A test device includes a diode junction layer having a first dopant conductivity region and a second dopant conductivity region formed within the diode junction layer on opposite sides of a diode junction. A first portion of vertical transistors is formed over the first dopant conductivity region as a device under test, and a second portion of vertical transistors is formed over the second dopant conductivity region. A common source/drain region is formed over the first and second portions of vertical transistors. Current through the first portion of vertical transistors permits measurement of a resistance at a probe contact connected to the common source/drain region.

A fault protection arrangement. The fault protection arrangement may include a neutral grounding resistor including a first non-ground end, connected to a neutralizing point, and a second non-ground end. The fault protection arrangement may include a neutral grounding resistance monitor assembly, directly coupled to the second non-ground end of the neutral grounding resistor. The neutral grounding resistance monitor assembly may include comprising a signal source coupled to the neutralizing-point; a first current sense circuit coupled between the signal source and the neutralizing-point; a first voltage sense circuit coupled between the signal source and the neutralizing-point; a second current sense circuit, comprising a current sensor, coupled between the second non-ground end of the neutral grounding resistor and a protective earth connection.

The present disclosure relates to circuitry for detecting at least partial removal of an audio accessory plug from a corresponding socket. The circuitry comprises a monitoring unit comprising a first terminal configured to be electrically connected to a first socket contact of the socket that is in electrical contact with a first plug contact of the plug when the plug is fully received in the socket. The monitoring unit is configured to monitor a first impedance of a first signal path coupled to the first terminal, and the circuitry is configured to output a signal indicative of detection of at least partial removal of the plug from the socket in response to detection by the monitoring unit of a first predetermined sequence of impedance states of the first signal path.

A measurement module receives a defined system topology and system component characteristics information for a system. The measurement module calculates an expected system impedance for the defined system topology. The measurement module collects one or more impedance measurements using a high frequency voltage stimulus. Finally, the measurement module compares the one or more impedance measurements with the expected system impedance to determine adequacy of protective grounding of the system.

The evaluation jig comprises a pair of female terminals connectable to a pair of male terminals of a charging connector and an adjustment member capable of adjusting contact resistance of the female terminal and the male terminal. The female terminal is reducible in diameter. The adjustment member includes an annular band attached to an outer peripheral surface of the female terminal and formed in an annulus surrounding the female terminal, a metal band attached to an outer peripheral surface of the annular band and capable of applying external force to the female terminal to reduce the female terminal in diameter, and an adjustment unit capable of adjusting the external force applied by the metal band to the female terminal. The annular band is made of an electrically and thermally insulating material.

An evaluation jig comprises a female terminal connectable to a male terminal of a charging connector. The female terminal includes a plurality of contact pieces and a support portion. Each contact piece has a flexible piece, and a contact portion protruding toward the center axis from an inner surface of the flexible piece. The flexible piece forms a portion of a cylinder having the center axis. The flexible piece has a length equal to or larger than twice an outer diameter of the cylinder in a direction parallel to the center axis. The flexible piece is elastically deformable so that the flexible piece has a distal end portion to be displaceable in a radial direction of the cylinder relative to a proximal end portion of the flexible piece. The contact portion has a shape curved so as to protrude inward in the radial direction.

A test method and device for a contact resistor are provided, configured to test a contact resistor of a metal-oxide-semiconductor (MOS) transistor. The method includes: a resistance value per area and a temperature coefficient of resistance of the contact resistor are acquired; and a target resistance value of the contact resistor is determined according to the resistance value per area, the temperature coefficient of resistance, and an area of the contact resistor.

A probe card, a system for manufacturing a semiconductor device, and a method of manufacturing a semiconductor device are provided. A probe card includes a first probe configured to contact a first ground pad of a device under test, a reference resistor including a first terminal and a second terminal and connected to the first probe, and a second probe configured to contact a second ground pad of the device under test, wherein the second probe is further configured to be connected to a ground node for applying a reference potential, and the first terminal of the reference resistor is configured to be connected to the first probe and the second terminal of the reference resistor is configured to receive an input potential.

Provided are a method, apparatus and system for measuring a resistance parameter of a grounding system, and a monitoring network. The method comprises: inputting a driving current into a plurality of sections of a grounding system path (S602), wherein the grounding system path comprises at least a grounded apparatus, a grounding body, and a downlead connecting the grounded apparatus and the grounding body; measuring response voltages generated by the plurality of sections, and acquiring a response current flowing through the downlead (S604); and determining a resistance parameter of the grounding system path according to the driving current, the response voltages and the response current (S606).

A display device including a first substrate including a display area and a non-display area, a circuit film connected to the first substrate, a printed circuit board (PCB) connected to the circuit film, and a first inspection pad, a second inspection pad, and a third inspection pad located in the non-display area and a bridge configured to electrically connect the first inspection pad, the second inspection pad, and the third inspection pad. The circuit film includes a first line electrically connected to the first inspection pad, a second line electrically connected to the second inspection pad, a third line electrically connected to the third inspection pad, and a branch point configured to branch at least one line from the first line, the second line, and the third line into two sub-lines. The PCB includes a test pad unit connected to the first line, the second line, and the third line.