A controller of a robot includes: a voltage detecting portion that detects a power-source voltage input from a power source; and a determining portion that determines, on the basis of the power-source voltage detected by the voltage detecting portion, whether to perform power-outage processing that guarantees the operation, wherein the determining portion includes a first timer that starts a clock at a point in time when the detected power-source voltage becomes equal to or less than a first threshold voltage that guarantees the operation and makes a determination for performing the power-outage processing in the case in which the power-source voltage does not exceed the first threshold voltage before the time measured by the first timer achieves a prescribed time that is longer than one cycle of the power-source voltage.

A solar power system may comprise a back sheet that comprises an interconnect circuit coupling a plurality of cell tiles. A tiled solar cell, comprising a solar cell and encapsulating and glass layers, is inserted into the cell tiles of the back sheet. Each solar cell is individually addressable through the use of the interconnect circuit. Moreover, the interconnect circuit of the back sheet is programmable and allows for dynamic interconnect routing between solar cells.

The present disclosure relates to voltage sensing mechanisms. One example embodiment includes a voltage-measurement device. The voltage-measurement device includes a housing. The voltage-measurement device also includes an extendible gripper configured to be removably attached to a wire under test. Additionally, the voltage-measurement device includes at least one power supply. Further, the voltage-measurement device includes a power management chip electrically coupled to the at least one power supply and configured to manage a range of input voltages from the at least one power supply. The power management chip comprises a synchronous boost voltage regulator. Additionally, the voltage-management device has a microprocessor electrically coupled to the power management chip and the extendible gripper. The microprocessor is configured to receive electrical power from the power management chip. The microprocessor is also configured to receive an electrical signal from the extendible gripper indicative of a voltage associated with the wire under test.

A sensor and a sensing system includes a chain of sensors, wherein each sensor comprises an input control port, an output control port, a power interface and an output interface, and is configured such that, when the sensor is powered over the power interface, an enable signal at the input control port triggers the sensor for executing a sequence which comprises measuring a physical property, and subsequently transmitting an enable signal over the output control port. The output control port of an earlier sensor is connected with the input control port of a next sensor. A first sensor is configured for repeating the sequence with a predefined period.

An integrated circuit including a comparator having a first input to receive a reference voltage, a second input, and an output to provide an under-voltage indicator. Sense points are configured to provide a plurality of sense point voltages, each sense point providing a corresponding sense point voltage of the plurality of sense point voltages; and a minimum voltage tracking circuit configured to receive the plurality of sense point voltages and provide an output voltage which tracks whichever sense point voltage of the plurality of sense point voltages is currently a minimum sense point voltage. The comparator receives the output voltage at the second input and asserts the under-voltage indicator when the output voltage is below the reference voltage.

Methods and systems are disclosed to monitor a media device via a universal serial bus (“USB”) port. An example method includes obtaining a voltage output by a UBS port of the media device and determining if the voltage exceeds a threshold. If the voltage exceeds the threshold, the example method includes determining the media device is in an on state. If the voltage does not exceed the threshold, the example method includes determining the media device is in an off state.

A regulator system includes a multi-bit detector system and a multi-cell charge/discharge circuit. The multi-bit detector system includes a plurality of detectors. Each of the plurality of detectors has a predetermined threshold voltage. The multi-cell charge/discharge circuit includes a plurality of charge pumps. Each of the charge pumps is configured to generate a predetermined charge. Each of the charge pumps is associated with a predetermined threshold voltage of the detector circuit.

There is disclosed a method of monitoring the functionality of individual irradiation emitters within a UVC irradiation disinfecting device comprising: supplying a constant current supply to at least one irradiation emitter; sensing the voltage across the at least one irradiation emitter; sensing the current drawn by the at least one irradiation emitter; analysing the sensed voltage and the sensed current against predetermined values; and determining a failure state of the at least one irradiation emitter based on said analysis.

A charging and discharging system includes multiple battery packs and one or more voltage equalization modules. The multiple battery packs are connected in parallel. Each of a subset of the battery packs is connected in series with a voltage equalization module of the one or more voltage equalization modules. The voltage equalization module is configured to adjust, to a target voltage, an output voltage of the corresponding battery pack and the voltage equalization module that are connected in series.

A semiconductor system, a semiconductor device, a through-silicon via (TSV) test method, and a method of manufacturing a semiconductor device are provided. The semiconductor system includes a semiconductor device including a buffer die and first to L-th (where L is an integer greater than or equal to 2) stack dies stacked on the buffer die and communicating with the buffer die through N (where N is a positive integer) TSVs; and a TSV test device that measures each of voltages at one end and voltages at another end on the N TSVs according to a clock signal, compares each of the voltages at the one end and the voltages at the other end with a reference voltage, and determines whether each of the N TSVs has a plurality of TSV defect types according to comparison results.