An accelerometer comprising a first proof mass and a second proof mass which are coupled to each other with a coupling structure which extends from the first proof mass to the second proof mass. The coupling structure synchronizes the movement of the first and second proof masses so that the first and second proof masses may be linearly displaced from their rest position in the x-direction, rotationally displaced in opposite in-plane directions and rotationally displaced in opposite out-of-plane directions.

An accelerometer comprising a first proof mass and a second proof mass which are coupled to each other with a coupling structure which extends from the first proof mass to the second proof mass. The coupling structure synchronizes the movement of the first and second proof masses so that the first and second proof masses may be linearly displaced from their rest position in the x-direction, rotationally displaced in opposite in-plane directions and rotationally displaced in opposite out-of-plane directions.

A microelectromechanical inertial sensor including a substrate and an electromechanical structure situated on the substrate.

A microelectromechanical inertial sensor including a substrate and an electromechanical structure situated on the substrate.

An example system comprising: a microelectromechanical system (MEMS) vibrating beam accelerometer (VBA) comprising: a proof mass; and a first resonator mechanically coupled to the proof mass; a first electrode configured to apply a force to the proof mass.

An inertial sensor 1 includes: a base body; a lid body facing the base body; a functional element disposed in a cavity between the base body and the lid body and including a semiconductor layer; an adhesive layer disposed in a peripheral region surrounding the cavity and adhering the base body and the lid body to each other; and a sealer configured to seal a hole which communicates the cavity with an outside and which is disposed in the peripheral region. The sealer is provided in contact with the lid body and the base body, and includes a material of the lid body and a material of the adhesive layer.

An inertial sensor 1 includes: a base body; a lid body facing the base body; a functional element disposed in a cavity between the base body and the lid body and including a semiconductor layer; an adhesive layer disposed in a peripheral region surrounding the cavity and adhering the base body and the lid body to each other; and a sealer configured to seal a hole which communicates the cavity with an outside and which is disposed in the peripheral region. The sealer is provided in contact with the lid body and the base body, and includes a material of the lid body and a material of the adhesive layer.

A micromechanical device includes a semiconductor body, a first mobile structure, an elastic assembly, coupled to the first mobile structure and to the semiconductor body and adapted to undergo deformation in a direction, and at least one abutment element. The elastic assembly is configured to enable an oscillation of the first mobile structure as a function of a force applied thereto. The first mobile structure, the abutment element and the elastic assembly are arranged with respect to one another in such a way that: when the force is lower than a force threshold, the elastic assembly operates with a first elastic constant; and when the force is greater than the threshold force, then the first mobile structure is in contact with the abutment element, and a deformation of the elastic assembly is generated, which operates with a second elastic constant different from the first elastic constant.

A micromechanical device includes a semiconductor body, a first mobile structure, an elastic assembly, coupled to the first mobile structure and to the semiconductor body and adapted to undergo deformation in a direction, and at least one abutment element. The elastic assembly is configured to enable an oscillation of the first mobile structure as a function of a force applied thereto. The first mobile structure, the abutment element and the elastic assembly are arranged with respect to one another in such a way that: when the force is lower than a force threshold, the elastic assembly operates with a first elastic constant; and when the force is greater than the threshold force, then the first mobile structure is in contact with the abutment element, and a deformation of the elastic assembly is generated, which operates with a second elastic constant different from the first elastic constant.

In an example, a vehicle tire includes a tread portion, a sidewall portion, and a sensor module for estimating one or more parameters of the tire. The sensor module includes a detector patch that includes one or more capacitors, each of which has an electrostatic capacity that is variable due to at least deformation of each capacitor. The sensor module also includes an electronics unit connected to each capacitor and configured to control the sensor module. The detector patch is adhered to an inside of at least one of the tread portion or the sidewall portion. At least one of the capacitors is located on the inside of the at least one of the tread portion or the sidewall portion. The electronics unit is configured to estimate at least one of the parameters based on the electrostatic capacity of each capacitor.