The present disclosure relates to a coaxial lead structure and method for radiating a GIS partial discharge UHF signal outward. The structure includes a GIS cavity, a circular hole provided on the GIS cavity, a medium cylinder provided at the circular hole and sealing the circular hole, a thin cylindrical metal lead that extends into and is fixed to the medium cylinder, and a ground lead connected to the thin cylindrical metal lead. According to the present disclosure, a relatively strong signal may be obtained outside a coaxial lead structure, and detection of a partial discharge UHF signal at this position may increase the detection sensitivity by one time compared with the detection methods of built-in and external disc insulators.

The present invention relates to a test socket having a thin structure that can reduce durability degradation of a contact itself, have excellent electrical characteristics in processing high-speed signals, and can extend a service life thereof, and relates to spring contacts suitable thereto. The test socket according to the present invention includes: a plurality of spring contacts (100) each of which includes an upper contact pin (110) and a lower contact pin (120) that are assembled cross each other, and a spring (130) supporting the upper and lower contact pins (110 and 120); a main plate (1110) having a plurality of accommodating holes (1111) in which the respective spring contacts (100) are accommodated, with first openings (1113); and a film plate (1120) provided on a lower portion of the main plate (1110), and having second openings (1121).

A probe head for a testing apparatus integrated on a semiconductor wafer is disclosed having a first plurality of contact probes having a first transversal diameter, a second plurality of micro contact probes having a second transversal diameter, smaller than the first transversal diameter, and a flexible membrane having conductive tracks for connecting a first plurality contact probe with a corresponding second plurality micro contact probe. The second plurality contact probes are arranged between the testing apparatus and the flexible membrane, and the second plurality micro contact probes are arranged between the flexible membrane and a semiconductor wafer. The second plurality micro contact probes are configured to abut onto contact pads of a device under test integrated in the semiconductor wafer, with each first plurality contact probe being in contact with a corresponding second plurality micro contact probe through a conductive track of the flexible membrane to connect the device under test with the testing apparatus.

A high-frequency coaxial attenuator includes a first coaxial cable portion that includes a first center conductor having a first length, and a first insulator of the first length formed around the first center conductor, wherein the first center conductor and the first insulator form a first diameter. A second coaxial cable portion is separated from the first coaxial cable portion by a gap. The second coaxial cable portion includes a second center conductor having a second length, and a second insulator of the second length formed around the second center conductor. A semiconductor material is deposited in the gap between the first coaxial cable portion and the second coaxial cable portion. The semiconductor material may be configured to provide an impedance of 500Ω and provides 20 dB of attenuation, and a 10:1 voltage divider based on a 50Ω input impedance of test equipment.

Evaluation board (EVB) assemblies or stacks utilized in tuning electronic modules are disclosed, as are methods for tuning such modules. In embodiments, the module testing assembly includes an EVB and an EVB baseplate. The EVB includes, in turn, an EVB through-port extending from a first EVB side to a second, opposing EVB side; and a module mount region on the first EVB side and extending about a periphery of the EVB through-port. The module mount region is shaped and sized to accommodate installation of a sample electronic module provided in a partially-completed, pre-encapsulated state fabricated in accordance with a separate thermal path electronic module design. A baseplate through-port combines with the EVB through-port to form a tuning access tunnel providing physical access to circuit components of the sample electronic module through the EVB baseplate from the second EVB side when the sample electronic module is installed on the module mount region.

A probe is provided and is configured for placement against and for movement along a body of interest and is configured to control and minimize compressive forces induced by the probe on the body of interest. The probe includes a probe handle portion that includes an outer probe housing and a probe head portion that is movably disposed within the outer probe housing. The probe head portion has a first end that defines a contact surface for placement along the body of interest. The probe head portion further has an extension that protrudes outwardly therefrom a second end of the probe head portion that is opposite the first end. The probe has at least one constant force spring that is coupled to the outer probe housing and to the probe head portion and is configured to apply a force to the probe head portion in a distal direction for maintaining the probe in position against a surface of interest during examination thereof, while permitting axial movement of the probe head portion within the outer probe housing. The constant force spring comprises at least one rolled ribbon spring that is wound about at least one pulley that is coupled to the extension of the probe head portion and moves axially together with the probe head portion within and relative to the outer probe housing.

A probe is provided and is configured for placement against and for movement along a body of interest and is configured to control and minimize compressive forces induced by the probe on the body of interest. The probe includes a probe handle portion that includes an outer probe housing and a probe head portion that is movably disposed within the outer probe housing. The probe head portion has a first end that defines a contact surface for placement along the body of interest. The probe head portion further has an extension that protrudes outwardly therefrom a second end of the probe head portion that is opposite the first end. The probe has at least one constant force spring that is coupled to the outer probe housing and to the probe head portion and is configured to apply a force to the probe head portion in a distal direction for maintaining the probe in position against a surface of interest during examination thereof, while permitting axial movement of the probe head portion within the outer probe housing. The constant force spring comprises at least one rolled ribbon spring that is wound about at least one pulley that is coupled to the extension of the probe head portion and moves axially together with the probe head portion within and relative to the outer probe housing.

The present invention relates to a probe member for a pogo pin, a method of manufacturing the probe member, and a pogo pin including the probe member. An embodiment of the present invention provides a probe member including a first body portion and a second body portion that are stacked in a height direction based on the other end of a contact portion, wherein the probe member is used in a test socket in a state in which at least a portion of the probe member is inserted in a pipe having an internal space.

A True Wireless System (TWS)headphone is provided, which comprises a charging case and one or two earbuds. The earbuds may be attached into the charging case by a two pogo pin connector. The earbuds can detect the different status of the battery in the charging case via the two pogo pin connector and can auto power on or off accordingly when taken out or put into the charging case.

An inspection device comprising: a first elastomer defining a hole; and a plunger overlapping with the first elastomer, wherein a conductive film is formed over an inner wall of the hole, and the plunger is electrically connected to the conductive film.