The design and fabrication of a multi-axis capacitive accelerometer is presented with sub-g resolution based on CMOS-compatible fabrication technology that can provide large proof-mass, high-aspect ratio and a large sense electrode area within a smaller footprint that previous accelerometers. In some instances, the device footprint can be reduced by placing the sense electrodes near the top or bottom of the transducer structure such that motion of the transducer causes size of the sense gap to vary in a direction that is parallel with longitudinal axis of the support beam for the transducer structure. An extra mass can also be added to the top of the transducer structure to increase sensitivity.

The design and fabrication of a multi-axis capacitive accelerometer is presented with sub-g resolution based on CMOS-compatible fabrication technology that can provide large proof-mass, high-aspect ratio and a large sense electrode area within a smaller footprint that previous accelerometers. In some instances, the device footprint can be reduced by placing the sense electrodes near the top or bottom of the transducer structure such that motion of the transducer causes size of the sense gap to vary in a direction that is parallel with longitudinal axis of the support beam for the transducer structure. An extra mass can also be added to the top of the transducer structure to increase sensitivity.

The present disclosure provides a mobile device and a method of changing the centroid thereof. The mobile device includes a device body, having a processor disposed therein; and a centroid changing device, including a guide rail disposed on the device body, a weight assembly slidably disposed on the guide rail, and a driving device coupled to the weight assembly, wherein the processor is electrically coupled to the driving device, and controls the weight assembly to slide along the guide rail via the driving device, to change the centroid of the device body.

A MEMS device of an embodiment includes a substrate, fixed electrode portions, a movable body, fixed electrode fixing portions, a wiring structure, and a first wire. The fixed electrode portions are fixed relative to the substrate. The movable body is movable relative to the substrate. The fixed electrode fixing portions are electrically coupled to the fixed electrode portions. The wiring structure is provided in the same layer as those of the movable body and the fixed electrode portions with respect to the substrate. The first wire has one end coupled to the fixed electrode fixing portion. The wiring structure is at least provided in an opening part of the movable body, and the first wire is wired on the wiring structure via an insulating film and routed out of the movable body through the opening part of the movable body.

A MEMS device of an embodiment includes a substrate, fixed electrode portions, a movable body, fixed electrode fixing portions, a wiring structure, and a first wire. The fixed electrode portions are fixed relative to the substrate. The movable body is movable relative to the substrate. The fixed electrode fixing portions are electrically coupled to the fixed electrode portions. The wiring structure is provided in the same layer as those of the movable body and the fixed electrode portions with respect to the substrate. The first wire has one end coupled to the fixed electrode fixing portion. The wiring structure is at least provided in an opening part of the movable body, and the first wire is wired on the wiring structure via an insulating film and routed out of the movable body through the opening part of the movable body.

A MEMS acceleration detection device including a housing having a cavity and a spring mass system assembled into the cavity of the housing. A lid enclosing the spring mass system in the cavity and contacting a top surface of the housing.

A MEMS acceleration detection device including a housing having a cavity and a spring mass system assembled into the cavity of the housing. A lid enclosing the spring mass system in the cavity and contacting a top surface of the housing.

This accelerometer (100) includes a substrate (30) and a bonding member (90) that bonds the substrate (30) and a supporting member (50) to each other, and the bonding member (90) is arranged in a region (R3) that straddles a first region (R1) in which a first sensor element (11) is arranged and a second region (R2) in which a second sensor element (12) is arranged in a plan view.

This accelerometer (100) includes a substrate (30) and a bonding member (90) that bonds the substrate (30) and a supporting member (50) to each other, and the bonding member (90) is arranged in a region (R3) that straddles a first region (R1) in which a first sensor element (11) is arranged and a second region (R2) in which a second sensor element (12) is arranged in a plan view.

Implementations of an accelerometer component may include: a first Z proof mass rotatable about a first axis and coupled to an anchor, the first Z proof mass including a first plurality of electrodes. Implementations may include a second Z proof mass rotatable about the first axis and coupled to the anchor, the second Z proof mass including a second plurality of electrodes. An X-axis accelerometer subcomponent may be located within a perimeter of the first Z proof mass, and a Y-axis accelerometer subcomponent may be located within a perimeter of the second Z proof mass. The first plurality of electrodes and the second plurality of electrodes may be symmetrical about each of the first axis, a second axis perpendicular to the first axis, a third axis diagonal to the first axis and second axis, and a fourth axis diagonal to the first axis and second axis.