G01R1/0408

Method for testing solder balls between two substrates by using dummy solder balls
11269020 · 2022-03-08 · ·

A plurality of test pads are formed on a first substrate or a second substrate. A plurality of first solder joints are reserved on a first surface of the first substrate, and each of the first solder joints is coupled to at least a test pad or to another first solder joint through at least a first trace. A plurality of second solder joints are reserved on a second surface of the second substrate. Each of the second solder joints is coupled to at least a test pad or to another second solder joint through at least a second trace. A plurality of dummy solder balls are formed between the first solder joints and the second solder joints. Probes are coupled to the test pads to measure circuit characteristics between the test pads.

SPLIT THIN-FILM PROBE CARD AND ELASTIC MODULE THEREOF
20210325430 · 2021-10-21 ·

A split thin-film probe card and an elastic module thereof are provided. The elastic module includes an elastic cushion and a thin-film sheet. The elastic cushion has a plurality of partition slots so as to define a plurality of independent elastic segments. The thin-film sheet includes a carrier, a plurality of signal circuits disposed on the carrier, and a plurality of conductive protrusions that are respectively formed on the signal circuits. The carrier has a plurality of grooves so as to divide the carrier into a plurality of action segments respectively disposed on the independent elastic segments. The signal circuits are respectively disposed on the action segments. When any one of the conductive protrusions is pressed, only the corresponding independent elastic segment is deformed through the corresponding signal circuit and the corresponding action segment.

Systems and methods for detecting cells using engineered transduction particles

Accurate measurements of the presence or absence of a target cell in a sample are provided. For example, the sample can be mixed with a plurality of transduction particles capable of binding to the target cells, the transduction particles being engineered to include a nucleic acid molecule formulated to cause the target cells to produce a plurality of detectable reporter molecules once the particles bind to and deliver the nucleic acid molecules into the one or more target cells. A set of signal data points are received that are associated with a quantity of reporter molecules and the signal data points are analyzed to accurately detect target cells in the sample. Systems and methods are disclosed.

Horizontal probing fixture
11150293 · 2021-10-19 ·

A horizontal probing fixture includes two bridge modules each having two spaced-apart pedestals, and a bridge plate connecting the pedestals. A first sliding unit for carrying and sliding a probe device includes two first sliding blocks respectively mounted and slidable on the bridge plates of the bridge modules, a first slide plate having two opposite ends respectively connecting the first sliding blocks, and two locking modules respectively disposed on the first sliding blocks. Each first sliding block has a bottom end complementarily engaged to and slidable on the bridge plate of one of the bridge modules. The locking modules are operable to respectively lock or unlock the first sliding blocks relative to the bridge plates.

CONDUCTIVE PARTICLES AND TEST SOCKET HAVING THE SAME
20210319928 · 2021-10-14 · ·

Proposed is a conductive particle used for a testing socket electrically connecting a lead of a device to be tested and a pad of a test board by being arranged between the device to be tested and the test board, wherein the conductive particle has a predetermined depth d and has a length l that is greater than a width w, the conductive particle having a body part in a pillar shape, a first convex part having an upper surface, formed in a top of the body part, and a second convex part having a lower surface, formed in a bottom of the body part.

Camera module inspector of rotating type distributing load of processing test raw data

Disclosed is a camera module inspector of rotating type distributing a load of processing test raw data. In an exemplary embodiment, the camera module inspector of rotating type includes a rotary index table including a plurality of socket units, a plurality of testers arranged around the rotary index table, a plurality of test control processors connected to correspond to the plurality of socket units, respectively, to be fixed on the rotary index table, a network connection unit establishing network connections with respect to the plurality of test control processors, a redundancy check processor processing the test raw data faster than the test control processor, connected to the network connection unit and data controller test raw data requiring a great deal of processing time out of the test raw data generated in the plurality of test control processors to be transmitted to the redundancy check processor through the network connection unit.

LOW INSERTION FORCE CONNECTOR ASSEMBLY AND SEMICONDUCTOR COMPONENT TEST APPARATUS
20210311106 · 2021-10-07 · ·

A low insertion force connector assembly includes a first connector and a second connector which are detachably coupled to each other, wherein the first connector and the second connector are easily assembled to prevent contact failure and are firmly assembled to each other to improve dimensional stability, and it is easy to assemble and manufacture the connectors.

Device test pad probe card structure with individual probe manipulation capability

A test probe assembly for use in testing a semiconductor wafer includes a probe card, a plurality of test probes mounted to the probe card and one or more piezoelectric elements mounted to each test probe. The piezoelectric elements are configured to move respective probe ends of the individual test probes in at least one direction to facilitate realignment of the probe ends for semiconductor wafer testing.

Thin-film probe card and test module thereof

A thin-film probe card and a test module thereof are provided. The test module includes a carrying unit, a plurality of vertical probes fixed in position by the carrying unit, an elastic cushion disposed on the carrying unit, and a thin sheet. The thin sheet includes a carrier partially disposed on the elastic cushion, a plurality of signal circuits disposed on the carrier, and a plurality of electrically conductive protrusions that are respectively formed on the signal circuits. An end of the vertical probes is arranged at an inner side of the electrically conductive protrusions and is coplanar with free ends of the electrically conductive protrusions.

SUPERCONDUCTING TAPE TESTING DEVICE

Provided is a superconducting tape testing device, including lead contacts and a support plate. Each lead contact a conductive contact and a magnet; the magnet is provided with a through hole through which the conductive contact passes, the support plate comprises a plate and a magnetic conductive member; and the magnetic conductive member is fixed on the surface of the plate body.