm.

A cantilever section as a substrate for a sensor includes: a base section; a movable section connected to the base section; an arm portion as a support portion extending along the movable section from the base section when viewed in a planar view as viewed from a thickness direction of the movable section; and a gap portion formed to have a predetermined gap between the movable section and the arm portion when viewed in the planar view, in which a ridge portion formed as an etching residue having a top portion on the side facing the gap portion is provided on each of facing surfaces of the movable section and the arm portion in the gap portion, and the predetermined gap is a gap between a top portion of a first ridge portion which is the ridge portion formed at one of the movable section and the arm portion, and a top portion of a second ridge portion which is the ridge portion formed at the other of the movable section and the arm portion.

An acceleration sensor (1) includes a fixed portion (33), a movable portion (31) connected to the fixed portion (33), a lower electrode (11) that is disposed to face a lower surface of the movable portion (31), and an upper electrode (21) that is disposed to face an upper surface of the movable portion (31). A distance in an x-axis direction between an end portion (41) of the lower electrode (11) and the fixed portion (33) is shorter than a distance in the x-axis direction between an end portion (51) of the upper electrode (21) and the fixed portion (33). Further, a distance in the x-axis direction between an end portion (42) of the lower electrode (11) and the fixed portion (33) is shorter than a distance in the x-axis direction between an end portion (52) of the upper electrode (21) and the fixed portion (33).

The disclosure discloses an acceleration sensor, where the acceleration sensor comprises: a housing, and a mass block in the housing and connected with the housing via at least two hanging beams, where an auxiliary buffer component is further provided between the mass block and a bottom surface of the housing, and an elastic coefficient of the auxiliary buffer component decreases as force applied thereon increases.

This invention describes a magnetoresistive inertial sensor chip, comprising a substrate, a vibrating diaphragm, a magnetic field sensing magnetoresistor and at least one permanent magnet thin film. The vibrating diaphragm is located on one side surface of the substrate. The magnetic field sensing magnetoresistor and the permanent magnet thin film are set on the surface of the vibrating diaphragm displaced from the base of the substrate. A contact electrode is also arranged on the surface of the vibrating diaphragm away from the base of the substrate. The magnetic field sensing magnetoresistor is connected to the contact electrode through a lead. The substrate comprises a cavity formed through etching and either one or both of the magnetic field sensing magnetoresistors and the permanent magnet thin film are arranged in a vertical projection area of the cavity in the vibrating diaphragm portion. A magnetic field generated by the permanent magnet thin film changes in the sensing direction of the magnetic field sensing magnetoresistor of magnetoresistive inertial sensor chip, which changes the resistance valve of the magnetic field sensing magnetoresistor, thereby producing a change in an output electrical signal. This magnetoresistive inertial sensor chip uses the high-sensitivity and high-frequency response characteristics of a magnetoresistor to improve the output signal strength and frequency response, thereby facilitating the detection of small and high frequency pressure, vibration, or acceleration changes.