Circuits and methods for improving IC yield during automated test equipment (ATE) calibration of circuit designs which require I.sub.DD calibration and use a closed feedback bias circuit, such as amplifier circuits. The circuit designs include bias branch/active circuit architectures where the active circuit includes one or more active devices. An example first embodiment uses an on-chip calibration switch between the on-chip grounds of a bias network and an active circuit comprising an amplifier. During calibration of the active circuit by the ATE, the calibration switch is closed, and after completion of calibration, the calibration switch is opened. An example second embodiment utilizes an active on-chip feedback loop calibration circuit to equalize voltages between the on-chip grounds of a bias network and an active circuit comprising an amplifier during calibration of the active circuit. Both embodiments mitigate or overcome miscalibration of active circuit current settings resulting from ATE test probe resistance.

Disclosed is a test system including a transmitter, a receiver, a measuring circuit, and a control circuit. The transmitter is coupled to the receiver in a DC coupling manner, and includes: a signal input circuit determining an output signal according to an input signal; a current source coupled between the signal input circuit and a low power-supply terminal and configured to determine a total current passing through the signal input circuit in a non-open/short-circuited condition; and a signal output wire circuit outputting the output signal for a performance test. The receiver includes: an impedance circuit coupled to the signal output wire circuit; and a coupling circuit coupling the impedance circuit with a high power-supply terminal. The measuring circuit measures a target current/voltage between the high power-supply terminal and low power-supply terminal to generate a measurement result. The control circuit determines whether the transmitter/receiver is open/short-circuited according to the measurement result.

Embodiments of the present disclosure use a customizable ganged waveguide that comprises a top metal plate and a bottom metal plate with trenches that come together in a way so as to form waveguide channels. The waveguide assembly of the present invention also comprises a waveguide adapter affixed to a first end of the ganged waveguide and operable to conduct the signal to a tester. Further, it comprises an air barrier affixed to a second end of the ganged waveguide to prevent air from flowing from the ganged waveguide to a printed circuit board connected at the second end. Finally, it comprises a tuning plate comprising double ridge slots configured to allow maximal signal to be transferred to the printed circuit board from the ganged waveguide.

A waveguide interface is disclosed. The disclosed waveguide interface comprises: an inner boundary region extending peripherally around a cavity, a recessed region extending peripherally around the inner boundary region, and a plurality of protrusions extending from the recessed region.

Examples disclosed herein relate to a on-chip or built-in self-test (BIST) module for an RFIC including means to up-convert a signal from a test frequency to RF at an input to the RFIC and down-convert and output signal.

A frequency debugging board includes a bottom plate; a variable capacitor and a plurality of first probes that are all disposed on the bottom plate, two ends of the variable capacitor being each connected to a first probe; and a plurality of second probes and at least one switch that are all disposed on the bottom plate, any two adjacent second probes being connected to each other through a switch.

A portable test apparatus for testing an RF/microwave treatment system, the portable test apparatus comprising: a connector configured for connection to a generator or amplifier of the treatment system and/or to a distal end of a reusable transmission cable of the treatment system; a measurement device configured for measuring RF/microwave energy received through the connector; and a test controller configured to: run at least one test of a set of tests for testing the treatment system, at least some of the set of tests comprising using the measurement device to measure RF/microwave energy supplied by a generator or amplifier of the treatment system to a proximal end of the reusable transmission cable and transmitted through the reusable transmission cable to the connector; and analyse and/or record and/or output results of the set of tests.

An integrated circuit, IC, comprising one or more DC blocking modules connected to a respective input/output, IO, pin of the IC, each DC blocking module comprising: a capacitor having a first terminal connected to the respective IO pin and a second terminal connected to a node of the circuitry of the IC; and an electrostatic discharge, ESD, protection circuit connected in parallel to the capacitor, the ESD protection circuit comprising: a conduction path connected between the first terminal of the capacitor and the second terminal of the capacitor; and a control terminal configured to receive a control signal to switch the ESD protection circuit between: an operational mode in which the conduction path is in a non-conducting state and provides ESD protection to the capacitor; and a test mode in which the conduction path is in a conducting state and short circuits the capacitor.

Methods and systems for automated testing of extremely-high frequency devices are disclosed. A device under test (DUT) is set in a simultaneous transmit and receive mode. The DUT receives a lower frequency radio frequency (RF) signal from a test unit and up-converts the lower frequency RF signal to a higher frequency RF signal. The DUT transmits the higher frequency RF signal using a first antenna, and receives the higher frequency RF signal using a second antenna. The DUT down-converts the received higher frequency RF signal to a received test RF signal and provides the received test RF signal to the test unit for comparing measurements derived from the received test signal to a design specification for the DUT.

An apparatus is disclosed for making circuitry with passive fundamental components more robust. In example implementations, an apparatus includes at least one passive fundamental component and at least one redundant passive fundamental component. The apparatus also includes fault tolerant circuitry coupled to the at least one passive fundamental component and the at least one redundant passive fundamental component. The fault tolerant circuitry includes fault detection circuitry configured to detect a fault of the at least one passive fundamental component. The fault tolerant circuitry also includes component repair circuitry configured to disconnect the at least one passive fundamental component based on the fault.