A method for operating a micromechanical inertial sensor, including: translating an acceleration into a deflection of two detection electrodes that are displaced in opposite directions; ascertaining a difference in the spacing of the two detection electrodes; converting the difference in the spacing into an acceleration value using a scaling factor; and applying a linearization process to the acceleration value.

A method for operating a micromechanical inertial sensor, including: translating an acceleration into a deflection of two detection electrodes that are displaced in opposite directions; ascertaining a difference in the spacing of the two detection electrodes; converting the difference in the spacing into an acceleration value using a scaling factor; and applying a linearization process to the acceleration value.

A method of manufacturing a physical quantity detection sensor includes forming a stacked structure having a plurality of sensor devices by bonding together a sensor substrate and a different type substrate of a different material from a material of the sensor substrate, the sensor substrate having a plurality of sensor movable portions therein, and dicing the stacked structure using a dicing blade, wherein a groove is provided in one of the sensor substrate and the different type substrate to penetrate the one of the sensor substrate and the different type substrate, the groove having a width larger than a width of the dicing blade, and in at least part of the dicing, the dicing blade is accommodated in the groove and advances without contacting surfaces on left and right sides of the groove.

A method of manufacturing a physical quantity detection sensor includes forming a stacked structure having a plurality of sensor devices by bonding together a sensor substrate and a different type substrate of a different material from a material of the sensor substrate, the sensor substrate having a plurality of sensor movable portions therein, and dicing the stacked structure using a dicing blade, wherein a groove is provided in one of the sensor substrate and the different type substrate to penetrate the one of the sensor substrate and the different type substrate, the groove having a width larger than a width of the dicing blade, and in at least part of the dicing, the dicing blade is accommodated in the groove and advances without contacting surfaces on left and right sides of the groove.

An inertia sensor detects a physical quantity based on a displacement in a Z axis when three axes orthogonal to one another are defined as an X axis, a Y axis, and the Z axis. The inertial sensor includes: a substrate; and a movable body that is fixed to the substrate, that swings around a swing axis P along the X axis, and that has two flat surfaces facing each other and a side surface connecting the two flat surfaces. The movable body includes a first extension arranged at a predetermined angle with respect to the swing axis P and a second extension arranged facing the side surface of the first extension.

An inertia sensor detects a physical quantity based on a displacement in a Z axis when three axes orthogonal to one another are defined as an X axis, a Y axis, and the Z axis. The inertial sensor includes: a substrate; and a movable body that is fixed to the substrate, that swings around a swing axis P along the X axis, and that has two flat surfaces facing each other and a side surface connecting the two flat surfaces. The movable body includes a first extension arranged at a predetermined angle with respect to the swing axis P and a second extension arranged facing the side surface of the first extension.

According to one embodiment, a sensor includes a base body, a first supporter fixed to the base body, and a first movable part separated from the base body. The first movable part includes a first movable base part supported by the first supporter, a second movable base part connected with the first movable base part, and a first movable beam. The first movable beam includes a first beam, a first movable conductive part, and a first connection region. The first beam includes a first beam portion, a second beam portion, and a third beam portion between the first beam portion and the second beam portion. The first beam portion is connected with the first movable base part. The second beam portion is connected with the second movable base part. The first connection region connects the third beam portion and the first movable conductive part.

According to one embodiment, a sensor includes a base body, a first supporter fixed to the base body, and a first movable part separated from the base body. The first movable part includes a first movable base part supported by the first supporter, a second movable base part connected with the first movable base part, and a first movable beam. The first movable beam includes a first beam, a first movable conductive part, and a first connection region. The first beam includes a first beam portion, a second beam portion, and a third beam portion between the first beam portion and the second beam portion. The first beam portion is connected with the first movable base part. The second beam portion is connected with the second movable base part. The first connection region connects the third beam portion and the first movable conductive part.

Methods and systems for compensation of a microelectromechanical system (MEMS) sensor may include associating test temperature values with input test signal values, identifying temperature-input signal pairs, and applying one of the test temperature values and one of the test signal values to the MEMS sensor. Desired output signal values may be determined, with each of the desired output signal values corresponding to one of the applied temperature-input signal pairs. Measured output signal values from the MEMS sensor may be measured, with each of the measured output signal values corresponding to one of the applied temperature-input signal pairs. Compensation terms may be determined based on the plurality of temperature-input signal pairs, the corresponding plurality of measured output signal values, and the corresponding plurality of desired output signal values. Compensation terms may be used to modify a sense signal of the MEMS sensor.

Disclosed herein are aspects of a multiple-mass, multi-axis microelectromechanical systems (MEMS) accelerometer sensor device with a fully differential sensing design that applies differential drive signals to movable proof masses and senses differential motion signals at sense fingers coupled to a substrate. In some embodiments, capacitance signals from different sense fingers are combined together at a sensing signal node disposed on the substrate supporting the proof masses. In some embodiments, a split shield may be provided, with a first shield underneath a proof mass coupled to the same drive signal applied to the proof mass and a second shield electrically isolated from the first shield provided underneath the sense fingers and biased with a constant voltage to provide shielding for the sense fingers.