Systems and methods for measuring the integrity of insulation components in electrical systems. In preferred embodiments, an active sensor is coupled to a test tap of a bushing, the active sensor having an electrical circuit electrically coupled to the test tap, and wherein the electrical circuit includes a high pass filter that divides the electrical circuit into a high frequency bus and a power frequency bus. A grounded high frequency voltage is injected into the test tap via the frequency bus circuit. Resulting voltages and currents may be measured and compared to a reference voltage to determine capacitances and power factors for both the inner and outer sections of the bushing. Once the capacitances and power factors of the bushings are known, grounded and ungrounded high frequency voltages may be injected to determine capacitances and power factors of a connected transformer or reactor.

A method for determining a relative dielectric constant of a ground to be searched for mines using a detector including at least one detection coil and a ground penetrating radar including at least one transmitter antenna and at least one receiver antenna and a detection method for detecting metal and non-metal objects in a ground using a mine detector including a metal detector and a ground penetrating radar, wherein the metal detector includes at least one detection coil with a coil plane which is moved parallel to the ground during detecting, and wherein the ground penetrating radar includes an antenna arrangement including at least one transmitter antenna and at least one receiver antenna. The method according to the invention for determining a relative dielectric constant enables a user to calibrate the detector quickly and in a known manner with respect to ground properties of the ground to be searched.

A device for measuring a frequency response of a wafer is provided. The device includes a first oscillator, a clock generator, a first circuit, and a first driver. The first oscillator configured to provide a first signal having a first frequency. The clock generator is configured to receive the first signal and generate a first clock signal and a second clock signal having the first frequency. The first circuit on the wafer and having a first number of parallelly connected ring oscillators. The first driver is coupled to the first circuit and the clock generator, and configured to receive the first clock signal and the second clock signal, and drive the first circuit. A first portion of each ring oscillator of the first circuit is electrically disconnected from a second portion of each ring oscillator of the first circuit.

A circuit board inspecting apparatus is disclosed for inspecting a circuit board having wiring patterns separated from each other and forming a plurality of wiring pattern pairs. The apparatus includes a low-voltage inspection part to apply a first low-potential difference below a threshold voltage between wiring patterns in a first of the plurality of wiring pattern pairs, and to detect a first current flowing therebetween. A resistance measurement part is provided to measure a first resistance value between the wiring patterns of the first wiring pattern pair upon detection of the first current and a high-voltage inspection part is configured to selectively apply, based on the first resistance value, a high-potential difference above said threshold voltage, between the wiring patterns in a second of said plurality of wiring pattern pairs.

Methods and systems for rating a current substrate support assembly based on impedance circuit electron flow are provided. Data associated with an amount of radio frequency (RF) power flowed through an electrical component of a current substrate support assembly during a current testing process performed for the current substrate support assembly is provided as input to a trained machine learning model. One or more outputs of the trained machine learning model are obtained. A measurement value for an electron flow across an impedance circuit of the current substrate support assembly is extracted from the one or more outputs. In response to a determination that the extracted measurement value for the electron flow satisfies an electron flow criterion, a first quality rating is assigned to the current substrate support assembly.

The present invention relates to diagnostic device for the characterization of electromagnetic material properties and a method of making and using same. Unlike current diagnostic devices, the diagnostic device comprises a novel waveguide system and is suitable for the characterization of electromagnetic material properties such as permittivity, permeability, and the loss tangent of materials over a broad temperature and pressure range.

A film structure includes a first metal layer, a second metal layer, and an insulation layer located between the first metal layer and the second metal layer. In at least a portion of an edge region of the film structure, the first metal layer extends outwards relative to an edge of the insulation layer by a first predetermined length, and the insulation layer extends outwards relative to an edge of the second metal layer by a second predetermined length. In this way, when the film structure is measured, a fall value between the surface, adjacent to the second metal layer, of the insulation layer and the surface, adjacent to the insulation layer, of the first metal layer is measured by means of a motion trajectory of the measuring probe at the time of ascending or descending, thereby obtaining a more accurate thickness value of the insulation layer.

A measuring device for determining the dielectric value of a medium has at least the following components: a measuring sensor with at least one first electrically conductive electrode and a high-frequency unit which is designed to couple a high-frequency signal at least into the first electrode and determine the dielectric value of the medium using a corresponding reflection signal. The measuring device is characterized in that the first electrode is wound on a measuring rod which can be brought into contact with the medium. By winding the electrode, the measuring sensor can be advantageously configured to be significantly shorter without limiting the sensitivity of the measuring device. In this manner, the measuring device can also be used in the event of constricted installation conditions.

The present invention provides a system and apparatus for inspecting tendons and cable stays in bridges and structures using multi-frequency excitation of an ECVT sensor.

Data associated with a power testing process performed for a substrate support assembly is provided as input to a trained machine learning model. A measurement value for an electron flow across one or more components of the substrate support assembly in accordance with the power testing process is obtained based on one or more outputs of the trained machine learning model. A first quality rating or a second quality rating is assigned to the substrate support assembly based on whether the measurement value satisfies an electron flow criterion, wherein the first quality rating indicates a higher quality than the second quality rating. An indication of whether the substrate support assembly is to be installed at a processing chamber in view of the assigned second quality rating is transmitted to a client device.