Patent classifications
G01R31/2803
SCAN SYSTEM INTERFACE (SSI) MODULE
A method for testing. The method includes sending a single instruction over a JTAG interface to a JTAG controller to select a first internal test data register of a plurality of data registers. The method includes programming the first internal test data register using the JTAG interface to configure mode control access and state control access for a test controller implementing a sequential scan architecture to test a chip at a system level.
DYNAMIC INDEPENDENT TEST PARTITION CLOCK
In one embodiment, a test system comprises: a plurality of test partitions and a centralized controller configured to coordinate testing between the plurality of test partitions. At least one of the plurality of test partitions comprises: a partition test interface controller configured to control testing within at least one test partition in accordance with dynamic selection of a test mode, and at least one test chain configured to perform test operations. The dynamic selection of the test mode and control of testing within a test partition can be independent of selection of a test mode and control in others of the plurality of test partitions. In one embodiment, a free running clock signal is coupled to a test partition, and the partition test mode controller transforms the free running clock signal into a local partition test clock which is controlled in accordance with the dynamic selection of the test mode.
INDEPENDENT TEST PARTITION CLOCK COORDINATION ACROSS MULTIPLE TEST PARTITIONS
Granular dynamic test systems and methods facilitate efficient and effective timing of test operations. In one embodiment, a chip test system comprises: a first test partition operable to perform test operations based upon a first local test clock signal; a second test partition operable to perform test operations based upon a second local test clock signal; and a centralized controller configured to coordinate testing between the plurality of test partitions, wherein the coordination includes managing communication of test information between the plurality of test partitions and external pins. In one exemplary implementation, a trigger edge of the first local test clock signal is staggered with respect to a trigger edge of the second local test clock signal, wherein the stagger is coordinated to mitigate power consumption by test operations in the first test partition and test operations in the second test partition.
GRANULAR DYNAMIC TEST SYSTEMS AND METHODS
In one embodiments, a system comprises: a plurality of scan test chains configured to perform test operations at a first clock speed; a central test controller for controlling testing by the scan test chains; and an interface configured to generate instructions to direct central test controller. The interface communicates with the centralized test controller at the first clock speed and an external scan input at a second clock speed. The second clock speed can be faster than the first clock speed. The instructions communicated to the central controller can be directions associated with sequential scan compression/decompression operations. In one exemplary implementation, the interface further comprise a mode state machine used to generate the mode control instructions and a test register state machine that generate test state control instructions, wherein the test mode control instructions and the test state control instructions direct operations of the centralized test controller.
Circuit board testing system
A circuit board testing system includes a testing fixture and a computer system. The testing fixture includes a contact element, a switching circuit, and a data acquisition unit. The contact element is connected with a circuit board. The switching circuit is connected with the contact element. By enabling the switching circuit, the data acquisition unit acquires a real voltage value corresponding to the electronic component. The computer system is connected with the testing fixture for converting the real voltage value into a real resistance value corresponding to the electronic component. According to the real resistance value, the computer system judges whether the electronic component passes the test.
System and related methods, apparatuses, and computer program products for testing components of an aerosol delivery device
The present disclosure relates to a system and related methods, apparatuses, and computer program products for testing components of an aerosol delivery device. For example, a system for testing a control board for an aerosol delivery device may include a control board for an aerosol delivery device and a test apparatus. The test apparatus may provide a test initiation signal to the control board. The control board may execute an onboard diagnostic test to test operation of the control board in response to the test initiation signal. The control board may provide diagnostic information generated based on execution of the onboard diagnostic test to the test apparatus. The test apparatus may determine, based on the diagnostic information, whether the control board is faulty.
Integrated circuit profiling and anomaly detection
A computerized method for IC classification, outlier detection and/or anomaly detection comprising using at least one hardware processor for testing each of the plurality of ICs in accordance with an IC design on a wafer, wherein the IC design comprises a plurality of sensors. The at least one hardware processor is used for testing each of the plurality of ICs by: collecting a plurality of sensor values, the plurality of sensor values including sensor values from each of the plurality of sensors; comparing the plurality of sensor values to a classification scheme, thereby obtaining a classification for each tested IC; and recording the classification of the tested IC.
Semiconductor test device and system and test method using the same
A test method for a semiconductor device includes determining a contact failure between a first semiconductor chip and a second semiconductor chip during assembly of a semiconductor package including the first semiconductor chip and the second semiconductor chip, using a test circuit embedded in the first semiconductor chip, and after the assembly of the semiconductor package, determining whether the semiconductor package is defective by using the test circuit.
METHOD FOR EVALUATING AN ELECTRONIC COMPONENT FAULTINESS
A method, implemented by a computer, for evaluating an electronic component on an electronic board. The method includes: measuring an evolution over time of a physical value of the component with a test machine, to obtain a first time series; defining a second time series corresponding to an evolution over time of the physical value of the component without defects; and calculating an error expressing the differences between both time series.
Process Corner Simulation System Capable of Processing a Duty Cycle and Speed-based Process Corner Simulations
A process corner simulation system includes a frequency generator, a transistor sensitive circuit, and a process corner simulator. The frequency generator is used to generate a frequency signal. The transistor sensitive circuit is coupled to the frequency generator for receiving the frequency signal. The process corner simulator is coupled to the transistor sensitive circuit for receiving at least one output signal generated from the transistor sensitive circuit. The at least one output signal outputted from the transistor sensitive circuit includes speed information and duty cycle information. The process corner simulator uses a plurality of process corner models for generating a plurality of simulation results corresponding to different process corners according to the at least one output signal.