An electrical assembly may include an electrically conductive first member, a magnetic second member, and/or a housing molded on the first member and the second member. A method of assembling an electrical assembly may include disposing the first member in contact with a first mold, disposing the second member in contact with the first mold, moving a second mold into contact with the first mold, and/or inserting a housing material (e.g., liquid plastic) into the first mold and the second mold to form the housing.

A power conversion device which is premised on converting electric power supplied from a power source with use of a magnetic component, includes: a plurality of bus bars configured to supply electric power to a load; current sensor elements which are respectively provided for the plurality of bus bars, and are configured to detect magnetic fluxes generated when electric currents flow through the plurality of bus bars; and a plate-like magnetic shield plate which is arranged on a straight line connecting the magnetic component and the current sensor element, and is configured to shield magnetic fluxes directed from the magnetic component to one or more current sensor elements.

A method can use a current sensor that can include a magnetic flux concentrator along with first and second magnetic field sensing elements disposed proximate to the magnetic flux concentrator, wherein the magnetic flux concentrator is operable to influence a direction of first and second magnetic fields at the first and second magnetic field sensing elements, respectively, the first and second magnetic fields resulting from an electrical current passing through a conductor, the first and second magnetic field sensing elements operable to generate first and second signals, respectively, in response to the first and second magnetic fields, respectively, wherein the current sensor can also include a differencing circuit operable to subtract the first and second signals to generate a difference signal related to the electrical current.

The present disclosure relates to a concept for checking at least one solder joint between a printed circuit board and a current sensor, including: measuring, by means of the current sensor, an electric current through the solder joint; measuring at least one temperature of the current sensor as a function of the electric current; and ascertaining a quality of the solder joint based on the temperature and the electric current.

The invention relates to a sensor device (200) having a sensor (210), having a circuit carrier, having conductor sections (230, 231, 233, 234) which serve for supplying electrical current to the sensor (210) and for detecting an output signal (U.sub.H) generated by the sensor (210) and by means of which the sensor (210) is connected to the circuit carrier, and having a supply and read-out device, wherein respective contact points (235, 236) of two of the conductor sections (230, 231) on the circuit carrier (220) are electrically connected by means of a capacitor (C.sub.1) such that the two conductor sections (230, 231), the capacitor (C.sub.1) and the sensor (210) form constituent parts of an electrical loop (L.sub.1), and to a current converter and to the use of such a sensor device (200).

A circuit for sensing a current comprises a substrate having a first and a second major surface, the second major surface being opposite to the first major surface. At least one magnetic field sensing element is arranged on the first major surface of the substrate and is suitable for sensing a magnetic field caused by a current flow in a current conductor coupled to the second major surface. The substrate also comprises at least one insulation layer, substantially buried between the first major surface and the second major surface of the substrate.

An apparatus for measuring a flow of current through at least one electrical conductor of an electrotechnical device which is disposed in a cooling channel, wherein a non-conductive cooling medium flows through the cooling channel during operation of the electrotechnical apparatus, the apparatus including a flux conductor which is disposed around the at least one electrical conductor, and an evaluation circuit which is coupled to the flux conductor and is configured to determine the flow of current through the at least one electrical conductor by evaluating an electrical parameter of the flux conductor, wherein at least a part of the flux conductor is disposed in the cooling channel.

A packaged current sensor integrated circuit includes a primary conductor having an input portion and an output portion configured to carry a current to be measured by a magnetic sensing element supported by a semiconductor die adjacent to the primary conductor. The primary current path contains a mechanical locking feature. The thickness of the molded body of the package is reduced to improve vibration immunity.

A current monitoring device for detecting an electrical current in a line includes a housing bottom part, a first current sensor, a housing top part, and a second current sensor. The housing bottom part has a first wall in which a first wall bead is formed and configured to partially enclose the line. The first current sensor is arranged in the housing bottom part and obtains a first current measured value by measuring a current strength of the electric current. The housing top part has a second wall in which a second wall bead is formed and configured to partially enclose the line. The second current sensor is in the housing top part and obtains a second current measured value by measuring the current strength of the electric current. The first and second wall beads align with one another to at least partially enclose the electrical line.

Examples relate to a current sensor and to a method for sensing a strength of an electric current using two groups of magnetic sensing probes. The current sensor includes a first group and a second group of magnetic sensing probes. The current sensor comprises sensor circuitry coupled to the first and the second group of magnetic sensing probes. The sensor circuitry is configured to determine a first differential magnetic field measurement of a magnetic field using probes of the first group of magnetic sensing probes. The sensor circuitry is configured to determine a second differential magnetic field measurement of the magnetic field using probes of the second group of magnetic sensing probes. The sensor circuitry is configured to determine a strength of the electric current based on a difference between the first differential magnetic field measurement and the second differential magnetic field measurement.