A control system for a wireless power transfer (WPT) system includes current sampling modules, voltage sampling modules, a logic conversion circuit, and a controller area network (CAN) communication module that are all connected to a microprocessor module; the current sampling module is connected to the logic conversion circuit through a signal isolation circuit, the logic conversion circuit is connected to a pulse-width modulation (PWM) module, the PWM module is connected to an inverter circuit or a DC/DC converter, and the current sampling module and the voltage sampling module are connected to a primary side or a secondary side of the WPT system; transmitter coils on the primary side are spaced apart on the road, a receiver coil on the secondary side is disposed on a chassis of an electric vehicle, and the transmitter coil includes a double rectangular coil, a ferrite core surface, and a shielding aluminum plate.

A semiconductor device which comprises a substrate and a plurality of layers of semiconductor material. A primary region is provided which has a primary contact associated therewith. The device includes a secondary region which has first and second secondary contacts associated therewith. A conductive region is provided between the primary and secondary regions. An auxiliary contact is operably coupled to a current source and controls the flow of current through the semiconductor device dependent on temperature.

What is proposed is a current sensor comprising a current rail and comprising a magnetic field sensor, wherein the magnetic field sensor is configured to measure a magnetic field induced by a current flowing through the current rail, wherein a first insulation layer and a second insulation layer are arranged between the current rail and the magnetic field sensor, wherein an interface between the first insulation layer and the second insulation layer is free of a contact with the current rail and/or is free of a contact with the magnetic field sensor.

A sensor device includes a current conductor designed to carry a measurement current, and a magnetic field sensor chip having a sensor element, wherein the magnetic field sensor chip is designed to detect a magnetic field at the location of the sensor element. The sensor device furthermore includes an encapsulation material, wherein the magnetic field sensor chip is encapsulated by the encapsulation material, and a soft magnet secured to the encapsulation material and designed to concentrate the magnetic field at the location of the sensor element. The magnetic field sensor chip and the soft magnet are galvanically isolated from one another by the encapsulation material.

A current sensor includes a current transferring conductor to conduct current and four magnetic field sensors with the magnetic field sensors being divided into two pairs of magnetic field sensors. The two magnetic field sensors are arranged in a V-shaped manner on one face of the current transferring conductor. Two magnetic field sensors are arranged in a V-shaped manner on the other face of the current transferring conductor. Of the magnetic field sensors arranged in a V-shaped manner, the ones of each side running parallel to each other form one pair.

A current measuring system for measuring current from a conductor comprises a first and second circuit and a current measurer connected to a conductor connected to a first power source. The first circuit comprises an inverting operational amplifier, which generates a first threshold signal when current flows into the first power source. The second circuit comprises a biasing circuit and a non-inverting operational amplifier, which generates the first threshold signal at the second output when current flows out of the first power source.

A current sensor integrated circuit (IC) includes a unitary lead frame having at least one first lead having a terminal end, at least one second lead having a terminal end, and a paddle having a first surface and a second opposing surface. A semiconductor die is supported by the first surface of the paddle, wherein the at least one first lead is electrically coupled to the semiconductor die and the at least one second lead is electrically isolated from the semiconductor die. The current sensor IC further includes a first mold material configured to enclose the semiconductor die and the paddle and a second mold material configured to enclose at least a portion of the first mold material, wherein the terminal end of the at least one first lead and the terminal end of the at least one second lead are external to the second mold material.

A current sensor that is less affected by the residual magnetization is provided. A current sensor of the present invention has a magnetic circuit that is magnetized by electric current; a first magnetic field detecting element that is positioned where a magnetic field, when the electric current is present, is directed in a same direction as a magnetic field that is caused by residual magnetization of the magnetic circuit when the electric current is not present; and a second magnetic field detecting element that is positioned where a magnetic field, when the electric current is present, is directed opposite to a direction of a magnetic field that is caused by residual magnetization of the magnetic circuit when the electric current is not present.

A differential signal current sensor device (100) may include a conductor (102) for conducting electrical current in a current direction. The conductor (102) may include a first slot (120A) extending from a first perimeter edge (122), towards a central axis extending along a length of the conductor (102), and a second slot (120B) extending from a second perimeter edge (124), towards the central axis. The current sensor device (100) may further include a first current sensor (130) positioned within the first slot (120A) and a second current sensor (132) positioned within the second slot (120B).

An electrical assembly may include an electrically conductive first member, a magnetic second member, and/or a housing molded on the first member and the second member. A method of assembling an electrical assembly may include disposing the first member in contact with a first mold, disposing the second member in contact with the first mold, moving a second mold into contact with the first mold, and/or inserting a housing material (e.g., liquid plastic) into the first mold and the second mold to form the housing.