A probe card including a multi-layered substrate, a plurality of needles, and a temperature controlling unit may be provided. The multi-layered substrate may include a test pattern through which a test current passes. The needles may be provided on the multi-layered substrate. The needles may be electrically connected to the test pattern and may be configured to contact an object so that the test current may be supplied to the object. The temperature controlling unit may provide the multi-layered substrate with at least one of a first temperature and a second temperature, the first temperature being higher than the second temperature. Thus, a time for setting a test temperature may be shortened. As a result, thermal deformation of the probe card and/or the object may be reduced or suppressed, and thus reliability of test result may be improved.

An insulation test apparatus and method for a circuit board having a plurality of wiring patterns formed thereon includes: selection means for selecting wiring patterns to be tested, power supply means for sending a predetermined electrical output between a first object to be measured and a target object to be measured; measurement means for measuring an electrical signal between the first object to be measured and the target object to be measured; and calculation means for calculating the resistance of an insulation failure portion between the first object to be measured and the target object to be measured.

An insulation inspection technique for allowing the occurrence of sparks to be detected more satisfactorily and allowing a board in which sparks have occurred to be more satisfactorily detected as being detective is provided. An insulation inspection apparatus detects a voltage induced between insulation inspection target wiring patterns by the application of a voltage during a time period from the start of the voltage application between the insulation inspection target wiring patterns to a predetermined time when the voltage between the insulation inspection target wiring patterns has stabilized. When a voltage drop due to sparks occurring between the insulation inspection target wiring patterns is detected during the time period, the board to be inspected is determined to be defective. In particular, supply current during the time period is set in accordance with the number of inspection points of an upstream wiring pattern of the insulation inspection target wiring patterns.

A flexible circuit board and a cutting device are provided. The flexible circuit board includes a board body including a cutting region. A plurality rows of testing terminals are located in the cutting region, a first spacing being provided between two adjacent rows of testing terminals. The testing terminals can be respectively cut off from the board body along a cutting direction which is along the extending direction of the first spacing in the board body. A testing circuit is located on a surface of the board body. The testing circuit is arranged in a region outside the cutting region and the testing circuit is independently and electrically connected to each row of the testing terminals.

A method for detecting failed back-drills in PCBs in the process of fabricating a PCB so that the failed back-drill can be screened out or repaired. A short to ground connection is added for every back-drill via that will be cut when the back-drill removes the via stub. If the back-drill is bad or failed the short to ground will fail the subsequent electrical tests. The PCB can be repaired by re-drilling the hole or via. Failed back-drills may be detected in the manufacturing stage using standard equipment and test procedures. This process creates a simple pass-fail measurement that uses an existing common test process to catch failed back drills in the PCB fabrication facility. This allows for easy and cost-effective repair and guarantees back-drill failures do not pass into the field.

An inspection apparatus for inspecting an inspection object. The inspection object includes a base body and wiring passing through the base body. The inspection apparatus includes an insulating substrate, a first electrode in the substrate with a portion of the first electrode exposed from a surface of the substrate to form a connection portion which may be electrically connected with the wiring, and a second electrode in the substrate. The first electrode and the second electrode are spaced apart, have mutually parallel portions, and are electrically insulated from each other.

An inspection system and an inspection method of a bare circuit board are provided. The inspection system is used for inspecting a bare circuit board. The bare circuit board includes a chip pad and an antenna. The inspection system includes an adapter board, a test device and a measure device. The adapter board includes a chip and a contact structure. The chip is electrically connected to the contact structure. The contact structure touches the chip pad so that the chip is electrically connected to the chip pad. The test device includes a transceiver antenna. The test device and the bare circuit board separate. The measure device is electrically connected to the chip or the transceiver antenna.

An electronic load testing system is configured to emulate aspects of an integrated circuit (IC). A control module of the system is configured to be electrically coupled to a first location on a printed circuit board (PCB) of an electronic assembly, and a load module is configured to be electrically coupled to a second location on the PCB. The load module includes a load cell configured to selectively conduct current from a power supply of the electronic assembly. The first location and the second location are spaced apart and in electronic communication via one or more traces of the PCB. The control module is configured to communicate with the load module via the one or more traces of the PCB. In some examples, the load module and the IC have an equivalent form factor, such that the load module can be installed in place of the IC.