An inertial sensor is an inertial sensor for detecting a physical quantity based on a displacement in a Z axis when defining three axes perpendicular to each other as an X axis, a Y axis, and the Z axis, and is provided with a substrate, a movable body which is fixed to the substrate, oscillates around an oscillation axis along the X axis, and has two planes opposed to each other and side surfaces connecting the two planes to each other, and a limiter which is fixed to the substrate, and is opposed to the side surfaces of the movable body, wherein the movable body is provided with a resilient portion in a portion opposed to the limiter.

The purpose of the present invention is to provide a method for manufacturing a three-dimensionally structured member which can be made by a simpler process. The method for manufacturing a three-dimensionally structured member includes shaping a flat plate-shaped base member to produce a three-dimensionally structured member having a plurality of sections that are different from one another in thickness. The manufacturing method comprises: a mask formation step for forming a mask over the whole of at least one main surface of the base member; a mask removal step for removing a part of the mask; and an etching step for etching an exposed part of the base member wherein a combination of the mask removal step and the etching step is performed on the mask and the base member that correspond to each of the plurality of sections of the three-dimensionally structured member, in the order from thinnest to the thickest of thicknesses of the three-dimensionally structured members.

The purpose of the present invention is to provide a method for manufacturing a three-dimensionally structured member which can be made by a simpler process. The method for manufacturing a three-dimensionally structured member includes shaping a flat plate-shaped base member to produce a three-dimensionally structured member having a plurality of sections that are different from one another in thickness. The manufacturing method comprises: a mask formation step for forming a mask over the whole of at least one main surface of the base member; a mask removal step for removing a part of the mask; and an etching step for etching an exposed part of the base member wherein a combination of the mask removal step and the etching step is performed on the mask and the base member that correspond to each of the plurality of sections of the three-dimensionally structured member, in the order from thinnest to the thickest of thicknesses of the three-dimensionally structured members.

A physical quantity sensor includes a first element section in which first capacitances varying in accordance with a physical quantity have first saturation capacitance values at which the first capacitances are saturated by a first physical quantity, a second element section in which a second capacitances varying in accordance with the physical quantity have second saturation capacitance values at which the second capacitances are saturated by a second physical quantity smaller in absolute value than the first physical quantity, a multiplexer for outputting the first signals from the first element section and the second signals from the second element section, and a determination circuit that determines whether or not the level of the second signal input via the multiplexer reaches a threshold value which is a level of the second signal when the second physical quantity acts.

A physical quantity sensor includes a first element section in which first capacitances varying in accordance with a physical quantity have first saturation capacitance values at which the first capacitances are saturated by a first physical quantity, a second element section in which a second capacitances varying in accordance with the physical quantity have second saturation capacitance values at which the second capacitances are saturated by a second physical quantity smaller in absolute value than the first physical quantity, a multiplexer for outputting the first signals from the first element section and the second signals from the second element section, and a determination circuit that determines whether or not the level of the second signal input via the multiplexer reaches a threshold value which is a level of the second signal when the second physical quantity acts.

A micromechanical component for a sensor device. The component includes a first seismic mass, the first seismic mass displaced out of its first position of rest by a first limit distance into a first direction along a first axis mechanically contacting a first stop structure, and including a second seismic mass which is displaceable out of its second position of rest at least along a second axis, the second axis lying parallel to the first axis or on the first axis, and a second stop surface of the second seismic mass, displaced out of its second position of rest into a second direction counter to the first direction along the second axis, mechanically contacting a first stop surface of the first seismic mass adhering to the first stop structure.

A micromechanical component for a sensor device. The component includes a first seismic mass, the first seismic mass displaced out of its first position of rest by a first limit distance into a first direction along a first axis mechanically contacting a first stop structure, and including a second seismic mass which is displaceable out of its second position of rest at least along a second axis, the second axis lying parallel to the first axis or on the first axis, and a second stop surface of the second seismic mass, displaced out of its second position of rest into a second direction counter to the first direction along the second axis, mechanically contacting a first stop surface of the first seismic mass adhering to the first stop structure.

A micromechanical z-inertial sensor. The micromechical z-inertial sensor includes at least one first seismic mass element; and torsion spring elements joined to the first seismic mass element. In each case, first torsion spring elements are connected to a substrate, and second torsion spring elements are connected to the first seismic mass element. A first and a second torsion spring element in each case is joined to one another with the aid of a lever element. The lever element is designed to strike against a stop element.

A micromechanical z-inertial sensor. The micromechical z-inertial sensor includes at least one first seismic mass element; and torsion spring elements joined to the first seismic mass element. In each case, first torsion spring elements are connected to a substrate, and second torsion spring elements are connected to the first seismic mass element. A first and a second torsion spring element in each case is joined to one another with the aid of a lever element. The lever element is designed to strike against a stop element.

A sensor includes a movable element adapted for rotational motion about a rotational axis due to acceleration along an axis perpendicular to a surface of a substrate. The movable element includes first and second ends, a first section having a first length between the rotational axis and the first end, and a second section having a second length between the rotational axis and the second end that is less than the first length. A motion stop extends from the second end of the second section. The first end of the first section includes a geometric stop region for contacting the surface of the substrate at a first distance away from the rotational axis. The motion stop for contacting the surface of the substrate at a second distance away from the rotational axis. The first and second distances facilitate symmetric stop performance between the geometric stop region and the motion stop.