A sensing system is provided for contactless sensing of current. The system includes a conductor for generating a magnetic field as electric current flows through the conductor, the conductor having a predetermined width and comprising a hole with a predetermined hole width passing through the whole thickness of the conductor, and a magnetic sensor for measuring at least one component of the magnetic field generated by the conductor. The magnetic sensor overlaps the hole. The current sensing is done based on the measured magnetic field. The sensor is positioned at a predetermined distance over a top surface of the conductor. The width of the hole is at least 0.15 times the width of the conductor.

A current sensor device for measuring a current in a conductor comprising: current sensing means comprising a magnetic sensing element for contactlessly measuring the current; amplification means arranged to act in a first and second state, said amplification means in said first and second state being arranged for amplifying a first and second signal, respectively, from said current sensing means with an adjustable first gain and a second gain and a first and second bandwidth to yield a first and second amplified signal, respectively, wherein said first gain is higher than the second gain, wherein the first gain and the second gain are larger than 1; processing means for controlling at least said first gain, for detecting an event based on at least said second amplified signal and for producing a signal indicative of said event; an output terminal arranged for outputting a signal indicative of said current based on said first amplified signal; and an output terminal arranged for outputting said signal indicative of the event.

A current sensor includes: six or more bus bars; a core made of a magnetic material and having a base portion and seven or more arm portions which extend in a vertical direction from the base portion and are spaced apart from each other, and in which each of the bus bars is inserted into a gap formed between adjacent arm portions; and a main body configured to integrally hold the bus bars and the core in a state in which the bus bars and the core are insert-molded using polyphenylene sulfide (PPS) or polyphthalamide (PPA).

The following disclosure provides a power strip including: a busbar electrically connected to a power source; multiple electrical outlets allowing multiple power plugs to be inserted thereinto, respectively; distribution bars which are branched out from the busbar and respectively supply the electrical outlets with electric currents of the power source; and a plurality of electric current measurement units each configured to measure the electric current flowing through a corresponding one of the distribution bars.

An example welding-type system includes: processing circuitry; and a machine readable storage medium comprising a machine readable instruction, when executed by the processing circuitry, cause the processing circuitry to: control a first switch to disconnect a motor circuit from a motor power source, the motor circuit comprising a wire feed motor and a second switch; control the second switch to permit current to flow while the first switch disconnects the motor circuit from the motor power source during a test period; and in response to feedback indicative of a current through the motor circuit while the first switch is open and the second switch is closed, detecting a fault condition associated with the motor circuit.

A current sensing assembly includes a conductor having a first side, a second side opposite the first side, a third side, and a fourth side opposite the third side. The first side has a first notch formed therein and the second side has a second notch formed therein opposite the first notch. The current sensing assembly also includes a sensor assembly including a first magnetic sensor disposed in the first notch or proximate to the third side of the conductor between the first and second notches, and a second magnetic sensor disposed in the second notch or proximate to the fourth side of the conductor between the first and second notches.

A current leakage detector for detecting current leakage between a power source and a load including a first sensing coil and a second sensing coil positioned opposite the first sensing coil. The current leakage detector further includes a magnetic field sensor proximate the first sensing coil and the second sensing coil and the magnetic field sensor has a response range. The current leakage detector also includes a bias circuit configured to adjust the response range of the magnetic field sensor. A method for detecting current leakage includes providing a first sensing coil and a second sensing coil. The method continues with the steps of providing a magnetic field sensor in proximity to the first and second sensing coils and providing a bias circuit. The method continues with the step of utilizing the bias circuit to place the response of the magnetic field sensor within a preferred response range.

A circuit breaker includes an electromechanical switch, a current sensor, a voltage sensor, and a processor. The electromechanical switch is serially connected between a line input terminal and a load output terminal of the circuit breaker, and configured to be placed in a switched-closed state or a switched-open state. The current sensor is configured to sense a magnitude of current flowing in a path between the line input and load output terminals and generate a current sense signal. The voltage sensor is configured to sense a magnitude of voltage at a point on the path between the line input and load output terminals and generate a voltage sense signal. The processor is configured to receive and process the current sense signal and the voltage sense signal to determine operational status information of the circuit breaker and determine power usage information of a load connected to the load output terminal.

A semiconductor package includes a leadframe forming a plurality of leads with a die attach site, a semiconductor die including a set of die contacts mounted to the die attach site in a flip chip configuration with each die contact of the set of die contacts electrically connected to leadframe via one of a set of solder joints, a set of solder joint capsules covering each of the set of solder joints against the leadframe, a clip mounted to the leadframe over the semiconductor die with a clip solder joint. The solder joint capsules restrict flow of the solder joints of the semiconductor die contacts in the flip chip configuration such that the solder remains in place if remelted during later clip solder reflow.

Hall sensing signals are received in a spinning readout pattern of subsequent readout phases, wherein the pattern is cyclically repeated at a spinning frequency and a polarity of the Hall sensor signals is reversed in two non-adjacent readout phases of the readout pattern. A signal storage circuit includes signal storage capacitors. An accumulation circuit includes accumulation capacitors. A switch network is selectively actuated to couple the signal storage capacitors with the accumulation capacitors synchronously with phases in the spinning readout pattern in subsequent alternating first and second periods. The spinning output is stored with alternating opposite signs on the signal storage capacitors and the Hall sensing signals are stored in the signal storage capacitors and then accumulated on the accumulation capacitors with alternate signs in subsequent periods. The accumulated output signal is then demodulated with a demodulation frequency half the spinning frequency.