Various embodiments of the teachings herein include an apparatus for measuring a magnetic field of a conductor of an electric current. The apparatus may include three magnetic field sensors arranged on a circumference of a non-circular ellipse defined by parallel projection or orthogonal projection of a circle. Three first positions are arranged equidistantly on a circumference of the circle. The three first positions emerge from the parallel projection or the orthogonal projection onto at least three second positions on the ellipse. The three magnetic field sensors are arranged at the three second positions. The magnetic field is measured without using a flux concentrator.

A magnetic field detection apparatus includes a magnetoresistive effect element and a helical coil. The magnetoresistive effect element includes a magnetoresistive effect film extending in a first axis direction. The helical coil includes a parallel connection including first and second parts extending in a second axis direction inclined with respect to the first axis direction. The first and second parts are adjacent to each other in a third axis direction and coupled to each other in parallel. The helical coil is wound around the magnetoresistive effect element while extending along the third axis direction. The magnetoresistive effect film overlaps the first and second parts in a fourth axis direction orthogonal to the second and third axis directions. The helical coil is configured to be supplied with a current and thereby configured to generate an induction magnetic field to be applied to the magnetoresistive effect film in the third axis direction.

A current sensing system, comprising at least one magnetic tunnel junction device placed adjacent to a current carrying conductor electrically connected to a battery of a vehicle. The magnetic tunnel junction device is configured to measure a magnetic field around the conductor. A monitoring device is operatively connected to the magnetic tunnel junction device, wherein the monitoring device is configured to receive the magnetic field measurement and determine an estimate of the current flowing through the conductor.

A sensor device includes a current conductor designed to carry a measurement current, and a magnetic field sensor chip having a sensor element, wherein the magnetic field sensor chip is designed to detect a magnetic field at the location of the sensor element. The sensor device furthermore includes an encapsulation material, wherein the magnetic field sensor chip is encapsulated by the encapsulation material, and a soft magnet secured to the encapsulation material and designed to concentrate the magnetic field at the location of the sensor element. The magnetic field sensor chip and the soft magnet are galvanically isolated from one another by the encapsulation material.

A current sensor includes a current transferring conductor to conduct current and four magnetic field sensors with the magnetic field sensors being divided into two pairs of magnetic field sensors. The two magnetic field sensors are arranged in a V-shaped manner on one face of the current transferring conductor. Two magnetic field sensors are arranged in a V-shaped manner on the other face of the current transferring conductor. Of the magnetic field sensors arranged in a V-shaped manner, the ones of each side running parallel to each other form one pair.

To improve cooling capability, power conversion apparatus 1 that converts a direct current voltage into an alternating current voltage includes: first substrate 100 on which power conversion circuit 2 is mounted; second substrate 200 on which driving circuit 3 that drives power conversion circuit 2 is mounted; and shield plate 300 that is disposed between first substrate 100 and second substrate 200, and first substrate 100 is a metal substrate.

A current sensor integrated circuit (IC) includes a unitary lead frame having at least one first lead having a terminal end, at least one second lead having a terminal end, and a paddle having a first surface and a second opposing surface. A semiconductor die is supported by the first surface of the paddle, wherein the at least one first lead is electrically coupled to the semiconductor die and the at least one second lead is electrically isolated from the semiconductor die. The current sensor IC further includes a first mold material configured to enclose the semiconductor die and the paddle and a second mold material configured to enclose at least a portion of the first mold material, wherein the terminal end of the at least one first lead and the terminal end of the at least one second lead are external to the second mold material.

A current sensor that is less affected by the residual magnetization is provided. A current sensor of the present invention has a magnetic circuit that is magnetized by electric current; a first magnetic field detecting element that is positioned where a magnetic field, when the electric current is present, is directed in a same direction as a magnetic field that is caused by residual magnetization of the magnetic circuit when the electric current is not present; and a second magnetic field detecting element that is positioned where a magnetic field, when the electric current is present, is directed opposite to a direction of a magnetic field that is caused by residual magnetization of the magnetic circuit when the electric current is not present.

A packaged current sensor integrated circuit includes a primary conductor having an input portion and an output portion configured to carry a current to be measured by a magnetic sensing element supported by a semiconductor die adjacent to the primary conductor. Each of the input portion and output portion of the primary conductor is exposed from orthogonal sides of the package body. A fault signal may be provided to indicate an overcurrent condition in the integrated current sensor package. The primary current path may be made of a thick lead frame material to reduce the primary current path resistance.

A differential signal current sensor device (100) may include a conductor (102) for conducting electrical current in a current direction. The conductor (102) may include a first slot (120A) extending from a first perimeter edge (122), towards a central axis extending along a length of the conductor (102), and a second slot (120B) extending from a second perimeter edge (124), towards the central axis. The current sensor device (100) may further include a first current sensor (130) positioned within the first slot (120A) and a second current sensor (132) positioned within the second slot (120B).