The present disclosure provides a test probe and an apparatus for testing a printed circuit board, wherein the test probe comprises a test pin; and an insulating protection sleeve with adhesive attached therein, wherein the insulating protection sleeve is sleeved on the test pin, and wherein a first end of the test pin protrudes from the insulating protection sleeve.

A measuring system and method is configured to analyze numerous different types of interconnects having varying degrees of complexity. The measuring system and method characterizes an interconnect to be tested by a predefined reflection coefficient signature. Each specific interconnect is predefined by a reflection coefficient signature that is unique to that specific interconnect. Once the reflection coefficient signature is defined, a corresponding reflection envelope is defined which defines boundary limits about the reflection coefficient signature. Subsequent testing of the specific interconnect results in a measured reflection coefficient curve, which is compared to the corresponding reflection envelope. The specific interconnect under test is considered acceptable if the values of the measured reflection coefficient curve do not fall outside the reflection envelope. If one or more values of the measured reflection coefficient curve fall outside the reflection envelope, then the specific interconnect under test fails the test.

A test system for measuring beam characteristics of a device under test (DUT), comprising a first antenna for receiving electro-magnetic radiation emitted by the device under test or for establishing a first test communication link to exchange test communication data with the DUT. The system further comprises a switch for setting the mode of the first antenna to a measuring or communication mode, and a test interface for inputting beam steering and/or communication data to the DUT. The system further comprises a control/analyzing processor for controlling beam steering of the DUT and to analyze signals from the DUT, e.g., received by the first antenna operated in the measuring mode. When the first antenna is set to the communication mode, test communication data is transmitted to the DUT through the first antenna. The test communication data comprises beam steering control data for controlling the beam steering of the DUT.

An inspecting device of a display panel includes a contact including first probe pins that contact to data pads of a display panel and second probe pins that contact to common voltage pads of the display panel, a signal generator coupled to the first probe pins, the signal generator configured to generate a first data voltage corresponding to a first gray level and a second data voltage corresponding to a second gray level, a power generator coupled to the second probe pins, the power generator configured to generate a first common voltage and a second common voltage of which a voltage level is different from a voltage level of the second common voltage, and a defect detector configured to detect a defect of the display panel by removing a contact noise generated due to contact failure of the first probe pins and the second probe pins.

An inspection device with improved inspection accuracy of electrical characteristics of a component, including a holding table, a pair of measuring elements configured to grip a component held on the holding table 32 and measure electrical characteristics of the component; and a relative movement device configured to relatively move the holding table and the pair of measuring elements. In a state in which component is clamped by the pair of measuring elements, by moving holding table, component and the holding table are separated by at least a set value, and in that state the electrical characteristics are measured. Therefore, even if the holding table is made of a conductive material, effects on the component are reduced, and the electrical characteristics can be measured accurately.

Systems and methods for testing printed circuit boards (PCBs) are disclosed herein. In one embodiment, a tester for printed circuit boards (PCBs) includes a test fixture having a plurality of electrical contacts for contacting the PCBs that are units under test (UUTs). The test fixture carries a remote test peripheral master (RTPM) module, and a remote test peripheral slave (RTPS) module. The RTPM module and the RTPS module are connected through a remote test peripheral (RTP) bus.

In one embodiments, a system comprises: a plurality of scan test chains configured to perform test operations at a first clock speed; a central test controller for controlling testing by the scan test chains; and an interface configured to generate instructions to direct central test controller. The interface communicates with the centralized test controller at the first clock speed and an external scan input at a second clock speed. The second clock speed can be faster than the first clock speed. The instructions communicated to the central controller can be directions associated with sequential scan compression/decompression operations. In one exemplary implementation, the interface further comprise a mode state machine used to generate the mode control instructions and a test register state machine that generate test state control instructions, wherein the test mode control instructions and the test state control instructions direct operations of the centralized test controller.

An inspection device is provided, which is capable of detecting a short circuit failure even when a connector is provided on a wiring board. The inspection device is configured to inspect a short circuit failure generated at any connected part of a plurality of pins 153 to a wiring board via solder. The plurality of pins 153 is included in a connector provided on the wiring board. The inspection device includes: a wiring 11 connected to certain pins 153 of the plurality of pins 153; a second wiring 12 connected to remaining pins 153 of the plurality of pins 153; and a tester unit connected to the first wiring 11 and to the second wiring 12 so as to inspect insulation between the certain pins 153 and the remaining pins 153.

An automatic power supply system is electrically coupled to a component to be tested. The automatic power supply system includes a power array and a controller. The power array includes a plurality of power channels, and provides power supplies through the plurality of power channels. The component to be tested is electrically coupled to a first power channel of the plurality of power channels and receives a power supply through the first power channel. The controller is electrically coupled to the power array, and calculates a power of the power supply received by the component to be tested. The controller adjusts a power specification of the power supply provided through the first power channel according to the power.

Disclosed herein is a method and apparatus for testing the response of electrical circuits to being flexed. Support members, preferably at least two, are positioned to receive the electrical circuits to be tested. The support members are spaced apart from each other to permit the electrical circuit to be flexed between the two support members. A plunger, having an arcuate front face is positioned between the support members. The plunger is depressed, flexing the electrical circuit a selected amount. After the circuit has been flexed a selected amount, the circuit is tested to determine whether or not it is fully operational after being flexed.